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Class Information
Number: 205/80
Name: Electrolysis: processes, compositions used therein, and methods of preparing the compositions > Electrolytic coating (process, composition and method of preparing composition)
Description: Process directed to the formation or deposition by an electrolytic action of a permanent coating material or materials upon a base, electrolyte compositions therefor and methods of making said electrolyte compositions.
Sub-classes under this class:
| Class Number |
Class Name |
Patents |
| 205/148 |
Agitating or moving electrolyte during coating |
197 |
| 205/147 |
Applying current to substrate without mechanical contact (e.g., liquid contact, bipolar electrode, etc.) |
43 |
| 205/158 |
Coating a substrate predominantly comprised of nonconductive material to which conductive material or material which can be converted into conductive material has been added (e.g., nonconductive polymer substrate containing carbon or copper oxide particles, etc.) |
53 |
| 205/109 |
Coating contains embedded solid material (e.g., particles, etc.) |
218 |
| 205/95 |
Coating has specified thickness variation |
36 |
| 205/111 |
Coating is dendritic or nodular |
85 |
| 205/112 |
Coating is discontinuous single metal or alloy layer (e.g., islands, porous layer, etc.) |
67 |
| 205/137 |
Coating moving substrate |
126 |
| 205/159 |
Coating predominantly nonmetal substrate |
171 |
| 205/157 |
Coating predominantly semiconductor substrate (e.g., silicon, compound semiconductor, etc.) |
283 |
| 205/149 |
Coating predominantly single metal or alloy substrate of specified shape |
131 |
| 205/118 |
Coating selected area |
358 |
| 205/93 |
Contacting coating as it forms with solid member or material other than electrode |
46 |
| 205/96 |
Controlling current distribution within bath |
161 |
| 205/238 |
Depositing predominantly alloy coating |
102 |
| 205/261 |
Depositing predominantly single metal coating |
73 |
| 205/105 |
Depositing predominantly single metal or alloy coating on nonmetal using specified waveform other than pure dc or 60 hz sine wave ac (e.g., single metal or alloy coating within or above pores of anodic oxide layer, etc.) |
59 |
| 205/102 |
Depositing predominantly single metal or alloy coating on single metal or alloy using specified waveform other than pure dc |
69 |
| 205/85 |
Displacement or replacement coating |
52 |
| 205/86 |
Employing internal battery action during coating |
18 |
| 205/170 |
Forming multiple superposed electrolytic coatings |
199 |
| 205/191 |
Forming nonelectrolytic coating after depositing predominantly single metal or alloy electrolytic coating |
100 |
| 205/198 |
Forming nonelectrolytic coating after forming nonmetal electrolytic coating |
47 |
| 205/183 |
Forming nonelectrolytic coating before depositing predominantly single metal or alloy electrolytic coating |
168 |
| 205/188 |
Forming nonelectrolytic coating before forming nonmetal electrolytic coating |
117 |
| 205/106 |
Forming nonmetal coating using specified waveform other than pure dc or 60 hz sine wave ac (e.g., anodic oxide coating, etc.) |
67 |
| 205/316 |
Forming nonmetal coating |
150 |
| 205/81 |
Involving measuring, analyzing, or testing |
126 |
| 205/116 |
Mirror or reflector produced |
15 |
| 205/115 |
Repairing |
37 |
| 205/87 |
Simultaneous deplating and plating |
41 |
| 205/220 |
Treating electrolytic or nonelectrolytic coating after it is formed |
172 |
| 205/98 |
Treating process fluid by means other than agitation or heating or cooling |
53 |
| 205/205 |
Treating substrate prior to coating |
156 |
| 205/114 |
Uniting two separate solid materials |
60 |
| 205/117 |
Utilizing brush or absorbent applicator |
51 |
| 205/91 |
Utilizing electromagnetic wave energy during coating (e.g., visible light, etc.) |
61 |
| 205/230 |
Utilizing fused bath |
63 |
| 205/89 |
Utilizing magnet or magnetic field during coating |
21 |
| 205/94 |
Utilizing mist prevention |
9 |
| 205/234 |
Utilizing nonaqueous bath |
59 |
| 205/88 |
Utilizing subatmospheric or superatmospheric pressure during coating |
30 |
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7448121 |
Metal hand tool and method for manufacturing the same |
Nov. 11, 2008 |
| 7449099 |
Selectively accelerated plating of metal features |
Nov. 11, 2008 |
| 7422629 |
Nonsludging zinc phosphating composition and process |
Sep. 9, 2008 |
| 7407689 |
Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys |
Aug. 5, 2008 |
| 7405155 |
Circuit package and method of plating the same |
Jul. 29, 2008 |
