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Class Information
Number: 205/84
Name: Electrolysis: processes, compositions used therein, and methods of preparing the compositions > Electrolytic coating (process, composition and method of preparing composition) > Involving measuring, analyzing, or testing > Controlling coating process in response to measured or detected parameter > Parameter is thickness, weight, or composition of coating
Description: Subject matter wherein the characteristic measured, analyzed, or tested is the thickness, weight, or composition of the electrolytic coating.

Patents under this class:
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Patent Number Title Of Patent Date Issued
8569102 Method of manufacturing high density CIS thin film for solar cell and method of manufacturing thin film solar cell using the same Oct. 29, 2013
8425751 Systems and methods for the electrodeposition of a nickel-cobalt alloy Apr. 23, 2013
8323471 Automatic deposition profile targeting Dec. 4, 2012
8114262 Thickness distribution control for electroplating Feb. 14, 2012
7914657 Controlling the thickness of wafers during the electroplating process Mar. 29, 2011
7854824 Method of manufacturing semiconductor device using electrochemical deposition with electric current revised by reflectance of every substrate surface and semiconductor manufacturing apparatus Dec. 21, 2010
7850836 Method of electro-depositing a conductive material in at least one through-hole via of a semiconductor substrate Dec. 14, 2010
7667835 Apparatus and method for preventing copper peeling in ECP Feb. 23, 2010
7578920 Electrolytic processing method Aug. 25, 2009
7575664 Plating method Aug. 18, 2009
7560015 Process for electrolytic coating of a strand casting mould Jul. 14, 2009
7537681 Method for forming and measuring the thickness of an anodized coating May. 26, 2009
7244347 Method and system to provide electrical contacts for electrotreating processes Jul. 17, 2007
7223328 Sensors for reducing gas molecules May. 29, 2007
7211186 Method and system to provide electrical contacts for electrotreating processes May. 1, 2007
7161689 Apparatus and method for processing a microelectronic workpiece using metrology Jan. 9, 2007
7041510 System and method for programmable illumination pattern generation May. 9, 2006
7020537 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece Mar. 28, 2006
6991941 Light-controlled electrokinetic assembly of particles near surfaces Jan. 31, 2006
6974533 Platinum electrode and method for manufacturing the same Dec. 13, 2005
6969672 Method and apparatus for controlling a thickness of a conductive layer in a semiconductor manufacturing operation Nov. 29, 2005
6926816 Analysis method of film thickness distribution and design system of printed circuit board and manufacturing processes Aug. 9, 2005
6916413 Electro-plating apparatus and method Jul. 12, 2005
6913681 Plating method and plating apparatus Jul. 5, 2005
6893548 Method of conditioning electrochemical baths in plating technology May. 17, 2005
6884333 Electrochemical system for analyzing performance and properties of electrolytic solutions Apr. 26, 2005
6866763 Method and system monitoring and controlling film thickness profile during plating and electroetching Mar. 15, 2005
6837978 Deposition uniformity control for electroplating apparatus, and associated method Jan. 4, 2005
6814848 Method for determining alloy phase in plating layer and method for evaluating sliding property of alloy galvanized steel plate Nov. 9, 2004
6802950 Apparatus and method for controlling plating uniformity Oct. 12, 2004
6773569 Potential pulse-scan methods of analyzing organic additives in plating baths with multi-component additives Aug. 10, 2004
6752916 Electrochemical planarization end point detection Jun. 22, 2004
6746579 Electrolytic gold plating method and apparatus therefor Jun. 8, 2004
6740221 Method of forming copper interconnects May. 25, 2004
6726824 Closed loop monitoring of electroplating bath constituents using mass spectrometry Apr. 27, 2004
6716329 Processing apparatus and processing system Apr. 6, 2004
6630360 Advanced process control (APC) of copper thickness for chemical mechanical planarization (CMP) optimization Oct. 7, 2003
6607650 Method of forming a plated layer to a predetermined thickness Aug. 19, 2003
6596147 Methods of overplating surfaces of microelectromechanical structure Jul. 22, 2003
6542784 Plating analysis method Apr. 1, 2003
6524460 Method for defining the characteristics of metal electrodes of ceramic sensor elements Feb. 25, 2003
6428673 Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processing based on metrology Aug. 6, 2002
6350361 Real time control device for electroformation, plating and deplating processes Feb. 26, 2002
6258239 Process for the manufacture of an electrode for a solid polymer fuel cell Jul. 10, 2001
6238539 Method of in-situ displacement/stress control in electroplating May. 29, 2001
6235178 Method and device for coating a metal strip May. 22, 2001
6231743 Method for forming a semiconductor device May. 15, 2001
6200450 Method and apparatus for depositing Ni-Fe-W-P alloys Mar. 13, 2001
6168639 Solid electrolyte capacitor, and process and apparatus for producing same Jan. 2, 2001

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