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Class Information
Number: 216/78
Name: Etching a substrate: processes > Gas phase etching of substrate > Etching inorganic substrate > Substrate contains elemental metal, alloy thereof, or metal compound > Etching of substrate containing elemental copper, or an alloy or compound thereof
Description: Process wherein the material to be etched contains elemental copper or an alloy thereof, or a compound containing copper.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7563380 |
Electrode assembly for the removal of surface oxides by electron attachment |
Jul. 21, 2009 |
| 7553427 |
Plasma etching of Cu-containing layers |
Jun. 30, 2009 |
| 7540969 |
High thermal conducting circuit substrate and manufacturing process thereof |
Jun. 2, 2009 |
| 7387738 |
Removal of surface oxides by electron attachment for wafer bumping applications |
Jun. 17, 2008 |
| 7368393 |
Chemical oxide removal of plasma damaged SiCOH low k dielectrics |
May. 6, 2008 |
| 7297285 |
Manufacturing process of emboss type flexible or rigid printed circuit board |
Nov. 20, 2007 |
| 7285229 |
Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the same |
Oct. 23, 2007 |
| 7214327 |
Anisotropic dry etching of Cu-containing layers |
May. 8, 2007 |
| 7148073 |
Methods and systems for preparing a copper containing substrate for analysis |
Dec. 12, 2006 |
| 7086141 |
Manufacturing method of magnetoresistive effect sensor |
Aug. 8, 2006 |
| 7064076 |
Process for low temperature, dry etching, and dry planarization of copper |
Jun. 20, 2006 |
| 7063091 |
Method for cleaning the surface of a substrate |
Jun. 20, 2006 |
| 6987067 |
Semiconductor copper line cutting method |
Jan. 17, 2006 |
| 6960306 |
Low Cu percentages for reducing shorts in AlCu lines |
Nov. 1, 2005 |
| 6949202 |
Apparatus and method for flow of process gas in an ultra-clean environment |
Sep. 27, 2005 |
| 6939796 |
System, method and apparatus for improved global dual-damascene planarization |
Sep. 6, 2005 |
| 6843899 |
2D/3D chemical sensors and methods of fabricating and operating the same |
Jan. 18, 2005 |
| 6840249 |
Method for cleaning a semiconductor device |
Jan. 11, 2005 |
| 6824655 |
Process for charged particle beam micro-machining of copper |
Nov. 30, 2004 |
| 6782897 |
Method of protecting a passivation layer during solder bump formation |
Aug. 31, 2004 |
| 6780342 |
Method of etching and method of plasma treatment |
Aug. 24, 2004 |
| 6773616 |
Formation of nanoscale wires |
Aug. 10, 2004 |
| 6764606 |
Method and apparatus for plasma processing |
Jul. 20, 2004 |
| 6743369 |
Method for manufacturing electrode for secondary battery |
Jun. 1, 2004 |
| 6733597 |
Method of cleaning a dual damascene structure |
May. 11, 2004 |
| 6730237 |
Focused ion beam process for removal of copper |
May. 4, 2004 |
| 6708404 |
Method of producing high-density copper clad multi-layered printed wiring board having highly reliable through hole |
Mar. 23, 2004 |
| 6692580 |
Method of cleaning a dual damascene structure |
Feb. 17, 2004 |
| 6682659 |
Method for forming corrosion inhibited conductor layer |
Jan. 27, 2004 |
| 6630402 |
Integrated circuit resistant to the formation of cracks in a passivation layer |
Oct. 7, 2003 |
| 6579565 |
Clad sheet for printed circuit board, a multilayered printed circuit board using thereof and manufacturing method thereof |
Jun. 17, 2003 |
| 6569775 |
Method for enhancing plasma processing performance |
May. 27, 2003 |
| 6547934 |
Reduction of metal oxide in a dual frequency etch chamber |
Apr. 15, 2003 |
| 6544663 |
Electrodeposited copper foil |
Apr. 8, 2003 |
| 6534416 |
Control of patterned etching in semiconductor features |
Mar. 18, 2003 |
| 6509276 |
Focused ion beam etching of copper with variable pixel spacing |
Jan. 21, 2003 |
| 6488862 |
Etched patterned copper features free from etch process residue |
Dec. 3, 2002 |
| 6464889 |
Surface modification of medical implants |
Oct. 15, 2002 |
| 6428714 |
Protective layer for continuous GMR design |
Aug. 6, 2002 |
| 6407001 |
Focused ion beam etching of copper |
Jun. 18, 2002 |
| 6388382 |
Plasma processing apparatus and method |
May. 14, 2002 |
| 6352081 |
Method of cleaning a semiconductor device processing chamber after a copper etch process |
Mar. 5, 2002 |
| 6296777 |
Structuring process |
Oct. 2, 2001 |
| 6280641 |
Printed wiring board having highly reliably via hole and process for forming via hole |
Aug. 28, 2001 |
| 6258727 |
Method of forming metal lands at the M0 level with a non selective chemistry |
Jul. 10, 2001 |
| 6180019 |
Plasma processing apparatus and method |
Jan. 30, 2001 |
| 6171956 |
Method for improving the thermal conductivity of metal lines in integrated circuits |
Jan. 9, 2001 |
| 6156218 |
Method of pretreatment for electroless nickel plating |
Dec. 5, 2000 |
| 6129858 |
Etching solution |
Oct. 10, 2000 |
| 6051152 |
Process for making diamond and diamond-coated filaments |
Apr. 18, 2000 |
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