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Class Information
Number: 205/125
Name: Electrolysis: processes, compositions used therein, and methods of preparing the compositions > Electrolytic coating (process, composition and method of preparing composition) > Coating selected area > Specified product produced > Product is circuit board or printed circuit
Description: Subject matter wherein the specified product is a circuit board or printed circuit.










Sub-classes under this class:

Class Number Class Name Patents
205/126 Electroless coating from bath containing metal ions and reducing agent prior to electrolytic coating 169


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12

Patent Number Title Of Patent Date Issued
8679316 Aqueous, acid bath and method for the electrolytic deposition of copper Mar. 25, 2014
8621749 Non-deleterious technique for creating continuous conductive circuits Jan. 7, 2014
8591715 Electrodeposition composition and method for coating a semiconductor substrate using the said composition Nov. 26, 2013
8500984 Method for manufacturing printed-circuit board Aug. 6, 2013
8499446 Method of manufacturing multilayer printed wiring board Aug. 6, 2013
8461036 Multiple surface finishes for microelectronic package substrates Jun. 11, 2013
8440158 Pre-plating solutions for making printed circuit boards and methods for preparing the same May. 14, 2013
RE44165 System and method for providing secure identification solutions utilizing a radio frequency device in a non-metallized region connected to a metallized region Apr. 23, 2013
8388824 Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers Mar. 5, 2013
8377506 Method of manufacturing a substrate structure Feb. 19, 2013
8323878 Method of manufacturing optical waveguide laminated wiring board Dec. 4, 2012
8293846 Composition for forming layer to be plated, method of producing metal pattern material, metal pattern material Oct. 23, 2012
8273234 Method for manufacturing PCB and PCB manufactured using the same Sep. 25, 2012
8221600 Sealed substrate carrier for electroplating Jul. 17, 2012
8221601 Maintainable substrate carrier for electroplating Jul. 17, 2012
RE43488 System and method for providing secure identification solutions utilizing a radio frequency device in a non-metallized region connected to a metallized region Jun. 26, 2012
8196298 Method for manufacturing electroconductive material-filled throughhole substrate Jun. 12, 2012
8197659 Plating apparatus, plating method and multilayer printed circuit board Jun. 12, 2012
8186052 Method of producing substrate May. 29, 2012
8176628 Protruding post substrate package structure and method May. 15, 2012
8151456 Method of producing substrate Apr. 10, 2012
8146243 Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit board Apr. 3, 2012
8127979 Electrolytic depositon and via filling in coreless substrate processing Mar. 6, 2012
8128791 Control of electrolyte composition in a copper electroplating apparatus Mar. 6, 2012
8112884 Method for providing an efficient thermal transfer through a printed circuit board Feb. 14, 2012
8084191 Thermoelectric module and manufacturing method for same Dec. 27, 2011
8070932 Circuit board with identifiable information and method for fabricating the same Dec. 6, 2011
8070930 Methods for fabricating metal nanowires Dec. 6, 2011
8066862 Manufacturing method of wiring board Nov. 29, 2011
8065798 Method of manufacturing printed circuit board Nov. 29, 2011
8024856 Method for manufacturing printed circuit board Sep. 27, 2011
8007649 Hydrophilic treatment method and wiring pattern forming method Aug. 30, 2011
8002959 Manufacturing method of double-sided wiring glass substrate Aug. 23, 2011
8002962 Copper electrodeposition in microelectronics Aug. 23, 2011
7993510 Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board Aug. 9, 2011
7993509 Manufacturing method of double-sided wiring glass substrate Aug. 9, 2011
7976956 Laminated circuit board Jul. 12, 2011
7955485 Planar laminate substrate and method for fabricating organic laminate substrate PCBS, semiconductors, semiconductor wafers and semiconductor devices having miniaturized electrical pathways Jun. 7, 2011
7947161 Method of operating an electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes May. 24, 2011
7935621 Anti-fuse device structure and electroplating circuit structure and method May. 3, 2011
7918020 Method for manufacturing electroconductive material-filled throughhole substrate Apr. 5, 2011
7892412 Manufacturing process of embedded type flexible or rigid printed circuit board Feb. 22, 2011
7887693 Acid copper electroplating bath composition Feb. 15, 2011
7883614 Method of manufacturing electronic part and electronic part Feb. 8, 2011
7874066 Method of manufacturing a device-incorporated substrate Jan. 25, 2011
7870665 Method of manufacturing a conductor circuit, and a coil sheet and laminated coil Jan. 18, 2011
7854829 Method of plating and method of manufacturing a micro device Dec. 21, 2010
7850836 Method of electro-depositing a conductive material in at least one through-hole via of a semiconductor substrate Dec. 14, 2010
7828951 Wafer support apparatus for electroplating process and method for using the same Nov. 9, 2010
7807034 Manufacturing method of non-etched circuit board Oct. 5, 2010

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