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Class Information
Number: 205/102
Name: Electrolysis: processes, compositions used therein, and methods of preparing the compositions > Electrolytic coating (process, composition and method of preparing composition) > Depositing predominantly single metal or alloy coating on single metal or alloy using specified waveform other than pure dc
Description: Subject matter wherein a predominantly single metal or alloy coating is deposited on single metal or alloy utilizing an electric current which is not pure DC (e.g., stepped voltage, etc.).
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7438794 |
Method of copper electroplating to improve gapfill |
Oct. 21, 2008 |
| 7189647 |
Sequential station tool for wet processing of semiconductor wafers |
Mar. 13, 2007 |
| 7105082 |
Composition and method for electrodeposition of metal on a work piece |
Sep. 12, 2006 |
| 6974531 |
Method for electroplating on resistive substrates |
Dec. 13, 2005 |
| 6953522 |
Liquid treatment method using alternating electrical contacts |
Oct. 11, 2005 |
| 6946065 |
Process for electroplating metal into microscopic recessed features |
Sep. 20, 2005 |
| 6932897 |
Titanium-containing metals with adherent coatings and methods for producing same |
Aug. 23, 2005 |
| 6921551 |
Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
Jul. 26, 2005 |
| 6919011 |
Complex waveform electroplating |
Jul. 19, 2005 |
| 6913680 |
Method of application of electrical biasing to enhance metal deposition |
Jul. 5, 2005 |
| 6893550 |
Electroplating bath composition and method of using |
May. 17, 2005 |
| 6863794 |
Method and apparatus for forming metal layers |
Mar. 8, 2005 |
| 6835294 |
Electrolytic copper plating method |
Dec. 28, 2004 |
| 6827833 |
Electrodeposition of metals in high-aspect ratio cavities using modulated reverse electric fields |
Dec. 7, 2004 |
| 6824665 |
Seed layer deposition |
Nov. 30, 2004 |
| 6824668 |
Method for electroplating Ni-Fe-P alloys using sulfamate solution |
Nov. 30, 2004 |
| 6814847 |
Method and apparatus for electro-deposition of metal |
Nov. 9, 2004 |
| 6811675 |
Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
Nov. 2, 2004 |
| 6805786 |
Precious alloyed metal solder plating process |
Oct. 19, 2004 |
| 6799832 |
Alloy and orifice plate for an ink-jet pen using the same |
Oct. 5, 2004 |
| 6793796 |
Electroplating process for avoiding defects in metal features of integrated circuit devices |
Sep. 21, 2004 |
| 6767437 |
Electroplating apparatus and electroplating method |
Jul. 27, 2004 |
| 6755955 |
Catalytic converter and method for producing a catalytic converter |
Jun. 29, 2004 |
| 6746591 |
ECP gap fill by modulating the voltate on the seed layer to increase copper concentration inside feature |
Jun. 8, 2004 |
| 6746590 |
Ultrasonically-enhanced electroplating apparatus and methods |
Jun. 8, 2004 |
| 6740220 |
Electrocatalytic cathode device of palladium and iridium on a high density or porous carbon support and a method for making such a cathode |
May. 25, 2004 |
| 6664633 |
Alkaline copper plating |
Dec. 16, 2003 |
| 6652669 |
Method for producing an ultraphobic surface on an aluminum base |
Nov. 25, 2003 |
| 6641710 |
Metal plating method |
Nov. 4, 2003 |
| 6607650 |
Method of forming a plated layer to a predetermined thickness |
Aug. 19, 2003 |
| 6599411 |
Method of electroplating a nickel-iron alloy film with a graduated composition |
Jul. 29, 2003 |
| 6576110 |
Coated anode apparatus and associated method |
Jun. 10, 2003 |
| 6551483 |
Method for potential controlled electroplating of fine patterns on semiconductor wafers |
Apr. 22, 2003 |
| 6547944 |
Commercial plating of nanolaminates |
Apr. 15, 2003 |
| 6503382 |
Method of electrodepositing a porous film |
Jan. 7, 2003 |
| 6478944 |
Functional Sn-Bi alloy plating using a substitute material for Pb |
Nov. 12, 2002 |
| 6447666 |
Galvanic bath, method for producing structured hard chromium layers and use thereof |
Sep. 10, 2002 |
| 6440289 |
Method for improving seed layer electroplating for semiconductor |
Aug. 27, 2002 |
| 6365028 |
Method for producing hard protection coatings on articles made of aluminum alloys |
Apr. 2, 2002 |
| 6346182 |
Process of making bipolar electrodeposited catalysts and catalysts so made |
Feb. 12, 2002 |
| 6319385 |
Process for electrochemically applying a surface coating |
Nov. 20, 2001 |
| 6312579 |
Bearing having multilayer overlay and method of manufacture |
Nov. 6, 2001 |
| 6297157 |
Time ramped method for plating of high aspect ratio semiconductor vias and channels |
Oct. 2, 2001 |
| 6258239 |
Process for the manufacture of an electrode for a solid polymer fuel cell |
Jul. 10, 2001 |
| 6176994 |
Method and device for manufacturing a spark erosion electrode wire |
Jan. 23, 2001 |
| 6090260 |
Electroplating method |
Jul. 18, 2000 |
| 5958604 |
Electrolytic process for cleaning and coating electrically conducting surfaces and product thereof |
Sep. 28, 1999 |
| 5908542 |
Metal foil with improved bonding to substrates and method for making the foil |
Jun. 1, 1999 |
| 5871630 |
Preparation of copper-indium-gallium-diselenide precursor films by electrodeposition for fabricating high efficiency solar cells |
Feb. 16, 1999 |
| 5750017 |
Tin electroplating process |
May. 12, 1998 |
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