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Class Information
Number: 216/20
Name: Etching a substrate: processes > Forming or treating electrical conductor article (e.g., circuit, etc.) > Adhesive or autogenous bonding of self-sustaining preforms (e.g., prefabricated base, etc.)
Description: Process including a step of adhesively or autogeneously bonding two or more self-sustaining preforms and wherein the final product contains the two or more adhered layers.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
8709265 (4927 Apr. 29, 2014
8623224 Method for making patterned conductive element Jan. 7, 2014
8623226 Making stacked pancake motors using patterned adhesives Jan. 7, 2014
8597526 Method for making graphene/carbon nanotube composite structure Dec. 3, 2013
8507801 Printed wiring board Aug. 13, 2013
8458903 Method of producing an elastic plate member for a liquid jet head Jun. 11, 2013
8460562 Cochlear implant assembly Jun. 11, 2013
8455926 Systems, methods, and apparatus of a low conductance silicon micro-leak for mass spectrometer inlet Jun. 4, 2013
8430255 Method of accurately spacing Z-axis electrode Apr. 30, 2013
8398869 Transfer film and method for fabricating a circuit Mar. 19, 2013
8357307 Method of forming electronic circuit Jan. 22, 2013
8329046 Methods for damage etch and texturing of silicon single crystal substrates Dec. 11, 2012
8282841 Printed circuit board and manufacturing method thereof Oct. 9, 2012
8187479 Manufacturing method of printed circuit board May. 29, 2012
8110118 Method of manufacturing circuit board Feb. 7, 2012
8066891 Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film Nov. 29, 2011
8062537 Method for manufacturing an electronics module Nov. 22, 2011
8053367 Wafer polishing method Nov. 8, 2011
8052881 Method of manufacturing multilayer printed circuit board having buried holes Nov. 8, 2011
8007673 Method of manufacturing circuit board Aug. 30, 2011
7951302 Method for forming bump of probe card May. 31, 2011
7943052 Method for self-assembling microstructures May. 17, 2011
7922920 Systems, methods, and apparatus of a low conductance silicon micro-leak for mass spectrometer inlet Apr. 12, 2011
7875195 Thick porous anodic alumina films and nanowire arrays grown on a solid substrate Jan. 25, 2011
7810355 Full perimeter chemical strengthening of substrates Oct. 12, 2010
7767102 Systems and methods for harvesting and integrating nanowires Aug. 3, 2010
7678587 Cantilever-type probe and method of fabricating the same Mar. 16, 2010
7669320 Coreless cavity substrates for chip packaging and their fabrication Mar. 2, 2010
7622048 Sacrificial substrate for etching Nov. 24, 2009
7588657 Pattern-free method of making line gratings Sep. 15, 2009
7537668 Method of fabricating high density printed circuit board May. 26, 2009
7534361 Methods for making laminated member for circuit board, making circuit board and laminating flexible film May. 19, 2009
7516545 Method of manufacturing printed circuit board having landless via hole Apr. 14, 2009
7511375 Semiconductor device carrier unit and semiconductor socket provided therewith Mar. 31, 2009
7501035 Method of manufacturing replica diffraction grating Mar. 10, 2009
7479455 Method for manufacturing semiconductor wafer Jan. 20, 2009
7476328 Method of manufacturing printed circuit board Jan. 13, 2009
7413670 Method for forming wiring on a substrate Aug. 19, 2008
7402254 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements Jul. 22, 2008
7361284 Method for wafer-level package Apr. 22, 2008
7297285 Manufacturing process of emboss type flexible or rigid printed circuit board Nov. 20, 2007
7229564 Method for manufacturing bipolar plate and direct methanol fuel cell Jun. 12, 2007
7217370 Wiring board and process for producing the same May. 15, 2007
7214282 Electromagnetic-wave shielding and light transmitting plate, manufacturing method thereof and display panel May. 8, 2007
7128844 Metal/ceramic circuit board and method for producing same Oct. 31, 2006
7077969 Miniature microdevice package and process for making thereof Jul. 18, 2006
7048867 Method of increasing the area of a useful layer of material transferred onto a support May. 23, 2006
7041227 Method for revealing crystalline defects and/or stress field defects at the molecular adhesion interface of two solid materials May. 9, 2006
6969471 Process for manufacturing printed circuit boards with protected spaces between tracks Nov. 29, 2005
6908561 Polymide-to-substrate adhesion promotion in HDI Jun. 21, 2005

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