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Browse by Category: Main > Chemistry
Class Information
Number: 204/192.37
Name: Chemistry: electrical and wave energy > Processes and products > Coating, forming or etching by sputtering > Sputter etching > Etching specified material > Silicon containing
Description: Processes wherein the material being etched is organic material.










Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8043484 Methods and apparatus for resputtering process that improves barrier coverage Oct. 25, 2011
7927467 Method of manufacturing discrete track recording medium and discrete track recording medium Apr. 19, 2011
7875199 Radical generating method, etching method and apparatus for use in these methods Jan. 25, 2011
7781327 Resputtering process for eliminating dielectric damage Aug. 24, 2010
7771603 Process for polishing glass substrate Aug. 10, 2010
7628897 Reactive ion etching for semiconductor device feature topography modification Dec. 8, 2009
7399388 Sequential gas flow oxide deposition technique Jul. 15, 2008
7270729 System for, and method of, etching a surface on a wafer Sep. 18, 2007
7150811 Ion beam for target recovery Dec. 19, 2006
RE39143 Method for making a wafer-pair having sealed chambers Jun. 27, 2006
6852203 Three-dimensional periodical structure, its manufacturing method, and method of manufacturing film Feb. 8, 2005
6846391 Process for depositing F-doped silica glass in high aspect ratio structures Jan. 25, 2005
6824655 Process for charged particle beam micro-machining of copper Nov. 30, 2004
6802944 High density plasma CVD process for gapfill into high aspect ratio features Oct. 12, 2004
6746960 Electronic techniques for analyte detection Jun. 8, 2004
6565721 Use of heavy halogens for enhanced facet etching May. 20, 2003
6565720 Substrate removal as a function of sputtered ions May. 20, 2003
6537622 Method of prevention of particle pollution in a pre-clean chamber Mar. 25, 2003
6533908 Device and method for coating substrates in a vacuum utilizing an absorber electrode Mar. 18, 2003
6500314 Plasma etch reactor and method Dec. 31, 2002
6491799 Method for forming a thin dielectric layer Dec. 10, 2002
6471833 High etch rate method for plasma etching silicon nitride Oct. 29, 2002
6436304 Plasma processing method Aug. 20, 2002
6395150 Very high aspect ratio gapfill using HDP May. 28, 2002
6358857 Methods of etching insulative materials, of forming electrical devices, and of forming capacitors Mar. 19, 2002
6342135 Sputter etching chamber with improved uniformity Jan. 29, 2002
6270634 Method for plasma etching at a high etch rate Aug. 7, 2001
6254739 Pre-treatment for salicide process Jul. 3, 2001
6251795 Method for depositing high density plasma chemical vapor deposition oxide with improved topography Jun. 26, 2001
6238588 High pressure high non-reactive diluent gas content high plasma ion density plasma oxide etch process May. 29, 2001
6217724 Coated platen design for plasma immersion ion implantation Apr. 17, 2001
6187151 Method of in-situ cleaning and deposition of device structures in a high density plasma environment Feb. 13, 2001
6169036 Method for cleaning via openings in integrated circuit manufacturing Jan. 2, 2001
6149779 Low-k BSG gap fill process using HDP Nov. 21, 2000
6143144 Method for etch rate enhancement by background oxygen control in a soft etch system Nov. 7, 2000
6139702 Seasoning process for etcher Oct. 31, 2000
6132551 Inductive RF plasma reactor with overhead coil and conductive laminated RF window beneath the overhead coil Oct. 17, 2000
6106678 Method of high density plasma CVD gap-filling Aug. 22, 2000
6051304 Magnetoresistance element and its manufacture Apr. 18, 2000
6039851 Reactive sputter faceting of silicon dioxide to enhance gap fill of spaces between metal lines Mar. 21, 2000
6030898 Advanced etching method for VLSI fabrication Feb. 29, 2000
6009830 Independent gas feeds in a plasma reactor Jan. 4, 2000
5998104 Method of stripping a resist mask Dec. 7, 1999
5997699 Insitu faceting during deposition Dec. 7, 1999
5965629 Process for modifying surfaces of materials, and materials having surfaces modified thereby Oct. 12, 1999
5955391 Ceramic matrix composite and method of manufacturing the same Sep. 21, 1999
5888593 Ion beam process for deposition of highly wear-resistant optical coatings Mar. 30, 1999
5882488 Resputtering to achieve better step coverage Mar. 16, 1999
5820692 Vacuum compatible water vapor and rinse process module Oct. 13, 1998
5783282 Resputtering to achieve better step coverage of contact holes Jul. 21, 1998

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