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Class Information
Number: 205/253
Name: Electrolysis: processes, compositions used therein, and methods of preparing the compositions > Electrolytic coating (process, composition and method of preparing composition) > Depositing predominantly alloy coating > Tin, lead, or germanium is predominant constituent > Utilizing organic compound-containing bath
Description: Subject matter wherein the electrolyte bath contains an organic compound as an essential ingredient (e.g., peptone, glue, etc.).
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7357853 |
Electroplating composite substrates |
Apr. 15, 2008 |
| 7309411 |
Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys |
Dec. 18, 2007 |
| 7279086 |
Electroplating solution for alloys of gold with tin |
Oct. 9, 2007 |
| 7273540 |
Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film |
Sep. 25, 2007 |
| 7195702 |
Tin alloy electroplating system |
Mar. 27, 2007 |
| RE39476 |
Tin electrolyte |
Jan. 23, 2007 |
| 7122108 |
Tin-silver electrolyte |
Oct. 17, 2006 |
| 7105082 |
Composition and method for electrodeposition of metal on a work piece |
Sep. 12, 2006 |
| 7087315 |
Method for forming plating film |
Aug. 8, 2006 |
| 7013564 |
Method of producing an electronic device having a PB free solder connection |
Mar. 21, 2006 |
| 6998036 |
Electrolyte and method for depositing tin-silver alloy layers |
Feb. 14, 2006 |
| 6923899 |
Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions |
Aug. 2, 2005 |
| 6911138 |
Method for plating electrodes of ceramic chip electronic components |
Jun. 28, 2005 |
| 6821681 |
Electrochemical cells and an interchangeable electrolyte therefore |
Nov. 23, 2004 |
| 6811672 |
Method for forming plating film and electronic component having plating film formed theron by same method |
Nov. 2, 2004 |
| 6808614 |
Electroplating solution for high speed plating of tin-copper solder |
Oct. 26, 2004 |
| 6797142 |
Tin plating |
Sep. 28, 2004 |
| 6790333 |
Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied |
Sep. 14, 2004 |
| 6773568 |
Metal alloy compositions and plating methods related thereto |
Aug. 10, 2004 |
| 6770185 |
Aqueous solution for electrodepositing tin-zinc alloys |
Aug. 3, 2004 |
| 6736954 |
Plating bath and method for depositing a metal layer on a substrate |
May. 18, 2004 |
| 6730209 |
Solder electroplating bath including brighteners having reduced volatility |
May. 4, 2004 |
| 6726827 |
Electroplating solution for high speed plating of tin-bismuth solder |
Apr. 27, 2004 |
| 6706418 |
Metal alloy compositions and plating methods related thereto |
Mar. 16, 2004 |
| 6669834 |
Method for high deposition rate solder electroplating on a microelectronic workpiece |
Dec. 30, 2003 |
| 6607653 |
Plating bath and process for depositing alloy containing tin and copper |
Aug. 19, 2003 |
| 6582582 |
Electroplating composition and process |
Jun. 24, 2003 |
| 6544398 |
Non-cyanide-type gold-tin alloy plating bath |
Apr. 8, 2003 |
| 6508927 |
Tin-copper alloy electroplating bath |
Jan. 21, 2003 |
| 6458264 |
Sn-Cu alloy plating bath |
Oct. 1, 2002 |
| 6436269 |
Plating bath and method for electroplating tin-zinc alloys |
Aug. 20, 2002 |
| 6322686 |
Tin electrolyte |
Nov. 27, 2001 |
| 6267863 |
Electroplating solution for electroplating lead and lead/tin alloys |
Jul. 31, 2001 |
| 6210556 |
Electrolyte and tin-silver electroplating process |
Apr. 3, 2001 |
| 6183545 |
Aqueous solutions for obtaining metals by reductive deposition |
Feb. 6, 2001 |
| 6176996 |
Tin alloy plating compositions |
Jan. 23, 2001 |
| 6103089 |
Multilayer material for sliding elements and process and means for the production thereof |
Aug. 15, 2000 |
| 6103088 |
Process for preparing bismuth compounds |
Aug. 15, 2000 |
| 6099713 |
Tin-silver alloy electroplating bath and tin-silver alloy electroplating process |
Aug. 8, 2000 |
| 6086742 |
Method of producing layered material for sliding bearings and an electroplating bath for carrying out this method |
Jul. 11, 2000 |
| 6022467 |
Electrolytic tin plating process with reduced sludge production |
Feb. 8, 2000 |
| 5951841 |
Electroplating baths salts of aromatic hydroxy compounds and their use as brighteners |
Sep. 14, 1999 |
| 5902472 |
Aqueous solution for forming metal complexes, tin-silver alloy plating bath, and process for producing plated object using the plating bath |
May. 11, 1999 |
| 5871631 |
Acidic tin-plating bath and additive therefor |
Feb. 16, 1999 |
| 5814202 |
Electrolytic tin plating process with reduced sludge production |
Sep. 29, 1998 |
| 5783059 |
Electrodeposition bath |
Jul. 21, 1998 |
| 5759381 |
Sn-Bi alloy-plating bath and method for forming plated Sn-Bi alloy film |
Jun. 2, 1998 |
| 5698087 |
Plating bath and method for electroplating tin and/or lead |
Dec. 16, 1997 |
| 5674374 |
Sn-Bi alloy-plating bath and plating method using the same |
Oct. 7, 1997 |
| 5651873 |
Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surface |
Jul. 29, 1997 |
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