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Class Information
Number: 228/254
Name: Metal fusion bonding > Process > Preplacing solid filler > Joint interposed > Attaching filler to work part > Adherent solid layer or coating (e.g., pretinned)
Description: Process wherein filler is secured to a meeting face by metallurgical (fusion) bonding or by adhesive bonding.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7380698 |
Method of connecting module layers suitable for the production of microstructure modules and a microstructure module |
Jun. 3, 2008 |
| 7381016 |
Uncoated cutting tool using brazed-in superhard blank |
Jun. 3, 2008 |
| 7368035 |
Method for brazing and adhesive bonding |
May. 6, 2008 |
| 7360677 |
Spot joining method of metal members and spot joining apparatus of metal members |
Apr. 22, 2008 |
| 7357293 |
Soldering an electronics package to a motherboard |
Apr. 15, 2008 |
| 7331502 |
Method of manufacturing electronic part and electronic part obtained by the method |
Feb. 19, 2008 |
| 7328831 |
Method of making a brazed metal article and the article formed thereby |
Feb. 12, 2008 |
| 7311242 |
Design of an insulated cavity |
Dec. 25, 2007 |
| 7293689 |
Two tier brazing for joining copper tubes to manifolds |
Nov. 13, 2007 |
| 7168608 |
System and method for hermetic seal formation |
Jan. 30, 2007 |
| 7157150 |
Brazing titanium to stainless steel using layered particulate |
Jan. 2, 2007 |
| 7059512 |
Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semicon |
Jun. 13, 2006 |
| 7022415 |
Layered sphere braze material |
Apr. 4, 2006 |
| 6994243 |
Low temperature solder chip attach structure and process to produce a high temperature interconnection |
Feb. 7, 2006 |
| 6994245 |
Micro-reactor fabrication |
Feb. 7, 2006 |
| 6957762 |
Vacuum brazing method for aluminum-based material |
Oct. 25, 2005 |
| 6940168 |
Enhanced pad design for substrate |
Sep. 6, 2005 |
| 6921014 |
Method for forming a channel on the surface of a metal substrate |
Jul. 26, 2005 |
| 6902098 |
Solder pads and method of making a solder pad |
Jun. 7, 2005 |
| 6880244 |
Circuit board having simultaneously and unitarily formed wiring patterns and protrusions |
Apr. 19, 2005 |
| 6875332 |
Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied |
Apr. 5, 2005 |
| 6860420 |
Method of joining metal oilfield tubulars and well provided therewith |
Mar. 1, 2005 |
| 6849136 |
Filler metal for aluminum brazing sheet for heat exchangers and method of manufacturing same |
Feb. 1, 2005 |
| 6827251 |
Method for joining |
Dec. 7, 2004 |
| 6820798 |
Method for producing circuit arrangments |
Nov. 23, 2004 |
| 6818988 |
Method of making a circuitized substrate and the resultant circuitized substrate |
Nov. 16, 2004 |
| 6799711 |
Minute copper balls and a method for their manufacture |
Oct. 5, 2004 |
| 6793120 |
Apparatus and method for mounting an electrical connector to a glass sheet of a vehicle window |
Sep. 21, 2004 |
| 6786390 |
LED stack manufacturing method and its structure thereof |
Sep. 7, 2004 |
| 6763580 |
Method and apparatus for securing an electrically conductive interconnect through a metallic substrate |
Jul. 20, 2004 |
| 6757963 |
Method of joining components using a silver-based composition |
Jul. 6, 2004 |
| 6758387 |
Solder coated material and method for its manufacture |
Jul. 6, 2004 |
| 6745930 |
Method of attaching a body made of metal matrix composite (MMC) material or copper to a ceramic member |
Jun. 8, 2004 |
| 6729532 |
Component mounting method |
May. 4, 2004 |
| 6719185 |
Substrate with top-flattened solder bumps and method for manufacturing the same |
Apr. 13, 2004 |
| 6712261 |
Solid conductive element insertion apparatus |
Mar. 30, 2004 |
| 6708868 |
Method for producing weld points on a substrate and guide for implementing said method |
Mar. 23, 2004 |
| 6708869 |
Method for production of heat exchanger |
Mar. 23, 2004 |
| 6705512 |
Method of application of conductive cap-layer in flip-chip, cob, and micro metal bonding |
Mar. 16, 2004 |
| 6702176 |
Solder, method for processing surface of printed wiring board, and method for mounting electronic part |
Mar. 9, 2004 |
| 6704150 |
Bonder chuck and optical component mounting structure interface |
Mar. 9, 2004 |
| 6685080 |
Individual selective rework of defective BGA solder balls |
Feb. 3, 2004 |
| 6681484 |
Method for manufacturing electronic component |
Jan. 27, 2004 |
| 6637644 |
Method of manufacturing heat insulating structural and/or light elements and installation for carrying out the method |
Oct. 28, 2003 |
| 6637643 |
Method of applying a bond coating and a thermal barrier coating on a metal substrate, and related articles |
Oct. 28, 2003 |
| 6636313 |
Method of measuring photoresist and bump misalignment |
Oct. 21, 2003 |
| 6622773 |
Method and apparatus for forming solder balls |
Sep. 23, 2003 |
| 6609652 |
Ball bumping substrates, particuarly wafers |
Aug. 26, 2003 |
| 6610430 |
Method of attaching a device to a circuit board |
Aug. 26, 2003 |
| 6604499 |
Oil-through type push rod |
Aug. 12, 2003 |
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