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Class Information
Number: 216/19
Name: Etching a substrate: processes > Forming or treating electrical conductor article (e.g., circuit, etc.) > Forming or treating of groove or through hole > Filling or coating of groove or through hole in a conductor with an insulator
Description: Process directed to filling or coating of groove or through hole with an insulator to thus form an insulated region in or on a conductor.

Patents under this class:
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Patent Number Title Of Patent Date Issued
8673689 Single layer BGA substrate process Mar. 18, 2014
8641914 Methods of improving long range order in self-assembly of block copolymer films with ionic liquids Feb. 4, 2014
8535546 Method of manufacturing multilayer wiring substrate Sep. 17, 2013
8491769 Embedding a nanotube inside a nanopore for DNA translocation Jul. 23, 2013
8475666 Method for making toughening agent materials Jul. 2, 2013
8454845 High speed interconnect and method of manufacture Jun. 4, 2013
8388851 Capacitor forming methods Mar. 5, 2013
8366947 Method for transferring nanostructures into a substrate Feb. 5, 2013
8273256 Method for manufacturing wiring structure of wiring board Sep. 25, 2012
8092697 Molecular characterization with carbon nanotube control Jan. 10, 2012
8062536 High density plasma chemical vapor deposition process Nov. 22, 2011
8062734 Article comprising conductive conduit channels Nov. 22, 2011
8058175 Method for planarization of wafer and method for formation of isolation structure in top metal layer Nov. 15, 2011
7971354 Method of manufacturing a multilayer printed wiring board Jul. 5, 2011
7931818 Process of embedded circuit structure Apr. 26, 2011
7743494 Process of fabricating a circuit board Jun. 29, 2010
7718079 High density plasma chemical vapor deposition process May. 18, 2010
7691276 Method for manufacturing an electrical connecting element, and a connecting element Apr. 6, 2010
7615162 Printed wiring board and method for manufacturing the same Nov. 10, 2009
7585419 Substrate structure and the fabrication method thereof Sep. 8, 2009
7540969 High thermal conducting circuit substrate and manufacturing process thereof Jun. 2, 2009
7514014 High density plasma chemical vapor deposition process Apr. 7, 2009
7422696 Multicomponent nanorods Sep. 9, 2008
7407596 Fluxgate sensor integrated in printed circuit board and method for manufacturing the same Aug. 5, 2008
7396475 Method of forming stepped structures employing imprint lithography Jul. 8, 2008
7371452 Conductive patterned sheet utilizing multi-layered conductive conduit channels May. 13, 2008
7294902 Trench isolation having a self-adjusting surface seal and method for producing one such trench isolation Nov. 13, 2007
7279110 Method and apparatus for creating a phase step in mirrors used in spatial light modulator arrays Oct. 9, 2007
7204933 Method of forming pillars in a fully integrated thermal inkjet printhead Apr. 17, 2007
7141176 Methods and apparatuses for assembling elements onto a substrate Nov. 28, 2006
7138170 Terminated conductive patterned sheet utilizing conductive conduits Nov. 21, 2006
7128844 Metal/ceramic circuit board and method for producing same Oct. 31, 2006
7112285 Conductive core substrate fabrication Sep. 26, 2006
7076870 Manufacturing process for a surface-mount metal-cavity package for an oscillator crystal blank Jul. 18, 2006
7052619 Method for manufacturing printed circuit boards from an extruded polymer May. 30, 2006
7030031 Method for forming damascene structure utilizing planarizing material coupled with diffusion barrier material Apr. 18, 2006
7025892 Method for creating gated filament structures for field emission displays Apr. 11, 2006
7022609 Manufacturing method of a semiconductor substrate provided with a through hole electrode Apr. 4, 2006
7001658 Heat selective electrically conductive polymer sheet Feb. 21, 2006
6878297 Method of producing organic light-emissive devices Apr. 12, 2005
6783689 Method of forming pillars in a fully integrated thermal inkjet printhead Aug. 31, 2004
6764747 Circuit board and method of producing the same Jul. 20, 2004
6759112 Exposed and embedded overlay structure Jul. 6, 2004
6759082 Metal foil laminated plate and method of manufacturing the same Jul. 6, 2004
6660175 Method of forming pillars in a fully integrated thermal inkjet printhead Dec. 9, 2003
6641744 Method of forming pillars in a fully integrated thermal inkjet printhead Nov. 4, 2003
6618940 Fine pitch circuitization with filled plated through holes Sep. 16, 2003
6555015 Multi-layer printed circuit board and method of making same Apr. 29, 2003
6555016 Method of making multilayer substrate Apr. 29, 2003
6527964 Methods and apparatuses for improved flow in performing fluidic self assembly Mar. 4, 2003

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