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Class Information
Number: 216/106
Name: Etching a substrate: processes > Nongaseous phase etching of substrate > Etching inorganic substrate > Substrate contains elemental metal, alloy thereof, or metal compound > Metal is elemental copper, an alloy, or compound thereof > Etchant contains acid
Description: Process wherein the substrate is etched with H+ ion producing or containing material.

Sub-classes under this class:

Class Number Class Name Patents
216/107 Etchant contains fluoride ion 56

Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8641829 Substrate processing system Feb. 4, 2014
8586481 Chemical planarization of copper wafer polishing Nov. 19, 2013
8580136 Etching solution composition for metal thin film consisting primarily of copper Nov. 12, 2013
8510951 Method for producing a lens pattern on roll Aug. 20, 2013
8486282 Acid chemistries and methodologies for texturing transparent conductive oxide materials Jul. 16, 2013
8257600 Printed masking process Sep. 4, 2012
8192636 Composition and method for improved adhesion of polymeric materials to copper alloy surfaces Jun. 5, 2012
8182710 Structuring method May. 22, 2012
8123970 Potassium monopersulfate solutions Feb. 28, 2012
8007594 Method for manufacturing semiconductor device Aug. 30, 2011
7998359 Methods of etching silicon-containing films on silicon substrates Aug. 16, 2011
7976723 Method for kinetically controlled etching of copper Jul. 12, 2011
7968000 Etchant composition, and method of fabricating metal pattern and thin film transistor array panel using the same Jun. 28, 2011
7897061 Compositions and methods for CMP of phase change alloys Mar. 1, 2011
7875558 Microetching composition and method of using the same Jan. 25, 2011
7850866 Etchant and array substrate having copper lines etched by the etchant Dec. 14, 2010
7780867 Edge bevel removal of copper from silicon wafers Aug. 24, 2010
7736405 Chemical mechanical polishing compositions for copper and associated materials and method of using same Jun. 15, 2010
7686899 Process for producing a sliding bearing with a sliding surface, consisting of a copper multicomponent alloy Mar. 30, 2010
7670497 Oxidant and passivant composition and method for use in treating a microelectronic structure Mar. 2, 2010
7666320 Manufacturing method of printed wiring board as well as copper-clad laminate and treatment solutions used therefor Feb. 23, 2010
7645393 Metal surface treatment composition Jan. 12, 2010
7578889 Methodology for cleaning of surface metal contamination from electrode assemblies Aug. 25, 2009
7563315 Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates Jul. 21, 2009
7550092 Chemical mechanical polishing composition Jun. 23, 2009
7547642 Micro-structure manufacturing method Jun. 16, 2009
7456114 Microetching composition and method of using the same Nov. 25, 2008
7404910 Etching solution, etched article and method for etched article Jul. 29, 2008
7393461 Microetching solution Jul. 1, 2008
7384871 Chemical mechanical polishing compositions and methods relating thereto Jun. 10, 2008
7368065 Implants with textured surface and methods for producing the same May. 6, 2008
7357879 Etching solution, method of etching and printed wiring board Apr. 15, 2008
7341958 Integrated process for thin film resistors with silicides Mar. 11, 2008
7306681 Method of cleaning a semiconductor substrate Dec. 11, 2007
7303993 Chemical mechanical polishing compositions and methods relating thereto Dec. 4, 2007
7285229 Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the same Oct. 23, 2007
7258808 High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same Aug. 21, 2007
7189336 Etchant, method for roughening copper surface and method for producing printed wiring board Mar. 13, 2007
7163897 Method for assaying elements in a substrate for optics, electronics, or optoelectronics Jan. 16, 2007
7153445 Method for roughening copper surfaces for bonding to substrates Dec. 26, 2006
7108795 Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates Sep. 19, 2006
7087183 Method of using an etchant solution for removing a thin metallic layer Aug. 8, 2006
7067068 Method for preventing lead from dissolving from a lead-containing copper-based alloy Jun. 27, 2006
7063800 Methods of cleaning copper surfaces in the manufacture of printed circuit boards Jun. 20, 2006
7060631 Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates Jun. 13, 2006
7037350 Composition for chemical-mechanical polishing and method of using same May. 2, 2006
7030033 Method for manufacturing circuit devices Apr. 18, 2006
6949470 Method for manufacturing circuit devices Sep. 27, 2005
6946027 Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates Sep. 20, 2005
6902591 Polishing composition Jun. 7, 2005

1 2 3 4 5 6

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