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Class Information
Number: 228/19
Name: Metal fusion bonding > With means to remove, compact, or shape applied flux or filler
Description: Device having means for exerting a force on, or transmitting energy to flux or filler material after said material has been applied to the work for the purpose of changing either the quantity, density or configuration of such material.


Sub-classes under this class:

Class Number Class Name Patents
228/20.1 By fluid blast or suction 107
228/22 Including wiper 19
228/21 With shield or guide for removed material 10


Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
7617962 Conductive ball mounting method, and apparatus therefor Nov. 17, 2009
7575146 Selective rework apparatus for surface mount components Aug. 18, 2009
7472818 Selective rework process and apparatus for surface mount components Jan. 6, 2009
7441687 Desoldering sheath Oct. 28, 2008
7325714 Solder heating system Feb. 5, 2008
7156278 Auxiliary soldering tool Jan. 2, 2007
7134590 Desoldering sheath Nov. 14, 2006
7048172 Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device May. 23, 2006
7033842 Electronic component mounting apparatus and electronic component mounting method Apr. 25, 2006
7014673 Filtering apparatus Mar. 21, 2006
6957759 Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device Oct. 25, 2005
6942137 Die removal method and apparatus Sep. 13, 2005
6811072 Known good die removal method and apparatus Nov. 2, 2004
6809286 Shielding gas filter for welding apparatus Oct. 26, 2004
6793125 Solder shaping process and apparatus Sep. 21, 2004
6732911 Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system May. 11, 2004
6722557 Flux cleaning method and method of manufacturing semiconductor device Apr. 20, 2004
6705509 Method of recovering lead-free solder from printed circuit boards Mar. 16, 2004
6676005 Wire bonding method and apparatus Jan. 13, 2004
6655576 Process for disassembling a brazed structure Dec. 2, 2003
6638363 Method of cleaning solder paste Oct. 28, 2003
6609675 Desoldering wick dispenser Aug. 26, 2003
6607113 Apparatus and method for removing a soldered device from a printed circuit board Aug. 19, 2003
6576030 Filtering apparatus Jun. 10, 2003
6568077 Blisk weld repair May. 27, 2003
6557796 Desoldering wick dispenser May. 6, 2003
6550669 Integral heating nozzle and pickup tube Apr. 22, 2003
6536649 Method of preventing residue contamination of semiconductor devices during furnace processing Mar. 25, 2003
6499644 Rework and underfill nozzle for electronic components Dec. 31, 2002
6464124 Electrically conductive elevation shaping tool Oct. 15, 2002
6446855 Compact reflow and cleaning apparatus Sep. 10, 2002
6382500 Solder reflow furnace with flux effluent collector and method of preventing flux contamination May. 7, 2002
6360934 Apparatus and method for removing a soldered device from a printed circuit board Mar. 26, 2002
6357648 Method and apparatus for removal of solder Mar. 19, 2002
6354481 Compact reflow and cleaning apparatus Mar. 12, 2002
6325270 Solder removing apparatus Dec. 4, 2001
6299048 Plant for friction stir welding Oct. 9, 2001
6276590 Conductive ball attaching apparatus and method Aug. 21, 2001
6257480 Jet soldering method and apparatus Jul. 10, 2001
6237831 Solder collecting capsule and solder extracting desoldering tool using same May. 29, 2001
6234373 Electrically conductive elevation shaping tool May. 22, 2001
6158646 Weld bead chopper Dec. 12, 2000
6129256 Reflow furnace for an electronic assembly Oct. 10, 2000
6119919 Method and device for repairing defective soldered joints Sep. 19, 2000
6062460 Apparatus for producing an electronic circuit May. 16, 2000
5988485 Flux cleaning for flip chip technology using environmentally friendly solvents Nov. 23, 1999
5979738 Machine for flash-butt welding of rails Nov. 9, 1999
5975409 Ceramic ball grid array using in-situ solder stretch Nov. 2, 1999
5964396 Enhanced ceramic ball grid array using in-situ solder stretch with clip Oct. 12, 1999
5961026 Apparatus and method for removing known good die using hot shear process Oct. 5, 1999

1 2 3


 
 
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