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Class Information
Number: 216/84
Name: Etching a substrate: processes > Nongaseous phase etching of substrate > With measuring, testing, or inspecting
Description: Process including the step of visually, chemically, or physically determining or measuring a variable condition or property of the substrate or the etching process.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6638357 |
Method for revealing agglomerated intrinsic point defects in semiconductor crystals |
Oct. 28, 2003 |
| 6599759 |
Method for detecting end point in plasma etching by impedance change |
Jul. 29, 2003 |
| 6569690 |
Monitoring system for determining progress in a fabrication activity |
May. 27, 2003 |
| 6562254 |
Etching method |
May. 13, 2003 |
| 6559063 |
Method for manufacturing semiconductor wafer having resist mask with measurement marks for measuring the accuracy of overlay of a photomask |
May. 6, 2003 |
| 6555017 |
Surface contouring by controlled application of processing fluid using Marangoni effect |
Apr. 29, 2003 |
| 6551521 |
Automatic etchant regeneration system with highly accurate sensor for monitoring etchant composition |
Apr. 22, 2003 |
| 6521138 |
Method for measuring width of bottom under cut during etching process |
Feb. 18, 2003 |
| 6514858 |
Test structure for providing depth of polish feedback |
Feb. 4, 2003 |
| 6497238 |
Method of manufacturing electronic devices and apparatus for carrying out such a method |
Dec. 24, 2002 |
| 6495055 |
Variable time etching system according to the accumulated number of devices being processed and a method for etching in the same manner |
Dec. 17, 2002 |
| 6475400 |
Method for controlling the sheet resistance of thin film resistors |
Nov. 5, 2002 |
| 6468438 |
Method of fabricating a substrate |
Oct. 22, 2002 |
| 6464842 |
Control of solid state dimensional features |
Oct. 15, 2002 |
| 6448084 |
Multiple metal etchant system for integrated circuits |
Sep. 10, 2002 |
| 6429134 |
Method of manufacturing semiconductor device |
Aug. 6, 2002 |
| 6428718 |
Selective back side wet etch |
Aug. 6, 2002 |
| 6426296 |
Method and apparatus for obtaining a precision thickness in semiconductor and other wafers |
Jul. 30, 2002 |
| 6391662 |
Process for detecting agglomerated intrinsic point defects by metal decoration |
May. 21, 2002 |
| 6387289 |
Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies |
May. 14, 2002 |
| 6383934 |
Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquids |
May. 7, 2002 |
| 6383332 |
Endpoint detection method and apparatus which utilize a chelating agent to detect a polishing endpoint |
May. 7, 2002 |
| 6379980 |
Method and apparatus for monitoring material removal tool performance using endpoint time removal rate determination |
Apr. 30, 2002 |
| 6375791 |
Method and apparatus for detecting presence of residual polishing slurry subsequent to polishing of a semiconductor wafer |
Apr. 23, 2002 |
| 6368980 |
Resist mark having measurement marks for measuring the accuracy of overlay of a photomask disposed on semiconductor wafer and method for manufacturing semiconductor wafer having it |
Apr. 9, 2002 |
| 6368516 |
Semiconductor manufacturing methods |
Apr. 9, 2002 |
| 6360687 |
Wafer flattening system |
Mar. 26, 2002 |
| 6342166 |
Method of detecting end point of polishing of wafer and apparatus for detecting end point of polishing |
Jan. 29, 2002 |
| 6337027 |
Microelectromechanical device manufacturing process |
Jan. 8, 2002 |
| 6335286 |
Feedback control of polish buff time as a function of scratch count |
Jan. 1, 2002 |
| 6319420 |
Method and apparatus for electrically endpointing a chemical-mechanical planarization process |
Nov. 20, 2001 |
| 6309555 |
Method for determining thickness of material layer and chemical mechanical polishing endpoint |
Oct. 30, 2001 |
| 6296778 |
Method and apparatus for simulating standard test wafers |
Oct. 2, 2001 |
| 6274505 |
Etching method, etching apparatus and analyzing method |
Aug. 14, 2001 |
| 6265304 |
Controlling an etching process of multiple layers based upon thickness ratio of the dielectric layers |
Jul. 24, 2001 |
| 6261851 |
Optimization of CMP process by detecting of oxide/nitride interface using IR system |
Jul. 17, 2001 |
| 6258205 |
Endpoint detection method and apparatus which utilize an endpoint polishing layer of catalyst material |
Jul. 10, 2001 |
| 6254795 |
Texture measuring method of a hard disk plate |
Jul. 3, 2001 |
| 6245213 |
Method for anisotropic etching of structures in conducting materials |
Jun. 12, 2001 |
| 6245581 |
Method and apparatus for control of critical dimension using feedback etch control |
Jun. 12, 2001 |
| 6242356 |
Etchback method for forming microelectronic layer with enhanced surface smoothness |
Jun. 5, 2001 |
| 6238589 |
Methods for monitoring components in the TiW etching bath used in the fabrication of C4s |
May. 29, 2001 |
| 6228661 |
Method to determine the dark-to-clear exposure dose for the swing curve |
May. 8, 2001 |
| 6228280 |
Endpoint detection by chemical reaction and reagent |
May. 8, 2001 |
| 6228769 |
Endpoint detection by chemical reaction and photoionization |
May. 8, 2001 |
| 6200908 |
Process for reducing waviness in semiconductor wafers |
Mar. 13, 2001 |
| 6197209 |
Method of fabricating a substrate |
Mar. 6, 2001 |
| 6194231 |
Method for monitoring polishing pad used in chemical-mechanical planarization process |
Feb. 27, 2001 |
| 6180423 |
Method for wafer polishing and method for polishing pad dressing |
Jan. 30, 2001 |
| 6153116 |
Method of detecting end point and monitoring uniformity in chemical-mechanical polishing operation |
Nov. 28, 2000 |
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