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Class Information
Number: 174/527
Name: Electricity: conductors and insulators > Boxes and housings > With electrical device > Encapsulated (potted, molded, plastic filled) > External terminals
Description: Subject matter wherein the box or housing includes external electrical connection points.

Sub-classes under this class:

Class Number Class Name Patents
174/534 Lands 86
174/528 Leads 160

Patents under this class:
1 2

Patent Number Title Of Patent Date Issued
8642902 Surface mountable device Feb. 4, 2014
8642891 Closure and interconnect systems and methods of using dry silicone gels in closure and interconnect systems Feb. 4, 2014
8637774 Tracer wire connector kits Jan. 28, 2014
8558124 Housing component for door latch assembly and method of making Oct. 15, 2013
8536465 Electrochemical device Sep. 17, 2013
8481861 Method of attaching die to circuit board with an intermediate interposer Jul. 9, 2013
8426740 Metal base circuit board Apr. 23, 2013
8399781 Anti-tamper mesh Mar. 19, 2013
8288666 Encasement technique for electronic circuits Oct. 16, 2012
8050037 Electronic control device using LC module structure Nov. 1, 2011
7935899 Circuit device and method of manufacturing the same May. 3, 2011
7863527 Lead frame mount for circuit component Jan. 4, 2011
7712211 Method for packaging circuits and packaged circuits May. 11, 2010
7622684 Electronic component package Nov. 24, 2009
7439452 Multi-chip module packaging with thermal expansion coefficiencies Oct. 21, 2008
7421781 Method of forming a module component having a plurality of penetration holes Sep. 9, 2008
6798638 Pot-shaped housing and cover for capacitors Sep. 28, 2004
6711354 Auxiliary module use relaying component and auxiliary module Mar. 23, 2004
6657137 Connection structure and connection method of for connecting two circuit boards Dec. 2, 2003
6653564 Conductor strip arrangement for a molded electronic component and process for molding Nov. 25, 2003
6649834 Injection molded image sensor and a method for manufacturing the same Nov. 18, 2003
6632997 Personalized circuit module package and method for packaging circuit modules Oct. 14, 2003
6601293 Method of making an electromagnetic interference shield device Aug. 5, 2003
6489558 Conductive cap, electronic component, and method of forming insulating film of conductive cap Dec. 3, 2002
6437239 Protection device and method of determining exposure temperature Aug. 20, 2002
6340792 Mold cap for semiconductor device mold package Jan. 22, 2002
6313402 Stress relief bend useful in an integrated circuit redistribution patch Nov. 6, 2001
6239366 Face-to-face multi-chip package May. 29, 2001
6232551 Substrate board for semiconductor package May. 15, 2001
6211461 Chip size package and method of fabricating the same Apr. 3, 2001
6124546 Integrated circuit chip package and method of making the same Sep. 26, 2000
6111199 Integrated circuit package using a gas to insulate electrical conductors Aug. 29, 2000
6080932 Semiconductor package assemblies with moisture vents Jun. 27, 2000
6078501 Power semiconductor module Jun. 20, 2000
6049463 Microelectronic assembly including an antenna element embedded within a polymeric card, and method for forming same Apr. 11, 2000
5981873 Printed circuit board for ball grid array semiconductor package Nov. 9, 1999
5962810 Integrated circuit package employing a transparent encapsulant Oct. 5, 1999
5952611 Flexible pin location integrated circuit package Sep. 14, 1999
5925934 Low cost and highly reliable chip-sized package Jul. 20, 1999
5894107 Chip-size package (CSP) using a multi-layer laminated lead frame Apr. 13, 1999
5847930 Edge terminals for electronic circuit modules Dec. 8, 1998
5844168 Multi-layer interconnect sutructure for ball grid arrays Dec. 1, 1998
5825083 Semiconductor device Oct. 20, 1998
5821456 Microelectronic assembly including a decomposable encapsulant, and method for forming and reworking same Oct. 13, 1998
5767446 Printed circuit board having epoxy barrier around a throughout slot and ball grid array semiconductor package Jun. 16, 1998
5760337 Thermally reworkable binders for flip-chip devices Jun. 2, 1998
5742006 Electric cell of the type comprising two parallel plates or substrates in particular made of plastic material separated from each other by a sealing frame Apr. 21, 1998
5686697 Electrical circuit suspension system Nov. 11, 1997
5677511 Overmolded PC board with ESD protection and EMI suppression Oct. 14, 1997
5639990 Solid printed substrate and electronic circuit package using the same Jun. 17, 1997

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