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Class Information
Number: 216/18
Name: Etching a substrate: processes > Forming or treating electrical conductor article (e.g., circuit, etc.) > Forming or treating of groove or through hole > Filling or coating of groove or through hole with a conductor to form an electrical interconnection
Description: Process directed to filling or coating of groove or through hole with an electrically conductive material so as to provide an electrical interconnection in a circuit.

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13

Patent Number Title Of Patent Date Issued
8641914 Methods of improving long range order in self-assembly of block copolymer films with ionic liquids Feb. 4, 2014
8574444 Fabricating method for multilayer printed circuit board Nov. 5, 2013
8562847 Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter Oct. 22, 2013
8535546 Method of manufacturing multilayer wiring substrate Sep. 17, 2013
8535547 Printed circuit board manufacturing system and manufacturing method thereof Sep. 17, 2013
8506826 Method of manufacturing a switch system Aug. 13, 2013
8501021 Process and system for quality management and analysis of via drilling Aug. 6, 2013
8476167 Lithographic apparatus and method of manufacturing an electrostatic clamp for a lithographic apparatus Jul. 2, 2013
8465657 Post chemical mechanical polishing etch for improved time dependent dielectric breakdown reliability Jun. 18, 2013
8454845 High speed interconnect and method of manufacture Jun. 4, 2013
8398868 Directed self-assembly of block copolymers using segmented prepatterns Mar. 19, 2013
8400781 Using interrupted through-silicon-vias in integrated circuits adapted for stacking Mar. 19, 2013
8377317 Method for manufacturing printed circuit board with thick traces Feb. 19, 2013
8357570 Pixel structure and method for fabricating the same Jan. 22, 2013
8334187 Hard mask for thin film resistor manufacture Dec. 18, 2012
8308963 Etchant for etching metal wiring layers and method for forming thin film transistor by using the same Nov. 13, 2012
8294034 Circuit board and process for fabricating the same Oct. 23, 2012
8282846 Metal interconnect structure with a side wall spacer that protects an ARC layer and a bond pad from corrosion and method of forming the metal interconnect structure Oct. 9, 2012
8277668 Methods of preparing printed circuit boards and packaging substrates of integrated circuit Oct. 2, 2012
8273256 Method for manufacturing wiring structure of wiring board Sep. 25, 2012
8262917 Fabricating method for multilayer printed circuit board Sep. 11, 2012
8252683 3D interconnection structure and method of manufacturing the same Aug. 28, 2012
8226835 Ultra-thin film formation using gas cluster ion beam processing Jul. 24, 2012
8220149 Method of manufacturing a printed circuit board Jul. 17, 2012
8207496 Multi-needle multi-parallel nanospray ionization source for mass spectrometry Jun. 26, 2012
8197702 Manufacturing method of printed circuit board Jun. 12, 2012
8173033 Manufacturing method of a nano filter structure for breathing May. 8, 2012
8166635 Manufacturing method of electrode, electric storage device, and intermediate laminate member May. 1, 2012
8156645 Method of manufacturing a multilayer printed wiring board with copper wrap plated hole Apr. 17, 2012
8158521 Two step post-deposition treatment of ILD layer for a lower dielectric constant and improved mechanical properties Apr. 17, 2012
8128993 Anisotropic nanotube fabric layers and films and methods of forming same Mar. 6, 2012
8123967 Method of producing an article having patterned decorative coating Feb. 28, 2012
8123965 Interconnect structure with stress buffering ability and the manufacturing method thereof Feb. 28, 2012
8123966 Piezoelectric electronic component, process for producing the same, and communication apparatus Feb. 28, 2012
8075788 Fabrication method of printed circuit board and printed circuit board machining apparatus Dec. 13, 2011
8062539 Method for manufacturing multilayer printed wiring board and multilayer printed wiring board obtained by the same Nov. 22, 2011
8062734 Article comprising conductive conduit channels Nov. 22, 2011
8052881 Method of manufacturing multilayer printed circuit board having buried holes Nov. 8, 2011
8052882 Method of manufacturing wiring substrate Nov. 8, 2011
8043519 Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter Oct. 25, 2011
7972521 Method of making reliable wafer level chip scale package semiconductor devices Jul. 5, 2011
7972460 Method of manufacturing printed circuit board Jul. 5, 2011
7954234 Method of manufacturing a wiring board Jun. 7, 2011
7931818 Process of embedded circuit structure Apr. 26, 2011
7927499 Substrate having blind hole and method for forming blind hole Apr. 19, 2011
7921799 Pattern forming apparatus and manufacturing apparatus using the same Apr. 12, 2011
7922918 Method of manufacturing circuit board used for switch device Apr. 12, 2011
7922919 Crossbar-array designs and wire addressing methods that tolerate misalignment of electrical components at wire overlap points Apr. 12, 2011
7910910 Phase-change memory cell and method of fabricating the phase-change memory cell Mar. 22, 2011
7910010 Ink jet head having an electrostatic actuator and manufacturing method of the same Mar. 22, 2011

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