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Class Information
Number: 228/41
Name: Metal fusion bonding > Including means to apply flux or filler to work or applicator > Solid flux or solid filler
Description: Device whose applying or supplying means is designed and intended to bring the flux or filler into engagement with the work or applicator which at least a portion of such flux or filler is in a form-sustaining state.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7407081 |
Methods and apparatus for transferring conductive pieces during semiconductor device fabrication |
Aug. 5, 2008 |
| 7404511 |
Laser trimming problem suppressing semiconductor device manufacturing apparatus and method |
Jul. 29, 2008 |
| 7392924 |
Automated ball mounting process and system with solder ball testing |
Jul. 1, 2008 |
| 7357295 |
Solder ball supplying method and supplying device |
Apr. 15, 2008 |
| 7337534 |
SMD chip handling apparatus |
Mar. 4, 2008 |
| 7275676 |
Apparatus for locating conductive spheres utilizing screen and hopper of solder balls |
Oct. 2, 2007 |
| 7240822 |
Ball mounting method |
Jul. 10, 2007 |
| 7121449 |
Method and device for applying material to a workpiece |
Oct. 17, 2006 |
| 7105432 |
Method of locating conductive spheres utilizing screen and hopper of solder balls |
Sep. 12, 2006 |
| 7100813 |
System and method for achieving planar alignment of a substrate during solder ball mounting for use in semiconductor fabrication |
Sep. 5, 2006 |
| 7077305 |
Ball loading apparatus |
Jul. 18, 2006 |
| 7070087 |
Method and apparatus for transferring solder bumps |
Jul. 4, 2006 |
| 7066377 |
Ball mounting method |
Jun. 27, 2006 |
| 7021517 |
Method and device for applying pieces of material to a workpiece |
Apr. 4, 2006 |
| 7014092 |
Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconduc |
Mar. 21, 2006 |
| 6988652 |
Solder printing using a stencil having a reverse-tapered aperture |
Jan. 24, 2006 |
| 6957760 |
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux |
Oct. 25, 2005 |
| 6955285 |
Apparatus for aligning and dispensing solder columns in an array |
Oct. 18, 2005 |
| 6926188 |
Transfer apparatus for arraying small conductive bumps on a substrate and/ or chip |
Aug. 9, 2005 |
| 6915940 |
Device for applying solder globules |
Jul. 12, 2005 |
| 6910613 |
Device and method for forming bump |
Jun. 28, 2005 |
| 6886733 |
Conductive powder applying device immersing substrate into conductive powder by rotating tank including conductive powder and substrate at opposing positions |
May. 3, 2005 |
| 6883698 |
Planting device for planting solder balls onto a chip |
Apr. 26, 2005 |
| 6866179 |
Detachable welding tab assembly |
Mar. 15, 2005 |
| 6830175 |
Solder ball dispenser |
Dec. 14, 2004 |
| 6805274 |
Solder ball attracting mask and its manufacturing method |
Oct. 19, 2004 |
| 6796480 |
Reliability of heat sink mounted laser diode bars |
Sep. 28, 2004 |
| 6769596 |
Method and system for reworking ball grid arrays |
Aug. 3, 2004 |
| 6766938 |
Apparatus and method of placing solder balls onto a substrate |
Jul. 27, 2004 |
| 6755339 |
Fluxing apparatus for applying powdered flux |
Jun. 29, 2004 |
| 6742694 |
Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus |
Jun. 1, 2004 |
| 6705505 |
Paste providing method, soldering method and apparatus and system therefor |
Mar. 16, 2004 |
| 6676890 |
Device for producing spherical balls |
Jan. 13, 2004 |
| 6641030 |
Method and apparatus for placing solder balls on a substrate |
Nov. 4, 2003 |
| 6637641 |
Systems and methods for manufacturing a circuit board |
Oct. 28, 2003 |
| 6610958 |
Apparatus and method for feeding filler wire in a welding operation |
Aug. 26, 2003 |
| 6609651 |
Method of soldering a leaded circuit component |
Aug. 26, 2003 |
| 6604673 |
Filling device and method for filling balls in the apertures of a ball-receiving element |
Aug. 12, 2003 |
| 6595408 |
Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement |
Jul. 22, 2003 |
| 6568580 |
Bump bonding apparatus and method |
May. 27, 2003 |
| 6550663 |
Desktop soldering dispenser with automatic metering and feeding of soldering wire |
Apr. 22, 2003 |
| 6547097 |
Dispensing apparatus and method |
Apr. 15, 2003 |
| 6543677 |
Solder-ball bonding device and method |
Apr. 8, 2003 |
| 6540129 |
Apparatus and method for manufacturing solder balls |
Apr. 1, 2003 |
| 6540127 |
Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas |
Apr. 1, 2003 |
| 6533159 |
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux |
Mar. 18, 2003 |
| 6533160 |
Device for providing balls or preforms for making flip-chip connections |
Mar. 18, 2003 |
| 6533163 |
Solder ball pitcher |
Mar. 18, 2003 |
| 6510977 |
Method and apparatus using laminated foils for placing conductive preforms |
Jan. 28, 2003 |
| 6494358 |
Bump bonding apparatus and method |
Dec. 17, 2002 |
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