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Class Information
Number: 205/81
Name: Electrolysis: processes, compositions used therein, and methods of preparing the compositions > Electrolytic coating (process, composition and method of preparing composition) > Involving measuring, analyzing, or testing
Description: Subject matter wherein the process includes a step of measuring, analyzing, or testing.

Sub-classes under this class:

Class Number Class Name Patents
205/82 Controlling coating process in response to measured or detected parameter 111

Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8702953 Method of determining operating condition for rotary surface treating apparatus Apr. 22, 2014
8668817 System and method of plating metal alloys by using galvanic technology Mar. 11, 2014
8585875 Substrate plating apparatus with multi-channel field programmable gate array Nov. 19, 2013
8580090 Combinatorial electrochemical deposition Nov. 12, 2013
8535504 Analysis of an auxiliary leveler additive in an acid copper plating bath Sep. 17, 2013
8475642 Systems and methods for monitoring plating and etching baths Jul. 2, 2013
8440555 Method for analyzing electrolytic copper plating solution May. 14, 2013
8372258 Monitoring of electroplating additives Feb. 12, 2013
8308929 Microfluidic systems and methods for screening plating and etching bath compositions Nov. 13, 2012
8177953 Method and apparatus for evaluation of coated parts May. 15, 2012
8147670 Profile control on ring anode plating chambers for multi-step recipes Apr. 3, 2012
8142640 Chloride analysis in acid copper plating baths Mar. 27, 2012
8118988 Analysis of copper ion and complexing agent in copper plating baths Feb. 21, 2012
8041442 Process for selecting surrogate part Oct. 18, 2011
7985328 Using cell voltage as a monitor for deposition coverage Jul. 26, 2011
7879222 Detection of additive breakdown products in acid copper plating baths Feb. 1, 2011
7850836 Method of electro-depositing a conductive material in at least one through-hole via of a semiconductor substrate Dec. 14, 2010
7820535 Method for analyzing copper electroplating solution, apparatus for the analysis, and method for fabricating semiconductor product Oct. 26, 2010
7797137 Adaptive method and system of monitoring signals for detecting anomalies Sep. 14, 2010
7765661 Method for manufacturing ceramic electronic component and planting bath Aug. 3, 2010
7678258 Void-free damascene copper deposition process and means of monitoring thereof Mar. 16, 2010
7578920 Electrolytic processing method Aug. 25, 2009
7544280 Plating analyzing method and apparatus Jun. 9, 2009
7537681 Method for forming and measuring the thickness of an anodized coating May. 26, 2009
7427344 Methods for determining organic component concentrations in an electrolytic solution Sep. 23, 2008
7425255 Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition Sep. 16, 2008
7384535 Bath analysis Jun. 10, 2008
7371312 Using cell voltage as a monitor for deposition coverage May. 13, 2008
7371311 Modified electroplating solution components in a low-acid electrolyte solution May. 13, 2008
7291253 Detection of an unstable additive breakdown product in a plating bath Nov. 6, 2007
7279084 Apparatus having plating solution container with current applying anodes Oct. 9, 2007
7189647 Sequential station tool for wet processing of semiconductor wafers Mar. 13, 2007
7186326 Efficient analysis of organic additives in an acid copper plating bath Mar. 6, 2007
7183787 Contact resistance device for improved process control Feb. 27, 2007
7161689 Apparatus and method for processing a microelectronic workpiece using metrology Jan. 9, 2007
7144488 Electrode, electrochemical cell, and method for analysis of electroplating baths Dec. 5, 2006
7094323 Process analyzer for monitoring electrochemical deposition solutions Aug. 22, 2006
7093347 Method of making a current-perpendicular to the plane (CPP) magnetoresistive (MR) sensor Aug. 22, 2006
7060203 Electrolyte solution for particle measuring apparatus, and particle measuring method using same Jun. 13, 2006
RE39123 Plating apparatus Jun. 13, 2006
7041510 System and method for programmable illumination pattern generation May. 9, 2006
7022215 System and methods for analyzing copper chemistry Apr. 4, 2006
7001497 Process and apparatus for positioning replacement anodes in electrolytic cells Feb. 21, 2006
6991941 Light-controlled electrokinetic assembly of particles near surfaces Jan. 31, 2006
6984299 Methods for determining organic component concentrations in an electrolytic solution Jan. 10, 2006
6969672 Method and apparatus for controlling a thickness of a conductive layer in a semiconductor manufacturing operation Nov. 29, 2005
6936157 Interference correction of additives concentration measurements in metal electroplating solutions Aug. 30, 2005
6926816 Analysis method of film thickness distribution and design system of printed circuit board and manufacturing processes Aug. 9, 2005
6911136 Method for regulating the electrical power applied to a substrate during an immersion process Jun. 28, 2005
6899805 Automated chemical management system executing improved electrolyte analysis method May. 31, 2005

1 2 3

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