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Class Information
Number: 228/264
Name: Metal fusion bonding > Process of disassembling bonded surfaces, per se (e.g., desoldering)
Description: Process for separation of meeting faces of work part(s) which faces were previously bonded together by used metallic filler or were previously metallurgically bonded directly together.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7575146 |
Selective rework apparatus for surface mount components |
Aug. 18, 2009 |
| 7481352 |
Method for ablating points of contact (debumping) |
Jan. 27, 2009 |
| 7472818 |
Selective rework process and apparatus for surface mount components |
Jan. 6, 2009 |
| 7441687 |
Desoldering sheath |
Oct. 28, 2008 |
| 7353983 |
Vertical removal of excess solder from a circuit substrate |
Apr. 8, 2008 |
| 7299965 |
Method and apparatus for mounting and removing an electronic component |
Nov. 27, 2007 |
| 7238919 |
Heating element movement bonding method for semiconductor components |
Jul. 3, 2007 |
| 7234218 |
Method for separating electronic component from organic board |
Jun. 26, 2007 |
| 7222772 |
Flip chip bonder |
May. 29, 2007 |
| 7168609 |
Method and apparatus for removing known good die |
Jan. 30, 2007 |
| 7100815 |
Diebond strip |
Sep. 5, 2006 |
| 7047635 |
Connecting material and connecting method |
May. 23, 2006 |
| 6908025 |
Preparing MCM hat for removal |
Jun. 21, 2005 |
| 6860419 |
Apparatus and method for controlling movement of a device after packaging |
Mar. 1, 2005 |
| 6811072 |
Known good die removal method and apparatus |
Nov. 2, 2004 |
| 6761304 |
Heating head for soldering and de-soldering of SMD components |
Jul. 13, 2004 |
| 6745932 |
Low strain chip removal apparatus |
Jun. 8, 2004 |
| 6719188 |
Rework methods for lead BGA/CGA |
Apr. 13, 2004 |
| 6705509 |
Method of recovering lead-free solder from printed circuit boards |
Mar. 16, 2004 |
| 6698649 |
Desolder apparatus |
Mar. 2, 2004 |
| 6655576 |
Process for disassembling a brazed structure |
Dec. 2, 2003 |
| 6651872 |
Method and apparatus for disassembling joined layers |
Nov. 25, 2003 |
| 6634092 |
Apparatus for replacing parts connected to circuit board |
Oct. 21, 2003 |
| 6629351 |
Apparatus and method for separating cull in a package assembly process |
Oct. 7, 2003 |
| 6572009 |
Passive and active heat retention device for solder fountain rework |
Jun. 3, 2003 |
| 6550669 |
Integral heating nozzle and pickup tube |
Apr. 22, 2003 |
| 6499644 |
Rework and underfill nozzle for electronic components |
Dec. 31, 2002 |
| 6497357 |
Apparatus and method for removing interconnections |
Dec. 24, 2002 |
| 6471114 |
Multiple flame torch tip and method |
Oct. 29, 2002 |
| 6467671 |
Solder recovering method and solder recovering apparatus |
Oct. 22, 2002 |
| 6453537 |
Cooling method for electronic components |
Sep. 24, 2002 |
| 6435401 |
Apparatus and a method for removing solder from an object |
Aug. 20, 2002 |
| 6425515 |
Method and apparatus for micro BGA removal and reattach |
Jul. 30, 2002 |
| 6415975 |
Determination of quality of bonding between a conductive ball and a conductive pad within an IC package |
Jul. 9, 2002 |
| 6360938 |
Process and apparatus to remove closely spaced chips on a multi-chip module |
Mar. 26, 2002 |
| 6360940 |
Method and apparatus for removing known good die |
Mar. 26, 2002 |
| 6349871 |
Process for reworking circuit boards |
Feb. 26, 2002 |
| 6333491 |
Apparatus and method for non-destructive, low stress removal of soldered electronic components |
Dec. 25, 2001 |
| 6320163 |
Apparatus and method for non-destructive, low stress removal of soldered electronic components |
Nov. 20, 2001 |
| 6301436 |
Photothermic desoldering unit |
Oct. 9, 2001 |
| 6257478 |
Soldering/unsoldering arrangement |
Jul. 10, 2001 |
| 6247630 |
Apparatus and method for uniformly melting the solder attaching a surface mount device to a printed circuit board |
Jun. 19, 2001 |
| 6227434 |
Reworking of a ball grid array module |
May. 8, 2001 |
| 6216937 |
Process and apparatus to remove closely spaced chips on a multi-chip module |
Apr. 17, 2001 |
| 6216938 |
Machine and process for reworking circuit boards |
Apr. 17, 2001 |
| 6201930 |
Chip removal and replacement system |
Mar. 13, 2001 |
| 6182884 |
Method and apparatus for reworking ceramic ball grid array or ceramic column grid array on circuit cards |
Feb. 6, 2001 |
| 6163014 |
Apparatus and method for non-destructive, low stress removal of soldered electronic components |
Dec. 19, 2000 |
| 6131791 |
Soldering and desoldering device with improved pickup device |
Oct. 17, 2000 |
| 6127253 |
Lead-free interconnection for electronic devices |
Oct. 3, 2000 |
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