| 7404885 |
Plating method and electronic device |
Jul. 29, 2008 |
| 7399423 |
Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter |
Jul. 15, 2008 |
| 7385290 |
Electrochemical reaction cell for a combined barrier layer and seed layer |
Jun. 10, 2008 |
| 7374651 |
Electrolytic copper plating method, phosphorus-containing anode for electrolytic copper plating, and semiconductor wafer plated using them and having few particles adhering to it |
May. 20, 2008 |
| 7323094 |
Process for depositing a layer of material on a substrate |
Jan. 29, 2008 |
| 7323095 |
Integrated multi-step gap fill and all feature planarization for conductive materials |
Jan. 29, 2008 |
| 7316783 |
Method of wiring formation and method for manufacturing electronic components |
Jan. 8, 2008 |
| 7267731 |
Method and system for fabricating three-dimensional microstructure |
Sep. 11, 2007 |
| 7252750 |
Dual contact ring and method for metal ECP process |
Aug. 7, 2007 |
| 7241372 |
Plating apparatus and plating liquid removing method |
Jul. 10, 2007 |
| 7241396 |
Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter |
Jul. 10, 2007 |
| 7223328 |
Sensors for reducing gas molecules |
May. 29, 2007 |
| 7189317 |
Semiconductor manufacturing system for forming metallization layer |
Mar. 13, 2007 |
| 7097776 |
Method of fabricating microneedles |
Aug. 29, 2006 |
| 7097410 |
Methods and apparatus for controlled-angle wafer positioning |
Aug. 29, 2006 |
| 7090939 |
Forming a layer on a flow plate of a fuel cell stack |
Aug. 15, 2006 |
| 6969672 |
Method and apparatus for controlling a thickness of a conductive layer in a semiconductor manufacturing operation |
Nov. 29, 2005 |
| 6949177 |
System and method for processing semiconductor wafers using different wafer processes |
Sep. 27, 2005 |
| 6916412 |
Adaptable electrochemical processing chamber |
Jul. 12, 2005 |
| 6887364 |
Method for manufacturing a multiple walled tube |
May. 3, 2005 |
| 6855239 |
Plating method and apparatus using contactless electrode |
Feb. 15, 2005 |
| 6808641 |
Method of wiring formation and method for manufacturing electronic components |
Oct. 26, 2004 |
| 6793961 |
Enhancement of magnetization switching speed in soft ferromagnetic films through control of edge stress anisotropy |
Sep. 21, 2004 |
| 6777831 |
Electrochemical processing power device |
Aug. 17, 2004 |
| 6773568 |
Metal alloy compositions and plating methods related thereto |
Aug. 10, 2004 |
| 6746579 |
Electrolytic gold plating method and apparatus therefor |
Jun. 8, 2004 |
| 6733649 |
Electrochemical processing method |
May. 11, 2004 |
| 6726823 |
Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
Apr. 27, 2004 |
| 6720084 |
Process for producing heat-resistant resin film having metallic thin film, process for producing endless belt, endless belt, and apparatus for forming image |
Apr. 13, 2004 |
| 6706418 |
Metal alloy compositions and plating methods related thereto |
Mar. 16, 2004 |
| 6695961 |
Carrier serving to supply current to workpieces or counter-electrodes that are to be treated electrolytically and a method for electrolytically treating workpieces |
Feb. 24, 2004 |
| 6663762 |
Plating system workpiece support having workpiece engaging electrode |
Dec. 16, 2003 |
| 6652726 |
Method for reducing wafer edge defects in an electrodeposition process |
Nov. 25, 2003 |
| 6610182 |
Cup-type plating apparatus and method for plating wafers |
Aug. 26, 2003 |
| 6607649 |
Process of preventing stray currents in peripheral parts of a plant in an electrolysis |
Aug. 19, 2003 |
| 6592964 |
Nozzle plate assembly of micro-injecting device and method for manufacturing the same |
Jul. 15, 2003 |
| 6582578 |
Method and associated apparatus for tilting a substrate upon entry for metal deposition |
Jun. 24, 2003 |
| 6483036 |
Arrangement for spacing electrowinning electrodes |
Nov. 19, 2002 |
| 6475629 |
Adhesive film formed of a siloxane-modified polyamideimide resin composition, adhesive sheet and semiconductor device |
Nov. 5, 2002 |
| 6475644 |
Radioactive coating solutions methods, and substrates |
Nov. 5, 2002 |
| 6447954 |
High energy, light weight, lead-acid storage battery |
Sep. 10, 2002 |
| 6365025 |
Method for depositing and/or removing material on a substrate |
Apr. 2, 2002 |
| 6361674 |
Powered lift for ECP chamber |
Mar. 26, 2002 |
| 6358392 |
Bismuth thin films structure and method of construction |
Mar. 19, 2002 |
| 6277253 |
External coating of tungsten or tantalum or other refractory metal on IMP coils |
Aug. 21, 2001 |
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