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Class Information
Number: 174/531
Name: Electricity: conductors and insulators > Boxes and housings > With electrical device > Encapsulated (potted, molded, plastic filled) > External terminals > Leads > Varying dimension
Description: Subject matter wherein the lead has at least one dimension (e.g., thickness, length, width) which varies and is not uniform in size along the lead.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 8334467 |
Lead frame design to improve reliability |
Dec. 18, 2012 |
| 6198044 |
Process for manufacture of a microcircuit board permitting limitation of the mechanical stresses transmitted to the microcircuit and board thus obtained |
Mar. 6, 2001 |
| 6040528 |
Insulating supporting structure for high-voltage apparatus including inorganic insulating layer formed on a surface of an organic insulating structure |
Mar. 21, 2000 |
| 5859387 |
Semiconductor device leadframe die attach pad having a raised bond pad |
Jan. 12, 1999 |
| RE35496 |
Semiconductor device and method of producing the same |
Apr. 29, 1997 |
| 5455386 |
Chamfered electronic package component |
Oct. 3, 1995 |
| 5352851 |
Edge-mounted, surface-mount integrated circuit device |
Oct. 4, 1994 |
| 5334803 |
Semiconductor device and method of producing the same |
Aug. 2, 1994 |
| 5255430 |
Method of assembling a module for a smart card |
Oct. 26, 1993 |
| 5157480 |
Semiconductor device having dual electrical contact sites |
Oct. 20, 1992 |
| 4935581 |
Pin grid array package |
Jun. 19, 1990 |
| 4797787 |
Lead frame and electronic device |
Jan. 10, 1989 |
| 4725692 |
Electronic device and lead frame used thereon |
Feb. 16, 1988 |
| 4698660 |
Resin-molded semiconductor device |
Oct. 6, 1987 |
| 4630170 |
Decoupling capacitor and method of manufacture thereof |
Dec. 16, 1986 |
| 4445271 |
Ceramic chip carrier with removable lead frame support and preforated ground pad |
May. 1, 1984 |
| 4436951 |
Semiconductor power module |
Mar. 13, 1984 |
| 4396936 |
Integrated circuit chip package with improved cooling means |
Aug. 2, 1983 |
| 4356344 |
Metal-plastic header assembly |
Oct. 26, 1982 |
| 4139726 |
Packaged microcircuit and method for assembly thereof |
Feb. 13, 1979 |
| 4125740 |
Resin-encased microelectronic module |
Nov. 14, 1978 |
| 4066839 |
Molded body incorporating heat dissipator |
Jan. 3, 1978 |
| 4032706 |
Resin-encased microelectronic module |
Jun. 28, 1977 |
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