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Class Information
Number: 228/33
Name: Metal fusion bonding > Including means to apply flux or filler to work or applicator
Description: Device having means effective to bring work or applicator (on the one hand), and flux or filler (on the other), into mutual engagement.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7607559 |
Conductive ball arraying apparatus |
Oct. 27, 2009 |
| 7546941 |
Ball attaching apparatus for correcting warpage of substrate and method of attaching solder balls using the same |
Jun. 16, 2009 |
| 7513410 |
Air bearing gap control for injection molded solder heads |
Apr. 7, 2009 |
| 7506792 |
Solder sphere placement apparatus |
Mar. 24, 2009 |
| 7405379 |
System for applying an isolation layer to a brazed end of a generator armature winding bar |
Jul. 29, 2008 |
| 7401637 |
Pressure-only molten metal valving apparatus and method |
Jul. 22, 2008 |
| 7389903 |
Device and method for soldering contacts on semiconductor chips |
Jun. 24, 2008 |
| 7380699 |
Method and apparatus for vapour phase soldering |
Jun. 3, 2008 |
| 7347349 |
Apparatus and method for printing micro metal structures |
Mar. 25, 2008 |
| 7168608 |
System and method for hermetic seal formation |
Jan. 30, 2007 |
| 7159752 |
Continuous mode solder jet apparatus |
Jan. 9, 2007 |
| 7100813 |
System and method for achieving planar alignment of a substrate during solder ball mounting for use in semiconductor fabrication |
Sep. 5, 2006 |
| 7070087 |
Method and apparatus for transferring solder bumps |
Jul. 4, 2006 |
| 7066378 |
Filling device |
Jun. 27, 2006 |
| 7048172 |
Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device |
May. 23, 2006 |
| 7040524 |
Automated packaging apparatus and method of optical elements |
May. 9, 2006 |
| 7040523 |
Method and apparatus for applying viscous or paste material onto a substrate |
May. 9, 2006 |
| 7028879 |
System for depositing connection sites on micro C-4 semiconductor die |
Apr. 18, 2006 |
| 6957759 |
Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device |
Oct. 25, 2005 |
| 6957760 |
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux |
Oct. 25, 2005 |
| 6926188 |
Transfer apparatus for arraying small conductive bumps on a substrate and/ or chip |
Aug. 9, 2005 |
| 6913182 |
Method and apparatus for controlled application of flux |
Jul. 5, 2005 |
| 6878396 |
Micro C-4 semiconductor die and method for depositing connection sites thereon |
Apr. 12, 2005 |
| 6854633 |
System with polymer masking flux for fabricating external contacts on semiconductor components |
Feb. 15, 2005 |
| 6832714 |
Heated filling device |
Dec. 21, 2004 |
| 6811074 |
Method and apparatus for dispensing solder on a substrate |
Nov. 2, 2004 |
| 6805274 |
Solder ball attracting mask and its manufacturing method |
Oct. 19, 2004 |
| 6789724 |
Welding apparatus and method |
Sep. 14, 2004 |
| 6772937 |
Method and apparatus for applying viscous material |
Aug. 10, 2004 |
| 6744003 |
Automatic soldering machine |
Jun. 1, 2004 |
| 6722553 |
Controlled and programmed deposition of flux on a flip-chip die by spraying |
Apr. 20, 2004 |
| 6708868 |
Method for producing weld points on a substrate and guide for implementing said method |
Mar. 23, 2004 |
| 6708871 |
Method for forming solder connections on a circuitized substrate |
Mar. 23, 2004 |
| 6708873 |
Apparatus and method for filling high aspect ratio via holes in electronic substrates |
Mar. 23, 2004 |
| 6698648 |
Method for producing solderable and functional surfaces on circuit carriers |
Mar. 2, 2004 |
| 6588645 |
Continuous mode solder jet apparatus |
Jul. 8, 2003 |
| 6576861 |
Method and apparatus for fine feature spray deposition |
Jun. 10, 2003 |
| 6572010 |
Integrated solder bump deposition apparatus and method |
Jun. 3, 2003 |
| 6550662 |
Chip rework solder tool |
Apr. 22, 2003 |
| 6543677 |
Solder-ball bonding device and method |
Apr. 8, 2003 |
| 6540129 |
Apparatus and method for manufacturing solder balls |
Apr. 1, 2003 |
| 6533163 |
Solder ball pitcher |
Mar. 18, 2003 |
| 6533159 |
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux |
Mar. 18, 2003 |
| 6527158 |
Method and apparatus for forming solder bumps |
Mar. 4, 2003 |
| 6520402 |
High-speed direct writing with metallic microspheres |
Feb. 18, 2003 |
| 6484923 |
Hand held flux and solder feeding tool |
Nov. 26, 2002 |
| 6464125 |
Rework and underfill nozzle for electronic components |
Oct. 15, 2002 |
| 6464130 |
Method of manufacturing piezoelectric actuator and method of joining lead wire to piezoelectric element of piezoelectric actuator |
Oct. 15, 2002 |
| 6464122 |
Soldering method and soldering apparatus |
Oct. 15, 2002 |
| 6457634 |
Soldering method and soldering apparatus |
Oct. 1, 2002 |
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