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Class Information
Number: 228/180.1
Name: Metal fusion bonding > Process > Plural joints > Of electrical device (e.g., semiconductor) > Simultaneous bonding of multiple joints (e.g., dip soldering of printed circuit boards)
Description: Process wherein plural distinct meeting faces are caused to be secured at the same time.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7427423 |
Components with conductive solder mask layers |
Sep. 23, 2008 |
| 7410090 |
Conductive bonding material fill techniques |
Aug. 12, 2008 |
| 7357288 |
Component connecting apparatus |
Apr. 15, 2008 |
| 7345361 |
Stackable integrated circuit packaging |
Mar. 18, 2008 |
| 7311240 |
Electrical circuits with button plated contacts and assembly methods |
Dec. 25, 2007 |
| 7311241 |
Method of mounting terminal on printed board, terminal mounted printed board and electric connection box accommodating the terminal mounted printed board, which are formed by the method |
Dec. 25, 2007 |
| 7308129 |
Characteristic amount calculating device for soldering inspection |
Dec. 11, 2007 |
| 7263769 |
Multi-layered flexible print circuit board and manufacturing method thereof |
Sep. 4, 2007 |
| 7260890 |
Methods for fabricating three-dimensional all organic interconnect structures |
Aug. 28, 2007 |
| 7251880 |
Method and structure for identifying lead-free solder |
Aug. 7, 2007 |
| 7216794 |
Bond capillary design for ribbon wire bonding |
May. 15, 2007 |
| 7197819 |
Method of assembling an electric power |
Apr. 3, 2007 |
| 7094993 |
Apparatus and method for heating and cooling an article |
Aug. 22, 2006 |
| 7070084 |
Electrical circuit apparatus and methods for assembling same |
Jul. 4, 2006 |
| 7063249 |
Electrical circuit apparatus and method |
Jun. 20, 2006 |
| 7036217 |
Methods of manufacturing via intersect pad for electronic components |
May. 2, 2006 |
| 6995342 |
Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus |
Feb. 7, 2006 |
| 6929169 |
Solder joint structure and method for soldering electronic components |
Aug. 16, 2005 |
| 6928727 |
Apparatus and method for making electrical connectors |
Aug. 16, 2005 |
| 6927346 |
Surface mount technology to via-in-pad interconnections |
Aug. 9, 2005 |
| 6915945 |
Method for contact-connecting an electrical component to a substrate having a conductor structure |
Jul. 12, 2005 |
| 6915941 |
Method for local application of solder to preselected areas on a printed circuit board |
Jul. 12, 2005 |
| 6913183 |
Selective gas knife for wave soldering |
Jul. 5, 2005 |
| 6914326 |
Solder ball landpad design to improve laminate performance |
Jul. 5, 2005 |
| 6902097 |
Electrically conductive wire |
Jun. 7, 2005 |
| 6902102 |
Soldering method and solder joint member |
Jun. 7, 2005 |
| 6898847 |
Method for producing an electrical connection between a plug element and a printed circuit board |
May. 31, 2005 |
| 6896172 |
Lead-free solder paste for reflow soldering |
May. 24, 2005 |
| 6885613 |
Apparatus for monitoring a solder wave |
Apr. 26, 2005 |
| 6851598 |
Electronic component with a semiconductor chip and method for producing the electronic component |
Feb. 8, 2005 |
| 6845556 |
Techniques for reworking circuit boards with ni/au finish |
Jan. 25, 2005 |
| 6843862 |
Solders |
Jan. 18, 2005 |
| 6839961 |
Methods of bonding solder balls to bond pads on a substrate, and bonding frames |
Jan. 11, 2005 |
| 6834791 |
Solder-bearing components and method of retaining a solder mass therein |
Dec. 28, 2004 |
| 6827252 |
Bump manufacturing method |
Dec. 7, 2004 |
| 6817092 |
Method for assembling a circuit board apparatus with pin connectors |
Nov. 16, 2004 |
| 6817091 |
Electronic assembly having solder thermal interface between a die substrate and a heat spreader |
Nov. 16, 2004 |
| 6797926 |
Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus |
Sep. 28, 2004 |
| 6796481 |
Chip mounting method |
Sep. 28, 2004 |
| 6796485 |
Solder-bearing electromagnetic shield |
Sep. 28, 2004 |
| 6794616 |
Solder reflow oven |
Sep. 21, 2004 |
| 6792677 |
Method of manufacturing an electronic component unit |
Sep. 21, 2004 |
| 6779711 |
Self-aligned corrosion stop for copper C4 and wirebond |
Aug. 24, 2004 |
| 6779710 |
Mounting parts peel suppressing soldering method, electronic circuit baseboard, and electronic instrument |
Aug. 24, 2004 |
| 6777105 |
Part |
Aug. 17, 2004 |
| 6763580 |
Method and apparatus for securing an electrically conductive interconnect through a metallic substrate |
Jul. 20, 2004 |
| 6758387 |
Solder coated material and method for its manufacture |
Jul. 6, 2004 |
| 6752310 |
Electrically conductive wire |
Jun. 22, 2004 |
| 6732907 |
Soldering method, soldering device, and method and device of fabricating electronic circuit module |
May. 11, 2004 |
| 6729532 |
Component mounting method |
May. 4, 2004 |
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