| |
 |
|
Class Information
Number: 174/558
Name: Electricity: conductors and insulators > Boxes and housings > With electrical device > External terminals > Bumps
Description: Subject matter wherein the external terminals provide connections to terminal areas of the device.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 8383964 |
Terminal structure, printed wiring board, module substrate, and electronic device |
Feb. 26, 2013 |
| 7911804 |
Circuit board and method of manufacturing same |
Mar. 22, 2011 |
| 7884289 |
Method for manufacturing an electronic assembly; an electronic assembly, a cover and a substrate |
Feb. 8, 2011 |
| 7800209 |
Wiring board with conductive wirings and protrusion electrodes |
Sep. 21, 2010 |
| 7288729 |
Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same |
Oct. 30, 2007 |
| 7285734 |
Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same |
Oct. 23, 2007 |
| 7227086 |
Semiconductor chip package having an adhesive tape attached on bonding wires |
Jun. 5, 2007 |
| 7057270 |
Systems and methods for stacking chip components |
Jun. 6, 2006 |
| 6992379 |
Electronic package having a thermal stretching layer |
Jan. 31, 2006 |
| 6984784 |
Electronic equipment system for vehicle |
Jan. 10, 2006 |
| 6980439 |
EMI shield for transceiver |
Dec. 27, 2005 |
| 6953893 |
Circuit board for connecting an integrated circuit to a support and IC BGA package using same |
Oct. 11, 2005 |
| 6947295 |
Ball grid array package with an electromagnetic shield connected directly to a printed circuit board |
Sep. 20, 2005 |
| 6911604 |
Bonding pads of printed circuit board capable of holding solder balls securely |
Jun. 28, 2005 |
| 6875921 |
Capacitive interposer |
Apr. 5, 2005 |
| 6864423 |
Bump chip lead frame and package |
Mar. 8, 2005 |
| 6861587 |
Low stress die attachment |
Mar. 1, 2005 |
| 6853077 |
Semiconductor device, semiconductor packaging method, assembly and method for fabricating the same |
Feb. 8, 2005 |
| 6849802 |
Semiconductor chip, chip stack package and manufacturing method |
Feb. 1, 2005 |
| 6843421 |
Molded memory module and method of making the module absent a substrate support |
Jan. 18, 2005 |
| 6809262 |
Flip chip package carrier |
Oct. 26, 2004 |
| 6548756 |
Packaging and interconnection of contact structure |
Apr. 15, 2003 |
| 6548759 |
Pre-drilled image sensor package |
Apr. 15, 2003 |
| 6335669 |
RF circuit module |
Jan. 1, 2002 |
| 6323434 |
Circuit board and production method thereof |
Nov. 27, 2001 |
| 6320127 |
Method and structure for reducing the incidence of voiding in an underfill layer of an electronic component package |
Nov. 20, 2001 |
| 6239367 |
Multi-chip chip scale package |
May. 29, 2001 |
| 6232551 |
Substrate board for semiconductor package |
May. 15, 2001 |
| 6229711 |
Flip-chip mount board and flip-chip mount structure with improved mounting reliability |
May. 8, 2001 |
| 6211461 |
Chip size package and method of fabricating the same |
Apr. 3, 2001 |
| 6191360 |
Thermally enhanced BGA package |
Feb. 20, 2001 |
| 6184463 |
Integrated circuit package for flip chip |
Feb. 6, 2001 |
| 5990418 |
Hermetic CBGA/CCGA structure with thermal paste cooling |
Nov. 23, 1999 |
| 5844168 |
Multi-layer interconnect sutructure for ball grid arrays |
Dec. 1, 1998 |
| 5796038 |
Technique to produce cavity-up HBGA packages |
Aug. 18, 1998 |
| 5737833 |
Method of producing a high-density printed wiring board for mounting |
Apr. 14, 1998 |
| 5698819 |
Surface mount electronic reed switch component |
Dec. 16, 1997 |
| 5653017 |
Method of mechanical and electrical substrate connection |
Aug. 5, 1997 |
| 5650918 |
Semiconductor device capable of preventing occurrence of a shearing stress |
Jul. 22, 1997 |
| 5635671 |
Mold runner removal from a substrate-based packaged electronic device |
Jun. 3, 1997 |
| 5588202 |
Method for manufacturing an overmolded sensor |
Dec. 31, 1996 |
| 5537738 |
Methods of mechanical and electrical substrate connection |
Jul. 23, 1996 |
| 5535101 |
Leadless integrated circuit package |
Jul. 9, 1996 |
| 5473512 |
Electronic device package having electronic device boonded, at a localized region thereof, to circuit board |
Dec. 5, 1995 |
| 5450283 |
Thermally enhanced semiconductor device having exposed backside and method for making the same |
Sep. 12, 1995 |
| 5426263 |
Electronic assembly having a double-sided leadless component |
Jun. 20, 1995 |
| 5404273 |
Semiconductor-device package and semiconductor device |
Apr. 4, 1995 |
| 5341564 |
Method of fabricating integrated circuit module |
Aug. 30, 1994 |
| 5329423 |
Compressive bump-and-socket interconnection scheme for integrated circuits |
Jul. 12, 1994 |
| 5327327 |
Three dimensional assembly of integrated circuit chips |
Jul. 5, 1994 |
|
|
|
