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Class Information
Number: 204/DIG.7
Name: Chemistry: electrical and wave energy > Current distribution within the bath

Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8623193 Method of electroplating using a high resistance ionic current source Jan. 7, 2014
8475636 Method and apparatus for electroplating Jul. 2, 2013
8475644 Method and apparatus for electroplating Jul. 2, 2013
8329006 Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating Dec. 11, 2012
8147660 Semiconductive counter electrode for electrolytic current distribution control Apr. 3, 2012
7967969 Method of electroplating using a high resistance ionic current source Jun. 28, 2011
7964081 Enhanced magnetic plating method Jun. 21, 2011
7935240 Electroplating apparatus and method based on an array of anodes May. 3, 2011
7635421 Electrolytic apparatus for use in oxide electrowinning method Dec. 22, 2009
7569124 Anodic oxidation apparatus Aug. 4, 2009
7560014 Method for airfoil electroplating Jul. 14, 2009
7252750 Dual contact ring and method for metal ECP process Aug. 7, 2007
7169283 Anodization device and anodization method Jan. 30, 2007
7160421 Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece Jan. 9, 2007
7045040 Process and system for eliminating gas bubbles during electrochemical processing May. 16, 2006
6974530 Method and system for controlling ion distribution during plating of a metal on a workpiece surface Dec. 13, 2005
6966976 Electroplating panel with plating thickness-compensation structures Nov. 22, 2005
6953522 Liquid treatment method using alternating electrical contacts Oct. 11, 2005
6881309 Diffuser with spiral opening pattern for electroplating reactor vessel Apr. 19, 2005
6827827 Metal plating apparatus and process Dec. 7, 2004
6811669 Methods and apparatus for improved current density and feature fill control in ECD reactors Nov. 2, 2004
6802946 Apparatus for controlling thickness uniformity of electroplated and electroetched layers Oct. 12, 2004
6767437 Electroplating apparatus and electroplating method Jul. 27, 2004
6755954 Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elements Jun. 29, 2004
6746578 Selective shield/material flow mechanism Jun. 8, 2004
6716331 Electrolysis method and apparatus Apr. 6, 2004
6695961 Carrier serving to supply current to workpieces or counter-electrodes that are to be treated electrolytically and a method for electrolytically treating workpieces Feb. 24, 2004
6669833 Process and apparatus for electroplating microscopic features uniformly across a large substrate Dec. 30, 2003
6660137 System for electrochemically processing a workpiece Dec. 9, 2003
6632333 Device for separating metal deposit from a cathode Oct. 14, 2003
6585865 Apparatus and method for selective electrolytic metallization/deposition utilizing a fluid head Jul. 1, 2003
6565729 Method for electrochemically depositing metal on a semiconductor workpiece May. 20, 2003
6554976 Electroplating apparatus Apr. 29, 2003
6551472 Electroforming apparatus Apr. 22, 2003
6544392 Apparatus for manufacturing pcb's Apr. 8, 2003
6500316 Apparatus for rotary cathode electroplating with wireless power transfer Dec. 31, 2002
6482300 Cup shaped plating apparatus with a disc shaped stirring device having an opening in the center thereof Nov. 19, 2002
6454926 Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas Sep. 24, 2002
6444101 Conductive biasing member for metal layering Sep. 3, 2002
6402909 Plating system with shielded secondary anode for semiconductor manufacturing Jun. 11, 2002
6402923 Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element Jun. 11, 2002
6391168 Plating apparatus utilizing an auxiliary electrode May. 21, 2002
6355147 Porous electrode apparatus for electrodeposition of detailed metal structures or microelectronic interconnections Mar. 12, 2002
6296753 Apparatus and method for plating wafers, substrates and other articles Oct. 2, 2001
6287443 Apparatus and method for electroplating wafers, substrates and other articles Sep. 11, 2001
6287434 Plating cell apparatus for x-ray mask fabrication Sep. 11, 2001
6277260 Apparatus and method for plating wafers, substrates and other articles Aug. 21, 2001
6274024 Apparatus and method for plating wafers, substrates and other articles Aug. 14, 2001
6274023 Apparatus and method for electroplating wafers, substrates and other articles Aug. 14, 2001
6274010 Electroplating apparatus Aug. 14, 2001

1 2 3 4

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