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Class Information
Number: 205/80
Name: Electrolysis: processes, compositions used therein, and methods of preparing the compositions > Electrolytic coating (process, composition and method of preparing composition)
Description: Process directed to the formation or deposition by an electrolytic action of a permanent coating material or materials upon a base, electrolyte compositions therefor and methods of making said electrolyte compositions.

Sub-classes under this class:

Class Number Class Name Patents
205/148 Agitating or moving electrolyte during coating 224
205/147 Applying current to substrate without mechanical contact (e.g., liquid contact, bipolar electrode, etc.) 56
205/158 Coating a substrate predominantly comprised of nonconductive material to which conductive material or material which can be converted into conductive material has been added (e.g., nonconductive polymer substrate containing carbon or copper oxide particles, etc.) 58
205/109 Coating contains embedded solid material (e.g., particles, etc.) 248
205/95 Coating has specified thickness variation 44
205/111 Coating is dendritic or nodular 91
205/112 Coating is discontinuous single metal or alloy layer (e.g., islands, porous layer, etc.) 75
205/137 Coating moving substrate 156
205/159 Coating predominantly nonmetal substrate 187
205/157 Coating predominantly semiconductor substrate (e.g., silicon, compound semiconductor, etc.) 335
205/149 Coating predominantly single metal or alloy substrate of specified shape 148
205/118 Coating selected area 474
205/93 Contacting coating as it forms with solid member or material other than electrode 55
205/96 Controlling current distribution within bath 211
205/238 Depositing predominantly alloy coating 136
205/261 Depositing predominantly single metal coating 106
205/105 Depositing predominantly single metal or alloy coating on nonmetal using specified waveform other than pure dc or 60 hz sine wave ac (e.g., single metal or alloy coating within or above pores of anodic oxide layer, etc.) 69
205/102 Depositing predominantly single metal or alloy coating on single metal or alloy using specified waveform other than pure dc 83
205/85 Displacement or replacement coating 57
205/86 Employing internal battery action during coating 20
205/170 Forming multiple superposed electrolytic coatings 250
205/191 Forming nonelectrolytic coating after depositing predominantly single metal or alloy electrolytic coating 114
205/198 Forming nonelectrolytic coating after forming nonmetal electrolytic coating 56
205/183 Forming nonelectrolytic coating before depositing predominantly single metal or alloy electrolytic coating 185
205/188 Forming nonelectrolytic coating before forming nonmetal electrolytic coating 133
205/106 Forming nonmetal coating using specified waveform other than pure dc or 60 hz sine wave ac (e.g., anodic oxide coating, etc.) 81
205/316 Forming nonmetal coating 172
205/81 Involving measuring, analyzing, or testing 150
205/116 Mirror or reflector produced 17
205/115 Repairing 43
205/87 Simultaneous deplating and plating 46
205/220 Treating electrolytic or nonelectrolytic coating after it is formed 201
205/98 Treating process fluid by means other than agitation or heating or cooling 65
205/205 Treating substrate prior to coating 192
205/114 Uniting two separate solid materials 61
205/117 Utilizing brush or absorbent applicator 58
205/91 Utilizing electromagnetic wave energy during coating (e.g., visible light, etc.) 68
205/230 Utilizing fused bath 65
205/89 Utilizing magnet or magnetic field during coating 25
205/94 Utilizing mist prevention 11
205/234 Utilizing nonaqueous bath 63
205/88 Utilizing subatmospheric or superatmospheric pressure during coating 35

Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8679317 Copper electroplating bath Mar. 25, 2014
8668817 System and method of plating metal alloys by using galvanic technology Mar. 11, 2014
8601691 Component and methods of fabricating a coated component using multiple types of fillers Dec. 10, 2013
8594417 Systems and methods for inspecting anodes and smelting management relating to the same Nov. 26, 2013
8562808 Polymer thick film silver electrode composition for use as a plating link Oct. 22, 2013
8562847 Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter Oct. 22, 2013
8512542 Method for the electrochemical coating of a substrate by brush plating and device for carrying out said method Aug. 20, 2013
8496799 Systems and methods for in situ annealing of electro- and electroless platings during deposition Jul. 30, 2013
8377513 Method for coating a cooling element Feb. 19, 2013
8361337 Method of producing nanopatterned templates Jan. 29, 2013
8317987 Non-permeable substrate carrier for electroplating Nov. 27, 2012
8293093 Process for cooper electrowinning and electrorefining Oct. 23, 2012
8262809 Composition for metal surface treatment, metal surface treatment method and metal material Sep. 11, 2012
8262871 Plating method and apparatus with multiple internally irrigated chambers Sep. 11, 2012
8262891 Leveler compounds Sep. 11, 2012
8252157 Electrolytic copper plating method, phosphorous copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anode Aug. 28, 2012
8227685 Graphene sheet comprising an intercalation compound and process of preparing the same Jul. 24, 2012
8221600 Sealed substrate carrier for electroplating Jul. 17, 2012
8221601 Maintainable substrate carrier for electroplating Jul. 17, 2012
8198531 Solar cell having tree-like nanostructure and method for preparing the same Jun. 12, 2012
8163641 System for modifying small structures Apr. 24, 2012
8110084 Electrode characterized by highly adhering superficial catalytic layer Feb. 7, 2012
8092716 Process for the preparation of a catalytic specie using electro-deposition Jan. 10, 2012
8070929 Catalyst particles on a tip Dec. 6, 2011
8043519 Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter Oct. 25, 2011
8002960 Method for electrolytic engineering of nano-particulate layers Aug. 23, 2011
7938950 Surface-treated metal material, surface-treating method, resin-coated metal material, metal can and can lid May. 10, 2011
7897437 Thermal interconnect systems methods of production and uses thereof Mar. 1, 2011
7883614 Method of manufacturing electronic part and electronic part Feb. 8, 2011
7824533 Tempered plated wire and methods of manufacture Nov. 2, 2010
7820025 Methods of synthesizing an oxidant and applications thereof Oct. 26, 2010
7811918 Electric current induced liquid metal flow and metallic conformal coating of conductive templates Oct. 12, 2010
7765661 Method for manufacturing ceramic electronic component and planting bath Aug. 3, 2010
7749582 Surface-treated metallic material, method of surface treating therefor and resin coated metallic material, metal can and can lid Jul. 6, 2010
7670473 Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same Mar. 2, 2010
7666523 Electrode surface coating and method for manufacturing the same Feb. 23, 2010
7560016 Selectively accelerated plating of metal features Jul. 14, 2009
7509961 Cigarettes and cigarette components containing nanostructured fibril materials Mar. 31, 2009
7449099 Selectively accelerated plating of metal features Nov. 11, 2008
7448121 Metal hand tool and method for manufacturing the same Nov. 11, 2008
7422629 Nonsludging zinc phosphating composition and process Sep. 9, 2008
7407689 Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys Aug. 5, 2008
7404885 Plating method and electronic device Jul. 29, 2008
7405155 Circuit package and method of plating the same Jul. 29, 2008
7399423 Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter Jul. 15, 2008
7385290 Electrochemical reaction cell for a combined barrier layer and seed layer Jun. 10, 2008
7374651 Electrolytic copper plating method, phosphorus-containing anode for electrolytic copper plating, and semiconductor wafer plated using them and having few particles adhering to it May. 20, 2008
7323094 Process for depositing a layer of material on a substrate Jan. 29, 2008
7323095 Integrated multi-step gap fill and all feature planarization for conductive materials Jan. 29, 2008
7316783 Method of wiring formation and method for manufacturing electronic components Jan. 8, 2008

1 2 3

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