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Class Information
Number: 204/DIG.7
Name: Chemistry: electrical and wave energy > Current distribution within the bath
Description:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7569124 |
Anodic oxidation apparatus |
Aug. 4, 2009 |
| 7560014 |
Method for airfoil electroplating |
Jul. 14, 2009 |
| 7252750 |
Dual contact ring and method for metal ECP process |
Aug. 7, 2007 |
| 7169283 |
Anodization device and anodization method |
Jan. 30, 2007 |
| 7160421 |
Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
Jan. 9, 2007 |
| 7045040 |
Process and system for eliminating gas bubbles during electrochemical processing |
May. 16, 2006 |
| 6974530 |
Method and system for controlling ion distribution during plating of a metal on a workpiece surface |
Dec. 13, 2005 |
| 6966976 |
Electroplating panel with plating thickness-compensation structures |
Nov. 22, 2005 |
| 6953522 |
Liquid treatment method using alternating electrical contacts |
Oct. 11, 2005 |
| 6881309 |
Diffuser with spiral opening pattern for electroplating reactor vessel |
Apr. 19, 2005 |
| 6827827 |
Metal plating apparatus and process |
Dec. 7, 2004 |
| 6811669 |
Methods and apparatus for improved current density and feature fill control in ECD reactors |
Nov. 2, 2004 |
| 6802946 |
Apparatus for controlling thickness uniformity of electroplated and electroetched layers |
Oct. 12, 2004 |
| 6767437 |
Electroplating apparatus and electroplating method |
Jul. 27, 2004 |
| 6755954 |
Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elements |
Jun. 29, 2004 |
| 6746578 |
Selective shield/material flow mechanism |
Jun. 8, 2004 |
| 6716331 |
Electrolysis method and apparatus |
Apr. 6, 2004 |
| 6695961 |
Carrier serving to supply current to workpieces or counter-electrodes that are to be treated electrolytically and a method for electrolytically treating workpieces |
Feb. 24, 2004 |
| 6669833 |
Process and apparatus for electroplating microscopic features uniformly across a large substrate |
Dec. 30, 2003 |
| 6660137 |
System for electrochemically processing a workpiece |
Dec. 9, 2003 |
| 6632333 |
Device for separating metal deposit from a cathode |
Oct. 14, 2003 |
| 6585865 |
Apparatus and method for selective electrolytic metallization/deposition utilizing a fluid head |
Jul. 1, 2003 |
| 6565729 |
Method for electrochemically depositing metal on a semiconductor workpiece |
May. 20, 2003 |
| 6554976 |
Electroplating apparatus |
Apr. 29, 2003 |
| 6551472 |
Electroforming apparatus |
Apr. 22, 2003 |
| 6544392 |
Apparatus for manufacturing pcb's |
Apr. 8, 2003 |
| 6500316 |
Apparatus for rotary cathode electroplating with wireless power transfer |
Dec. 31, 2002 |
| 6482300 |
Cup shaped plating apparatus with a disc shaped stirring device having an opening in the center thereof |
Nov. 19, 2002 |
| 6454926 |
Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas |
Sep. 24, 2002 |
| 6444101 |
Conductive biasing member for metal layering |
Sep. 3, 2002 |
| 6402909 |
Plating system with shielded secondary anode for semiconductor manufacturing |
Jun. 11, 2002 |
| 6402923 |
Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element |
Jun. 11, 2002 |
| 6391168 |
Plating apparatus utilizing an auxiliary electrode |
May. 21, 2002 |
| 6355147 |
Porous electrode apparatus for electrodeposition of detailed metal structures or microelectronic interconnections |
Mar. 12, 2002 |
| 6296753 |
Apparatus and method for plating wafers, substrates and other articles |
Oct. 2, 2001 |
| 6287434 |
Plating cell apparatus for x-ray mask fabrication |
Sep. 11, 2001 |
| 6287443 |
Apparatus and method for electroplating wafers, substrates and other articles |
Sep. 11, 2001 |
| 6277260 |
Apparatus and method for plating wafers, substrates and other articles |
Aug. 21, 2001 |
| 6274010 |
Electroplating apparatus |
Aug. 14, 2001 |
| 6274024 |
Apparatus and method for plating wafers, substrates and other articles |
Aug. 14, 2001 |
| 6274023 |
Apparatus and method for electroplating wafers, substrates and other articles |
Aug. 14, 2001 |
| 6267860 |
Method and apparatus for electroplating |
Jul. 31, 2001 |
| 6254742 |
Diffuser with spiral opening pattern for an electroplating reactor vessel |
Jul. 3, 2001 |
| RE37050 |
Clamp for use with electroplating apparatus and method of using the same |
Feb. 13, 2001 |
| 6179983 |
Method and apparatus for treating surface including virtual anode |
Jan. 30, 2001 |
| 6174425 |
Process for depositing a layer of material over a substrate |
Jan. 16, 2001 |
| 6168691 |
Device for electrochemical treatment of elongate articles |
Jan. 2, 2001 |
| 6168693 |
Apparatus for controlling the uniformity of an electroplated workpiece |
Jan. 2, 2001 |
| 6139711 |
Hydrodynamically controlled hull cell and method of use |
Oct. 31, 2000 |
| 6132587 |
Uniform electroplating of wafers |
Oct. 17, 2000 |
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