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Class Information
Number: 204/238
Name: Chemistry: electrical and wave energy > Apparatus > Electrolytic > Cells with electrolyte treatment means > Recirculation > With filter
Description: Apparatus in which the additional electrolyte treatment means includes a filter.


Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
7622025 Method and apparatus for decontamination of fluid Nov. 24, 2009
7566385 Apparatus adapted for membrane-mediated electropolishing Jul. 28, 2009
7481910 Method and apparatus for stabilizing plating film impurities Jan. 27, 2009
7476305 Recovery system for platinum plating bath Jan. 13, 2009
7179359 Cup-shaped plating apparatus Feb. 20, 2007
7087143 Plating system for semiconductor materials Aug. 8, 2006
RE39123 Plating apparatus Jun. 13, 2006
6929723 Electroplating apparatus using a non-dissolvable anode and ultrasonic energy Aug. 16, 2005
6875322 Electrochemical assisted CMP Apr. 5, 2005
6855233 Apparatus for production of strong alkali and acid electrolytic solution Feb. 15, 2005
6835295 Electrowinning cell incorporating metal ion filtration apparatus Dec. 28, 2004
6821407 Anode and anode chamber for copper electroplating Nov. 23, 2004
6752855 Solution treatment system and solution treatment method Jun. 22, 2004
6733653 Electrowinning cell incorporating metal ion filtration apparatus May. 11, 2004
6689260 Nuclear fuel electrorefiner Feb. 10, 2004
6652725 Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by the apparatus Nov. 25, 2003
6638409 Stable plating performance in copper electrochemical plating Oct. 28, 2003
6627073 Water treatment device Sep. 30, 2003
6599415 Apparatus and method for electropolishing surfaces Jul. 29, 2003
6576110 Coated anode apparatus and associated method Jun. 10, 2003
6569299 Membrane partition system for plating of wafers May. 27, 2003
6547936 Electroplating apparatus having a non-dissolvable anode Apr. 15, 2003
6416650 Apparatus and method of electrochemical polishing by ring-form electrode Jul. 9, 2002
6406608 Apparatus to monitor and add plating solution to plating baths and controlling quality of deposited metal Jun. 18, 2002
6379520 Plating apparatus Apr. 30, 2002
6267853 Electro-chemical deposition system Jul. 31, 2001
6264806 Plating fluid replenishment system and method Jul. 24, 2001
6200436 Recycling consistent plating system for electroplating Mar. 13, 2001
6080288 System for forming nickel stampers utilized in optical disc production Jun. 27, 2000
5951833 Anodizing apparatus Sep. 14, 1999
5928490 Laundry wash process and waste water treatment system Jul. 27, 1999
5865964 Apparatus for stripping ions from concrete and soil Feb. 2, 1999
5833828 Method and apparatus for thermal process control in the electroforming of stampers for production of CD/LD data carriers Nov. 10, 1998
5766428 Chromium plating solution, solution waste from chromium plating and closed recycling system for chromic acid cleaning water in chromium plating Jun. 16, 1998
5716509 Process and device for the electrolytic surface coating of workpieces Feb. 10, 1998
5698081 Coating particles in a centrifugal bed Dec. 16, 1997
5690804 Method and plant for regenerating sulfate electrolyte in steel strip galvanizing processes Nov. 25, 1997
5690797 Hydrogen and oxygen gas generating system Nov. 25, 1997
5683564 Plating cell and plating method with fluid wiper Nov. 4, 1997
5672259 System with electrolytic cell and method for producing heat and reducing radioactivity of a radioactive material by electrolysis Sep. 30, 1997
5624535 Production system of electrolyzed water Apr. 29, 1997
5597460 Plating cell having laminar flow sparger Jan. 28, 1997
5573652 Apparatus for continuously dissolving metal powder for use in plating and method of dissolving nickel metal using same Nov. 12, 1996
5549798 Wet processing apparatus having individual reactivating feedback paths for anode and cathode water Aug. 27, 1996
5516412 Vertical paddle plating cell May. 14, 1996
5496457 Compact plating console Mar. 5, 1996
5494559 System for electrolysis Feb. 27, 1996
5458755 Anodization apparatus with supporting device for substrate to be treated Oct. 17, 1995
5441620 Electroplating apparatus Aug. 15, 1995
5391285 Adjustable plating cell for uniform bump plating of semiconductor wafers Feb. 21, 1995

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