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Class Information
Number: 216/19
Name: Etching a substrate: processes > Forming or treating electrical conductor article (e.g., circuit, etc.) > Forming or treating of groove or through hole > Filling or coating of groove or through hole in a conductor with an insulator
Description: Process directed to filling or coating of groove or through hole with an insulator to thus form an insulated region in or on a conductor.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7407596 |
Fluxgate sensor integrated in printed circuit board and method for manufacturing the same |
Aug. 5, 2008 |
| 7396475 |
Method of forming stepped structures employing imprint lithography |
Jul. 8, 2008 |
| 7371452 |
Conductive patterned sheet utilizing multi-layered conductive conduit channels |
May. 13, 2008 |
| 7294902 |
Trench isolation having a self-adjusting surface seal and method for producing one such trench isolation |
Nov. 13, 2007 |
| 7279110 |
Method and apparatus for creating a phase step in mirrors used in spatial light modulator arrays |
Oct. 9, 2007 |
| 7204933 |
Method of forming pillars in a fully integrated thermal inkjet printhead |
Apr. 17, 2007 |
| 7141176 |
Methods and apparatuses for assembling elements onto a substrate |
Nov. 28, 2006 |
| 7138170 |
Terminated conductive patterned sheet utilizing conductive conduits |
Nov. 21, 2006 |
| 7128844 |
Metal/ceramic circuit board and method for producing same |
Oct. 31, 2006 |
| 7112285 |
Conductive core substrate fabrication |
Sep. 26, 2006 |
| 7076870 |
Manufacturing process for a surface-mount metal-cavity package for an oscillator crystal blank |
Jul. 18, 2006 |
| 7052619 |
Method for manufacturing printed circuit boards from an extruded polymer |
May. 30, 2006 |
| 7030031 |
Method for forming damascene structure utilizing planarizing material coupled with diffusion barrier material |
Apr. 18, 2006 |
| 7025892 |
Method for creating gated filament structures for field emission displays |
Apr. 11, 2006 |
| 7022609 |
Manufacturing method of a semiconductor substrate provided with a through hole electrode |
Apr. 4, 2006 |
| 7001658 |
Heat selective electrically conductive polymer sheet |
Feb. 21, 2006 |
| 6878297 |
Method of producing organic light-emissive devices |
Apr. 12, 2005 |
| 6783689 |
Method of forming pillars in a fully integrated thermal inkjet printhead |
Aug. 31, 2004 |
| 6764747 |
Circuit board and method of producing the same |
Jul. 20, 2004 |
| 6759082 |
Metal foil laminated plate and method of manufacturing the same |
Jul. 6, 2004 |
| 6759112 |
Exposed and embedded overlay structure |
Jul. 6, 2004 |
| 6660175 |
Method of forming pillars in a fully integrated thermal inkjet printhead |
Dec. 9, 2003 |
| 6641744 |
Method of forming pillars in a fully integrated thermal inkjet printhead |
Nov. 4, 2003 |
| 6618940 |
Fine pitch circuitization with filled plated through holes |
Sep. 16, 2003 |
| 6555015 |
Multi-layer printed circuit board and method of making same |
Apr. 29, 2003 |
| 6555016 |
Method of making multilayer substrate |
Apr. 29, 2003 |
| 6527964 |
Methods and apparatuses for improved flow in performing fluidic self assembly |
Mar. 4, 2003 |
| 6495053 |
Electrical circuit board and a method for making the same |
Dec. 17, 2002 |
| 6461527 |
Method for fabricating a flexible printed circuit board with access on both sides |
Oct. 8, 2002 |
| 6436610 |
Method for selectively exposing a light pattern to a photosensitive work surface |
Aug. 20, 2002 |
| 6429755 |
Method for constructing an encapsulated MEMS band-pass filter for integrated circuits |
Aug. 6, 2002 |
| 6426011 |
Method of making a printed circuit board |
Jul. 30, 2002 |
| 6402970 |
Method of making a support circuit for a semiconductor chip assembly |
Jun. 11, 2002 |
| 6396001 |
Printed circuit board and method of making the same |
May. 28, 2002 |
| 6375857 |
Method to form fuse using polymeric films |
Apr. 23, 2002 |
| 6350386 |
Method of making a support circuit with a tapered through-hole for a semiconductor chip assembly |
Feb. 26, 2002 |
| 6303043 |
Method of fabricating preserve layer |
Oct. 16, 2001 |
| 6238590 |
Tribochemical polishing of ceramics and metals |
May. 29, 2001 |
| 6187412 |
Silicon article having columns and method of making |
Feb. 13, 2001 |
| 6162365 |
Pd etch mask for copper circuitization |
Dec. 19, 2000 |
| 6117345 |
High density plasma chemical vapor deposition process |
Sep. 12, 2000 |
| 6103134 |
Circuit board features with reduced parasitic capacitance and method therefor |
Aug. 15, 2000 |
| 5930676 |
Multilayered interconnection substrate and process for fabricating the same |
Jul. 27, 1999 |
| 5893980 |
Semiconductor device capacitor fabrication method |
Apr. 13, 1999 |
| 5863447 |
Method for providing a selective reference layer isolation technique for the production of printed circuit boards |
Jan. 26, 1999 |
| 5679267 |
Dual etching of ceramic materials with an elevated thin film |
Oct. 21, 1997 |
| 5653892 |
Etching of ceramic materials with an elevated thin film |
Aug. 5, 1997 |
| 5616256 |
Printed wiring board and process for producing thereof |
Apr. 1, 1997 |
| 5576148 |
Process for production of printed circuit board |
Nov. 19, 1996 |
| 5573632 |
Multilayer printed-circuit substrate, wiring substrate and process of producing the same |
Nov. 12, 1996 |
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