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Browse by Category: Main > Material Science
Class Information
Number: 228/264
Name: Metal fusion bonding > Process of disassembling bonded surfaces, per se (e.g., desoldering)
Description: Process for separation of meeting faces of work part(s) which faces were previously bonded together by used metallic filler or were previously metallurgically bonded directly together.










Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8627997 Universal radio frequency shield removal Jan. 14, 2014
8556154 Clamping tool and equipment for rework process Oct. 15, 2013
8477497 Cooling device for cooling electronic components Jul. 2, 2013
8434670 Repair apparatus and repair method May. 7, 2013
8413320 Method of gold removal from electronic components Apr. 9, 2013
8330076 Method and device for removing solder material deposits from a substrate Dec. 11, 2012
8167190 Electrically conductive polymer compositions containing metal particles and a graphene and methods for production and use thereof May. 1, 2012
8167189 Methods for rework of a solder May. 1, 2012
8132710 Deconstructable assembly and method Mar. 13, 2012
8113411 Universal radio frequency shield removal Feb. 14, 2012
8099862 Apparatus for detaching a head slider joined to a mounting plate of suspension Jan. 24, 2012
8070050 Heat conducting apparatus and solder melting method therefor Dec. 6, 2011
7963434 Micro component removing method Jun. 21, 2011
7950565 High speed ball shear machine May. 31, 2011
7886422 Ultrasonic reclaim method for disk drive suspensions Feb. 15, 2011
7836583 Integrated circuit dismounter Nov. 23, 2010
7829817 Device for removing solder material from a soldered joint Nov. 9, 2010
7806312 Method and apparatus for removing known good die Oct. 5, 2010
7753251 Micro component removing apparatus Jul. 13, 2010
7748594 Solder repairing apparatus and method of repairing solder Jul. 6, 2010
7703197 Process for depopulating a circuit board Apr. 27, 2010
7681778 Electronic assembly remanufacturing system and method Mar. 23, 2010
7621033 Method for reworking a microwave module Nov. 24, 2009
7575146 Selective rework apparatus for surface mount components Aug. 18, 2009
7481352 Method for ablating points of contact (debumping) Jan. 27, 2009
7472818 Selective rework process and apparatus for surface mount components Jan. 6, 2009
7441687 Desoldering sheath Oct. 28, 2008
7353983 Vertical removal of excess solder from a circuit substrate Apr. 8, 2008
7299965 Method and apparatus for mounting and removing an electronic component Nov. 27, 2007
7238919 Heating element movement bonding method for semiconductor components Jul. 3, 2007
7234218 Method for separating electronic component from organic board Jun. 26, 2007
7222772 Flip chip bonder May. 29, 2007
7168609 Method and apparatus for removing known good die Jan. 30, 2007
7100815 Diebond strip Sep. 5, 2006
7047635 Connecting material and connecting method May. 23, 2006
6908025 Preparing MCM hat for removal Jun. 21, 2005
6860419 Apparatus and method for controlling movement of a device after packaging Mar. 1, 2005
6811072 Known good die removal method and apparatus Nov. 2, 2004
6761304 Heating head for soldering and de-soldering of SMD components Jul. 13, 2004
6745932 Low strain chip removal apparatus Jun. 8, 2004
6719188 Rework methods for lead BGA/CGA Apr. 13, 2004
6705509 Method of recovering lead-free solder from printed circuit boards Mar. 16, 2004
6698649 Desolder apparatus Mar. 2, 2004
6655576 Process for disassembling a brazed structure Dec. 2, 2003
6651872 Method and apparatus for disassembling joined layers Nov. 25, 2003
6634092 Apparatus for replacing parts connected to circuit board Oct. 21, 2003
6629351 Apparatus and method for separating cull in a package assembly process Oct. 7, 2003
6572009 Passive and active heat retention device for solder fountain rework Jun. 3, 2003
6550669 Integral heating nozzle and pickup tube Apr. 22, 2003
6499644 Rework and underfill nozzle for electronic components Dec. 31, 2002

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