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Class Information
Number: 205/167
Name: Electrolysis: processes, compositions used therein, and methods of preparing the compositions > Electrolytic coating (process, composition and method of preparing composition) > Coating predominantly nonmetal substrate > Synthetic resin substrate > Conductive material applied to substrate by painting, spraying, or immersion > Conductive material applied to substrate by plating from bath containing metal ions and reducing agent (e.g., electroless plating, etc.)
Description: Subject matter wherein conductive material is applied to the substrate by plating from a bath containing metal ions and a reducing agent before the substrate is electrolytically coated.










Sub-classes under this class:

Class Number Class Name Patents
205/169 Conductive material is copper or nickel 67
205/168 Resin contains etchable filler 15


Patents under this class:
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Patent Number Title Of Patent Date Issued
8519017 Resin composition containing catalyst precursor for electroless plating in forming electro-magnetic shielding layer, method of forming metallic pattern using the same, and metallic pattern for Aug. 27, 2013
8491772 Redox method of forming a coaxial probe structure of elongated electrical conductors projecting from a support structure Jul. 23, 2013
8354014 Palladium complex and catalyst-imparting treatment solution using the same Jan. 15, 2013
8182594 Electroless nickel plating liquid May. 22, 2012
8052858 Pretreatment method for electroless plating material and method for producing member having plated coating Nov. 8, 2011
7964082 Method for electrophoretic coating Jun. 21, 2011
7883837 Transparent electrically conductive film and process for producing the same Feb. 8, 2011
7794578 Method for preparing a circuit board material having a conductive base and a resistance layer Sep. 14, 2010
7754062 Method of pretreatment of material to be electrolessly plated Jul. 13, 2010
7682774 Resin composition comprising catalyst precursor for electroless plating to form electromagnetic wave shielding layer, methods for forming metal patterns using the resin composition and metal p Mar. 23, 2010
7645370 Plating resin molded article and process for producing the same Jan. 12, 2010
7544281 Uniform current distribution for ECP loading of wafers Jun. 9, 2009
7520054 Process of manufacturing high frequency device packages Apr. 21, 2009
7384532 Platable coating and plating process Jun. 10, 2008
7305761 Method for manufacturing wiring substrate Dec. 11, 2007
6878260 Process for forming a high-quality interface between a plated and a non-plated area Apr. 12, 2005
6875471 Metallization of polymer parts for painting Apr. 5, 2005
6872294 Metallization of polymer composite parts for painting Mar. 29, 2005
6802985 Method for fabricating metal wirings Oct. 12, 2004
6689281 Shield-plated corrugated tube Feb. 10, 2004
6518182 Via-filling process Feb. 11, 2003
6468593 Plated non-conductive products and plating method for the same Oct. 22, 2002
6432291 Simultaneous electroplating of both sides of a dual-sided substrate Aug. 13, 2002
6426290 Electroplating both sides of a workpiece Jul. 30, 2002
6406607 Method for forming a nozzle plate having a non-wetting surface of uniform thickness and an orifice wall of tapered contour, and nozzle plate Jun. 18, 2002
6350365 Method of producing multilayer circuit board Feb. 26, 2002
6348142 Electroplating multi-trace circuit board substrates using single tie bar Feb. 19, 2002
6344309 Polysilane composition for forming a coating suitable for bearing a metal pattern, metal pattern forming method, wiring board preparing method Feb. 5, 2002
6331239 Method of electroplating non-conductive plastic molded products Dec. 18, 2001
6274241 Substrates seeded with precious metal salts, process for producing the same and their use Aug. 14, 2001
6258311 Forming mold cavities Jul. 10, 2001
6136513 Method of uniformly depositing seed and a conductor and the resultant printed circuit structure Oct. 24, 2000
6114051 Method for electroplating high-impact plastics Sep. 5, 2000
6110347 Method for the formation of an indium oxide film by electrodeposition process or electroless deposition process, a substrate provided with the indium oxide film for a semiconductor element, an Aug. 29, 2000
6106689 Process for forming zinc oxide film and processes for producing semiconductor device substrate and photo-electricity generating device using the film Aug. 22, 2000
6045680 Process for making thermally stable metal coated polymeric monofilament or yarn Apr. 4, 2000
5961808 Metal film resistor having fuse function and method for producing the same Oct. 5, 1999
5962073 Method for electroplating elastomer-modified polyphthalamide articles Oct. 5, 1999
5928727 Method for electroplating elastomer-modified polyphthalamide articles Jul. 27, 1999
5888372 Process for producing metal-coated films in web form Mar. 30, 1999
5846665 Method for electroplating high-impact plastics Dec. 8, 1998
5770032 Metallizing process Jun. 23, 1998
5759378 Process for preparing a non-conductive substrate for electroplating Jun. 2, 1998
5707503 Oxygen sensor element Jan. 13, 1998
5681442 Method of producing an organic device Oct. 28, 1997
5679234 Process of forming miniature pattern well controlled in thickness on semiconductor wafer through selective electroplating Oct. 21, 1997
5674373 Method for metallizing non-conductive substrates Oct. 7, 1997
5569493 Preparation of cured cyanate ester resins and composites for metal plating Oct. 29, 1996
5547559 Process for plating metals onto various substrates in an adherent fashion Aug. 20, 1996
5536386 Process for preparing a non-conductive substrate for electroplating Jul. 16, 1996

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