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Class Information
Number: 216/15
Name: Etching a substrate: processes > Forming or treating electrical conductor article (e.g., circuit, etc.) > Forming or treating a crossover
Description: Process directed to the forming or treating of a circuit where one conductor crosses over another without electrical contact due to the presence of an insulator therebetween.

Patents under this class:

Patent Number Title Of Patent Date Issued
8568599 Touch panel fabricating method Oct. 29, 2013
8535546 Method of manufacturing multilayer wiring substrate Sep. 17, 2013
8501021 Process and system for quality management and analysis of via drilling Aug. 6, 2013
8460562 Cochlear implant assembly Jun. 11, 2013
8312624 Method for manufacturing a heat dissipation structure of a printed circuit board Nov. 20, 2012
7867402 Method for realizing a multispacer structure, use of said structure as a mold and circuital architectures obtained from said mold Jan. 11, 2011
7670496 Process for producing structural body and etchant for silicon oxide film Mar. 2, 2010
6838389 High selectivity etching of a lead overlay structure Jan. 4, 2005
6740246 Circuit board and a method for making the same May. 25, 2004
6576402 Method for producing wiring configurations having coarse conductor structures and at least one region having fine conductor structures Jun. 10, 2003
RE38053 Liquid crystal display device and manufacturing method thereof Apr. 1, 2003
6475703 Method for constructing multilayer circuit boards having air bridges Nov. 5, 2002
6453914 Acid blend for removing etch residue Sep. 24, 2002
6449839 Electrical circuit board and a method for making the same Sep. 17, 2002
6403893 Circuit board and a method for making the same Jun. 11, 2002
6280640 Process for manufacturing a chip carrier substrate Aug. 28, 2001
6248247 Method of fortifying an air bridge circuit Jun. 19, 2001
6217783 Method for strengthening air bridge circuits Apr. 17, 2001
6111204 Bond pads for fine-pitch applications on air bridge circuit boards Aug. 29, 2000
5597470 Method for making a flexible lead for a microelectronic device Jan. 28, 1997
5534111 Thermal isolation microstructure Jul. 9, 1996
5531018 Method of micromachining electromagnetically actuated current switches with polyimide reinforcement seals, and switches produced thereby Jul. 2, 1996
5387547 Process for adjusting the impedance of a microwave conductor using an air bridge Feb. 7, 1995
5279706 Method and apparatus for fabricating a metal interconnection pattern for an integrated circuit module Jan. 18, 1994
5219713 Multi-layer photoresist air bridge fabrication method Jun. 15, 1993
5127570 Flexible automated bonding method and apparatus Jul. 7, 1992
5117276 High performance interconnect system for an integrated circuit May. 26, 1992
5055425 Stacked solid via formation in integrated circuit systems Oct. 8, 1991
5030318 Method of making electrical probe diaphragms Jul. 9, 1991
5023205 Method of fabricating hybrid circuit structures Jun. 11, 1991
4541882 Process for the manufacture of substrates to interconnect electronic components and articles made by said process Sep. 17, 1985
4517225 Method for manufacturing an electrical interconnection by selective tungsten deposition May. 14, 1985
4502917 Process for forming patterned films Mar. 5, 1985
4289846 Process for forming low-reactance interconnections on semiconductors Sep. 15, 1981
4277321 Treating multilayer printed wiring boards Jul. 7, 1981
4118595 Crossovers and method of fabrication Oct. 3, 1978
4054484 Method of forming crossover connections Oct. 18, 1977
4037318 Method of making fuses Jul. 26, 1977

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