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Class Information
Number: 205/239
Name: Electrolysis: processes, compositions used therein, and methods of preparing the compositions > Electrolytic coating (process, composition and method of preparing composition) > Depositing predominantly alloy coating > Copper-containing alloy
Description: Subject matter wherein the alloy contains metallic copper (i.e., copper in the free uncombined state) as one of the essential constituents.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7510639 |
Leveler compounds |
Mar. 31, 2009 |
| 7297868 |
Preparation of CIGS-based solar cells using a buffered electrodeposition bath |
Nov. 20, 2007 |
| 7273539 |
Method for regeneration of an electrolysis bath for the production of a compound I-III-VI.sub.2 in thin layers |
Sep. 25, 2007 |
| 7217464 |
Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resista |
May. 15, 2007 |
| 7105082 |
Composition and method for electrodeposition of metal on a work piece |
Sep. 12, 2006 |
| 7087315 |
Method for forming plating film |
Aug. 8, 2006 |
| 7052781 |
Flexible copper foil structure and fabrication method thereof |
May. 30, 2006 |
| 7048840 |
Method for metal coating the surface of high temperature superconductors |
May. 23, 2006 |
| 6982030 |
Reduction of surface oxidation during electroplating |
Jan. 3, 2006 |
| 6858121 |
Method and apparatus for filling low aspect ratio cavities with conductive material at high rate |
Feb. 22, 2005 |
| 6852210 |
Plating method and plating bath precursor used therefor |
Feb. 8, 2005 |
| 6783654 |
Electrolytic plating method and device for a wiring board |
Aug. 31, 2004 |
| 6777108 |
Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil |
Aug. 17, 2004 |
| 6740221 |
Method of forming copper interconnects |
May. 25, 2004 |
| 6736954 |
Plating bath and method for depositing a metal layer on a substrate |
May. 18, 2004 |
| 6562220 |
Metal alloy sulfate electroplating baths |
May. 13, 2003 |
| 6537683 |
Stratified composite material for sliding elements and method for the production thereof |
Mar. 25, 2003 |
| 6534116 |
Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
Mar. 18, 2003 |
| 6497806 |
Method of producing a roughening-treated copper foil |
Dec. 24, 2002 |
| 6409906 |
Electroplating solution for plating antimony and antimony alloy coatings |
Jun. 25, 2002 |
| 6379487 |
Component of printed circuit board |
Apr. 30, 2002 |
| 6344123 |
Method and apparatus for electroplating alloy films |
Feb. 5, 2002 |
| 6344125 |
Pattern-sensitive electrolytic metal plating |
Feb. 5, 2002 |
| 6342308 |
Copper foil bonding treatment with improved bond strength and resistance to undercutting |
Jan. 29, 2002 |
| 6319387 |
Copper alloy electroplating bath for microelectronic applications |
Nov. 20, 2001 |
| 6251253 |
Metal alloy sulfate electroplating baths |
Jun. 26, 2001 |
| 6248228 |
Metal alloy halide electroplating baths |
Jun. 19, 2001 |
| 6183545 |
Aqueous solutions for obtaining metals by reductive deposition |
Feb. 6, 2001 |
| 6179985 |
Metal alloy fluoroborate electroplating baths |
Jan. 30, 2001 |
| 6071570 |
Electrodes of improved service life |
Jun. 6, 2000 |
| 6054037 |
Halogen additives for alkaline copper use for plating zinc die castings |
Apr. 25, 2000 |
| 5895562 |
Gas shielding during plating |
Apr. 20, 1999 |
| 5804054 |
Preparation of copper indium gallium diselenide films for solar cells |
Sep. 8, 1998 |
| 5730854 |
Alkoxylated dimercaptans as copper additives and de-polarizing additives |
Mar. 24, 1998 |
| 5730852 |
Preparation of cuxinygazsen (X=0-2, Y=0-2, Z=0-2, N=0-3) precursor films by electrodeposition for fabricating high efficiency solar cells |
Mar. 24, 1998 |
| 5695627 |
Process for producing copper-indium-sulfur-selenium thin film and process for producing copper-indium-sulfur-selenium chalcopyrite crystal |
Dec. 9, 1997 |
| RE35513 |
Cyanide-free plating solutions for monovalent metals |
May. 20, 1997 |
| 5582927 |
High magnetic moment materials and process for fabrication of thin film heads |
Dec. 10, 1996 |
| 5560812 |
Method for producing a metal film resistor |
Oct. 1, 1996 |
| 5407556 |
Process of producing metallic foil by electrolysis |
Apr. 18, 1995 |
| 5385661 |
Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition |
Jan. 31, 1995 |
| 5366814 |
Copper foil for printed circuits and process for producing the same |
Nov. 22, 1994 |
| 5277789 |
Metal, metal alloy, and metal oxide formation by electrodeposition of polymetalllic complexes |
Jan. 11, 1994 |
| 5275714 |
Method of producing an absorber layer for solar cells with the aid of electrodeposition |
Jan. 4, 1994 |
| 5232575 |
Polymeric leveling additive for acid electroplating baths |
Aug. 3, 1993 |
| 5118394 |
Electroplating bath containing citric acid or citrate for tin or tin alloy plating |
Jun. 2, 1992 |
| 5019222 |
Treatment of copper foil for printed circuits |
May. 28, 1991 |
| 5004525 |
Copper electroplating composition |
Apr. 2, 1991 |
| 4980035 |
Bath for electrolytic deposition of a gold-copper-zinc alloy |
Dec. 25, 1990 |
| 4916098 |
Process and apparatus for manufacturing an electrocatalytic electrode |
Apr. 10, 1990 |
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