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Class Information
Number: 205/187
Name: Electrolysis: processes, compositions used therein, and methods of preparing the compositions > Electrolytic coating (process, composition and method of preparing composition) > Forming nonelectrolytic coating before depositing predominantly single metal or alloy electrolytic coating > Nonelectrolytic coating or coatings all contain single metal or alloy > Nonelectrolytic coating by plating from bath containing metal ions and reducing agent (e.g., electroless plating, etc.)
Description: Subject matter wherein a nonelectrolytic coating is formed by plating from a bath containing metal ions and a reducing agent.

Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8568899 Metal covered polyimide composite, process for producing the composite, and process for producing electronic circuit board Oct. 29, 2013
8354014 Palladium complex and catalyst-imparting treatment solution using the same Jan. 15, 2013
8202576 Method of forming metal film Jun. 19, 2012
8197659 Plating apparatus, plating method and multilayer printed circuit board Jun. 12, 2012
8173220 Method of producing metal plated material May. 8, 2012
8152985 Method of chrome plating magnesium and magnesium alloys Apr. 10, 2012
8147671 Electroplating method and electroplated product Apr. 3, 2012
8118989 Methods of bonding pure rhenium to a substrate Feb. 21, 2012
8052858 Pretreatment method for electroless plating material and method for producing member having plated coating Nov. 8, 2011
7976692 Metallization process for making fuser members Jul. 12, 2011
7943199 Method of producing metal plated material, metal plated material, method of producing metal pattern material, and metal pattern material May. 17, 2011
7794578 Method for preparing a circuit board material having a conductive base and a resistance layer Sep. 14, 2010
7645370 Plating resin molded article and process for producing the same Jan. 12, 2010
7449100 Method for forming electroplating film on surfaces of articles Nov. 11, 2008
7405157 Methods for the electrochemical deposition of copper onto a barrier layer of a work piece Jul. 29, 2008
7384532 Platable coating and plating process Jun. 10, 2008
7297451 Black matrix, method for the preparation thereof, flat display device and electromagnetic interference filter employing the same Nov. 20, 2007
7255980 Black matrix, method for preparing the same, and flat panel display and electromagnetic interference filter using the same Aug. 14, 2007
7255782 Selective catalytic activation of non-conductive substrates Aug. 14, 2007
7175920 Copper foil for high-density ultra-fine printed wiring board Feb. 13, 2007
7063779 Method for manufacturing metal-coated optical fiber Jun. 20, 2006
6951604 Production method for flexible printed board Oct. 4, 2005
6946065 Process for electroplating metal into microscopic recessed features Sep. 20, 2005
6875519 Two-layer copper polyimide substrate Apr. 5, 2005
6827834 Non-cyanide copper plating process for zinc and zinc alloys Dec. 7, 2004
6824666 Electroless deposition method over sub-micron apertures Nov. 30, 2004
6821324 Cobalt tungsten phosphorus electroless deposition process and materials Nov. 23, 2004
6805915 Electroless copper plating solution, electroless copper plating process and production process of circuit board Oct. 19, 2004
6793796 Electroplating process for avoiding defects in metal features of integrated circuit devices Sep. 21, 2004
6740222 Method of manufacturing a printed wiring board having a discontinuous plating layer May. 25, 2004
6740425 Method for manufacturing copper-resin composite material May. 25, 2004
6709803 Process for producing printed wiring board Mar. 23, 2004
6689268 Copper foil composite including a release layer Feb. 10, 2004
6673227 Process for producing three-dimensional, selectively metallized parts Jan. 6, 2004
6632342 Methods of fabricating a microstructure array Oct. 14, 2003
6627118 Ni alloy particles and method for producing same, and anisotropic conductive film Sep. 30, 2003
6569491 Platable dielectric materials for microvia technology May. 27, 2003
6562715 Barrier layer structure for copper metallization and method of forming the structure May. 13, 2003
6533915 Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil Mar. 18, 2003
6475644 Radioactive coating solutions methods, and substrates Nov. 5, 2002
6468672 Decorative chrome electroplate on plastics Oct. 22, 2002
6395164 Copper seed layer repair technique using electroless touch-up May. 28, 2002
6391181 Articles having a colored metallic coating and process for their manufacture May. 21, 2002
6387305 Forming mold cavities May. 14, 2002
6370768 Circuit board, a method for manufacturing same, and a method of electroless plating Apr. 16, 2002
6365030 Method of manufacturing R-Fe-B bond magnets of high corrosion resistance Apr. 2, 2002
6336962 Method and solution for producing gold coating Jan. 8, 2002
6331239 Method of electroplating non-conductive plastic molded products Dec. 18, 2001
6258415 Iron-plated aluminum alloy parts and method for planting same Jul. 10, 2001
6254758 Method of forming conductor pattern on wiring board Jul. 3, 2001

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