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Browse by Category: Main > Electrical & Energy
Class Information
Number: 174/558
Name: Electricity: conductors and insulators > Boxes and housings > With electrical device > External terminals > Bumps
Description: Subject matter wherein the external terminals provide connections to terminal areas of the device.










Patents under this class:
1 2

Patent Number Title Of Patent Date Issued
8383964 Terminal structure, printed wiring board, module substrate, and electronic device Feb. 26, 2013
7911804 Circuit board and method of manufacturing same Mar. 22, 2011
7884289 Method for manufacturing an electronic assembly; an electronic assembly, a cover and a substrate Feb. 8, 2011
7800209 Wiring board with conductive wirings and protrusion electrodes Sep. 21, 2010
7288729 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same Oct. 30, 2007
7285734 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same Oct. 23, 2007
7227086 Semiconductor chip package having an adhesive tape attached on bonding wires Jun. 5, 2007
7057270 Systems and methods for stacking chip components Jun. 6, 2006
6992379 Electronic package having a thermal stretching layer Jan. 31, 2006
6984784 Electronic equipment system for vehicle Jan. 10, 2006
6980439 EMI shield for transceiver Dec. 27, 2005
6953893 Circuit board for connecting an integrated circuit to a support and IC BGA package using same Oct. 11, 2005
6947295 Ball grid array package with an electromagnetic shield connected directly to a printed circuit board Sep. 20, 2005
6911604 Bonding pads of printed circuit board capable of holding solder balls securely Jun. 28, 2005
6875921 Capacitive interposer Apr. 5, 2005
6864423 Bump chip lead frame and package Mar. 8, 2005
6861587 Low stress die attachment Mar. 1, 2005
6853077 Semiconductor device, semiconductor packaging method, assembly and method for fabricating the same Feb. 8, 2005
6849802 Semiconductor chip, chip stack package and manufacturing method Feb. 1, 2005
6843421 Molded memory module and method of making the module absent a substrate support Jan. 18, 2005
6809262 Flip chip package carrier Oct. 26, 2004
6548756 Packaging and interconnection of contact structure Apr. 15, 2003
6548759 Pre-drilled image sensor package Apr. 15, 2003
6335669 RF circuit module Jan. 1, 2002
6323434 Circuit board and production method thereof Nov. 27, 2001
6320127 Method and structure for reducing the incidence of voiding in an underfill layer of an electronic component package Nov. 20, 2001
6239367 Multi-chip chip scale package May. 29, 2001
6232551 Substrate board for semiconductor package May. 15, 2001
6229711 Flip-chip mount board and flip-chip mount structure with improved mounting reliability May. 8, 2001
6211461 Chip size package and method of fabricating the same Apr. 3, 2001
6191360 Thermally enhanced BGA package Feb. 20, 2001
6184463 Integrated circuit package for flip chip Feb. 6, 2001
5990418 Hermetic CBGA/CCGA structure with thermal paste cooling Nov. 23, 1999
5844168 Multi-layer interconnect sutructure for ball grid arrays Dec. 1, 1998
5796038 Technique to produce cavity-up HBGA packages Aug. 18, 1998
5737833 Method of producing a high-density printed wiring board for mounting Apr. 14, 1998
5698819 Surface mount electronic reed switch component Dec. 16, 1997
5653017 Method of mechanical and electrical substrate connection Aug. 5, 1997
5650918 Semiconductor device capable of preventing occurrence of a shearing stress Jul. 22, 1997
5635671 Mold runner removal from a substrate-based packaged electronic device Jun. 3, 1997
5588202 Method for manufacturing an overmolded sensor Dec. 31, 1996
5537738 Methods of mechanical and electrical substrate connection Jul. 23, 1996
5535101 Leadless integrated circuit package Jul. 9, 1996
5473512 Electronic device package having electronic device boonded, at a localized region thereof, to circuit board Dec. 5, 1995
5450283 Thermally enhanced semiconductor device having exposed backside and method for making the same Sep. 12, 1995
5426263 Electronic assembly having a double-sided leadless component Jun. 20, 1995
5404273 Semiconductor-device package and semiconductor device Apr. 4, 1995
5341564 Method of fabricating integrated circuit module Aug. 30, 1994
5329423 Compressive bump-and-socket interconnection scheme for integrated circuits Jul. 12, 1994
5327327 Three dimensional assembly of integrated circuit chips Jul. 5, 1994

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