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Class Information
Number: 228/180.22
Name: Metal fusion bonding > Process > Plural joints > Of electrical device (e.g., semiconductor) > Simultaneous bonding of multiple joints (e.g., dip soldering of printed circuit boards) > Component terminal to substrate surface (i.e., nonpenetrating terminal) > Lead-less (or "bumped") device
Description: Process wherein the terminal extends above
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7621033 |
Method for reworking a microwave module |
Nov. 24, 2009 |
| 7617590 |
Method of manufacturing an embedded inductor |
Nov. 17, 2009 |
| 7611041 |
Semiconductor device, manufacturing method and apparatus for the same |
Nov. 3, 2009 |
| 7611040 |
Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition |
Nov. 3, 2009 |
| 7607216 |
Method for manufacturing monolithic ceramic electronic component |
Oct. 27, 2009 |
| 7603769 |
Method of coupling a surface mount device |
Oct. 20, 2009 |
| 7600667 |
Method of assembling carbon nanotube reinforced solder caps |
Oct. 13, 2009 |
| 7598613 |
Flip chip bonding structure |
Oct. 6, 2009 |
| 7597233 |
Apparatus and method of mounting conductive ball |
Oct. 6, 2009 |
| 7592244 |
Semiconductor device and method of manufacturing the same |
Sep. 22, 2009 |
| 7584533 |
Method of fabricating an inductor structure on an integrated circuit structure |
Sep. 8, 2009 |
| 7575150 |
Flux composition for solder, solder paste, and method of soldering |
Aug. 18, 2009 |
| 7569939 |
Self alignment features for an electronic assembly |
Aug. 4, 2009 |
| 7569164 |
Solder precoating method |
Aug. 4, 2009 |
| 7568610 |
Method of soldering electronic component having solder bumps to substrate |
Aug. 4, 2009 |
| 7546941 |
Ball attaching apparatus for correcting warpage of substrate and method of attaching solder balls using the same |
Jun. 16, 2009 |
| 7516879 |
Method of producing coaxial solder bump connections using injection molding of solder |
Apr. 14, 2009 |
| 7513032 |
Method of mounting an electronic part to a substrate |
Apr. 7, 2009 |
| 7506794 |
High-temperature alloy standoffs for injection molding of solder |
Mar. 24, 2009 |
| 7501337 |
Dual metal stud bumping for flip chip applications |
Mar. 10, 2009 |
| 7494041 |
In-situ alloyed solders, articles made thereby, and processes of making same |
Feb. 24, 2009 |
| 7490402 |
Technique for laminating multiple substrates |
Feb. 17, 2009 |
| 7476564 |
Flip-chip packaging process using copper pillar as bump structure |
Jan. 13, 2009 |
| 7475803 |
Solder ball loading method and solder ball loading unit background of the invention |
Jan. 13, 2009 |
| 7467468 |
Method for manufacturing an ink-jet head |
Dec. 23, 2008 |
| 7461771 |
Method of treating and probing a via |
Dec. 9, 2008 |
| 7455213 |
Apparatus for manufacturing semiconductor devices, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method |
Nov. 25, 2008 |
| 7445141 |
Solder interconnection array with optimal mechanical integrity |
Nov. 4, 2008 |
| 7427423 |
Components with conductive solder mask layers |
Sep. 23, 2008 |
| 7414417 |
Contact sheet for testing electronic parts, apparatus for testing electronic parts, method for testing electronic parts, method for manufacturing electronic parts and electronic parts |
Aug. 19, 2008 |
| 7412766 |
Method of fabricating coil-embedded inductor |
Aug. 19, 2008 |
| 7410091 |
Method of integrated circuit assembly |
Aug. 12, 2008 |
| 7378297 |
Methods of bonding two semiconductor devices |
May. 27, 2008 |
| 7367489 |
Method and apparatus for flip chip attachment by post collapse re-melt and re-solidification of bumps |
May. 6, 2008 |
| 7367486 |
System and method for forming solder joints |
May. 6, 2008 |
| 7358115 |
Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides |
Apr. 15, 2008 |
| 7357293 |
Soldering an electronics package to a motherboard |
Apr. 15, 2008 |
| 7356907 |
Method of manufacturing a carriage assembly of a hard disk drive |
Apr. 15, 2008 |
| 7353596 |
Component mounting method |
Apr. 8, 2008 |
| 7351610 |
Method of fabricating a semiconductor multi-package module having a second package substrate with an exposed metal layer wire bonded to a first package substrate |
Apr. 1, 2008 |
| 7351072 |
Memory module, memory extension memory module, memory module system, and method for manufacturing a memory module |
Apr. 1, 2008 |
| 7348678 |
Integrated circuit package to provide high-bandwidth communication among multiple dice |
Mar. 25, 2008 |
| 7344061 |
Multi-functional solder and articles made therewith, such as microelectronic components |
Mar. 18, 2008 |
| 7340829 |
Method for fabricating electrical connection structure of circuit board |
Mar. 11, 2008 |
| 7331502 |
Method of manufacturing electronic part and electronic part obtained by the method |
Feb. 19, 2008 |
| 7331500 |
Solder bumps formation using solder paste with shape retaining attribute |
Feb. 19, 2008 |
| 7328830 |
Structure and method for bonding to copper interconnect structures |
Feb. 12, 2008 |
| 7326859 |
Printed circuit boards having pads for solder balls and methods for the implementation thereof |
Feb. 5, 2008 |
| 7325716 |
Dense intermetallic compound layer |
Feb. 5, 2008 |
| 7322511 |
Apparatus and method for printing micro metal structures |
Jan. 29, 2008 |
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