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Class Information
Number: 174/523
Name: Electricity: conductors and insulators > Boxes and housings > With electrical device > Encapsulated (potted, molded, plastic filled) > Dam
Description: Subject matter wherein the box or housing includes a structure which blocks or dams the flow of the encapsulating compound.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615712 |
Integrated circuit packages including damming and change protection cover for harsh environments |
Nov. 10, 2009 |
| 6984883 |
Semiconductor power module |
Jan. 10, 2006 |
| 6921860 |
Microelectronic component assemblies having exposed contacts |
Jul. 26, 2005 |
| 6489558 |
Conductive cap, electronic component, and method of forming insulating film of conductive cap |
Dec. 3, 2002 |
| 6124547 |
Tape carrier package |
Sep. 26, 2000 |
| 5973263 |
Encapsulated electronic component and method for encapsulating an electronic component |
Oct. 26, 1999 |
| 5962810 |
Integrated circuit package employing a transparent encapsulant |
Oct. 5, 1999 |
| 5900581 |
Resin sealing structure for elements |
May. 4, 1999 |
| 5844168 |
Multi-layer interconnect sutructure for ball grid arrays |
Dec. 1, 1998 |
| 5767446 |
Printed circuit board having epoxy barrier around a throughout slot and ball grid array semiconductor package |
Jun. 16, 1998 |
| 5717163 |
Plastic material pouring device for forming electronic components |
Feb. 10, 1998 |
| 5700981 |
Encapsulated electronic component and method for encapsulating an electronic component |
Dec. 23, 1997 |
| 5590462 |
Process for dissipating heat from a semiconductor package |
Jan. 7, 1997 |
| 5386342 |
Rigid backplane formed from a moisture resistant insulative material used to protect a semiconductor device |
Jan. 31, 1995 |
| 5332864 |
Integrated circuit package having an interposer |
Jul. 26, 1994 |
| 5243132 |
Drain hole core for explosion-proof drain seal fittings |
Sep. 7, 1993 |
| 5130781 |
Dam for lead encapsulation |
Jul. 14, 1992 |
| 5120678 |
Electrical component package comprising polymer-reinforced solder bump interconnection |
Jun. 9, 1992 |
| 4214364 |
Hermetic and non-hermetic packaging of devices |
Jul. 29, 1980 |
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