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Class Information
Number: 174/531
Name: Electricity: conductors and insulators > Boxes and housings > With electrical device > Encapsulated (potted, molded, plastic filled) > External terminals > Leads > Varying dimension
Description: Subject matter wherein the lead has at least one dimension (e.g., thickness, length, width) which varies and is not uniform in size along the lead.










Patents under this class:

Patent Number Title Of Patent Date Issued
8334467 Lead frame design to improve reliability Dec. 18, 2012
6198044 Process for manufacture of a microcircuit board permitting limitation of the mechanical stresses transmitted to the microcircuit and board thus obtained Mar. 6, 2001
6040528 Insulating supporting structure for high-voltage apparatus including inorganic insulating layer formed on a surface of an organic insulating structure Mar. 21, 2000
5859387 Semiconductor device leadframe die attach pad having a raised bond pad Jan. 12, 1999
RE35496 Semiconductor device and method of producing the same Apr. 29, 1997
5455386 Chamfered electronic package component Oct. 3, 1995
5352851 Edge-mounted, surface-mount integrated circuit device Oct. 4, 1994
5334803 Semiconductor device and method of producing the same Aug. 2, 1994
5255430 Method of assembling a module for a smart card Oct. 26, 1993
5157480 Semiconductor device having dual electrical contact sites Oct. 20, 1992
4935581 Pin grid array package Jun. 19, 1990
4797787 Lead frame and electronic device Jan. 10, 1989
4725692 Electronic device and lead frame used thereon Feb. 16, 1988
4698660 Resin-molded semiconductor device Oct. 6, 1987
4630170 Decoupling capacitor and method of manufacture thereof Dec. 16, 1986
4445271 Ceramic chip carrier with removable lead frame support and preforated ground pad May. 1, 1984
4436951 Semiconductor power module Mar. 13, 1984
4396936 Integrated circuit chip package with improved cooling means Aug. 2, 1983
4356344 Metal-plastic header assembly Oct. 26, 1982
4139726 Packaged microcircuit and method for assembly thereof Feb. 13, 1979
4125740 Resin-encased microelectronic module Nov. 14, 1978
4066839 Molded body incorporating heat dissipator Jan. 3, 1978
4032706 Resin-encased microelectronic module Jun. 28, 1977











 
 
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