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Class Information
Number: 228/246
Name: Metal fusion bonding > Process > Preplacing solid filler > Particular size or shape
Description: Process wherein the filler is a solid, preformed article shaped to fit prescribed work.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7614541 |
Method and apparatus for placing conductive balls |
Nov. 10, 2009 |
| 7607559 |
Conductive ball arraying apparatus |
Oct. 27, 2009 |
| 7600667 |
Method of assembling carbon nanotube reinforced solder caps |
Oct. 13, 2009 |
| 7600666 |
Repair with feedstock having conforming surfaces with a substrate |
Oct. 13, 2009 |
| 7597233 |
Apparatus and method of mounting conductive ball |
Oct. 6, 2009 |
| 7565996 |
Transient liquid phase bonding using sandwich interlayers |
Jul. 28, 2009 |
| 7559455 |
Diebond strip |
Jul. 14, 2009 |
| 7546941 |
Ball attaching apparatus for correcting warpage of substrate and method of attaching solder balls using the same |
Jun. 16, 2009 |
| 7527187 |
Titanium braze foil |
May. 5, 2009 |
| 7524698 |
Handling and positioning of metallic plated balls for socket application in ball grid array packages |
Apr. 28, 2009 |
| 7523852 |
Solder interconnect structure and method using injection molded solder |
Apr. 28, 2009 |
| 7516548 |
Method of manufacturing a fibre reinforced metal matrix composite article |
Apr. 14, 2009 |
| 7506792 |
Solder sphere placement apparatus |
Mar. 24, 2009 |
| 7506795 |
Method and apparatus for thermally coupling a heat dissipation device to a microelectronic device |
Mar. 24, 2009 |
| 7494913 |
Microball placement solutions |
Feb. 24, 2009 |
| 7475803 |
Solder ball loading method and solder ball loading unit background of the invention |
Jan. 13, 2009 |
| 7467468 |
Method for manufacturing an ink-jet head |
Dec. 23, 2008 |
| 7461772 |
Silver/aluminum/copper/titanium/nickel brazing alloys for brazing WC-Co to titanium alloys |
Dec. 9, 2008 |
| 7461770 |
Copper-based brazing alloy and brazing process |
Dec. 9, 2008 |
| 7458499 |
Apparatus and method for filling a ball grid array template |
Dec. 2, 2008 |
| 7455209 |
Filling device and method for filling balls in the apertures of a ball-receiving element |
Nov. 25, 2008 |
| 7451908 |
Furnace brazing process |
Nov. 18, 2008 |
| 7441688 |
Methods and device for controlling pressure in reactive multilayer joining and resulting product |
Oct. 28, 2008 |
| 7431792 |
Method and apparatus for placing conductive balls |
Oct. 7, 2008 |
| 7410088 |
Solder preform for low heat stress laser solder attachment |
Aug. 12, 2008 |
| 7392924 |
Automated ball mounting process and system with solder ball testing |
Jul. 1, 2008 |
| 7364063 |
Thermally coupling an integrated heat spreader to a heat sink base |
Apr. 29, 2008 |
| 7357295 |
Solder ball supplying method and supplying device |
Apr. 15, 2008 |
| 7357414 |
Closure for a gas supply system |
Apr. 15, 2008 |
| 7331498 |
Method for refining and homogeneously distributing alloying partners and for removing undesirable reaction products and slags in or from soft solder during the production of fine solder powder |
Feb. 19, 2008 |
| 7271497 |
Dual metal stud bumping for flip chip applications |
Sep. 18, 2007 |
| 7267260 |
Apparatus for holding a fiber array |
Sep. 11, 2007 |
| 7259335 |
Solder-bearing wafer for use in soldering operations |
Aug. 21, 2007 |
| 7243833 |
Electrically-isolated interconnects and seal rings in packages using a solder preform |
Jul. 17, 2007 |
| 7240822 |
Ball mounting method |
Jul. 10, 2007 |
| 7222775 |
Process for the metallization and/or brazing with a silicon alloy of parts made of an oxide ceramic unable to be wetted by the said alloy |
May. 29, 2007 |
| 7222776 |
Printed wiring board and manufacturing method therefor |
May. 29, 2007 |
| 7189083 |
Method of retaining a solder mass on an article |
Mar. 13, 2007 |
| 7185799 |
Method of creating solder bar connections on electronic packages |
Mar. 6, 2007 |
| 7143929 |
Ceramic circuit board and method for manufacturing the same |
Dec. 5, 2006 |
| 7127867 |
Metal snow guard |
Oct. 31, 2006 |
| 7121449 |
Method and device for applying material to a workpiece |
Oct. 17, 2006 |
| 7111771 |
Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same |
Sep. 26, 2006 |
| 7100813 |
System and method for achieving planar alignment of a substrate during solder ball mounting for use in semiconductor fabrication |
Sep. 5, 2006 |
| 7097090 |
Solder ball |
Aug. 29, 2006 |
| 7093746 |
Coated stencil with reduced surface tension |
Aug. 22, 2006 |
| 7077305 |
Ball loading apparatus |
Jul. 18, 2006 |
| 7073700 |
Process and apparatus for applying brazing material to a metallic structure through the use of vibration |
Jul. 11, 2006 |
| 7070088 |
Method of semiconductor device assembly including fatigue-resistant ternary solder alloy |
Jul. 4, 2006 |
| 7070087 |
Method and apparatus for transferring solder bumps |
Jul. 4, 2006 |
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