| |
 |
|
Class Information
Number: 174/522
Name: Electricity: conductors and insulators > Boxes and housings > With electrical device > Encapsulated (potted, molded, plastic filled) > Vent, inlet or exit
Description: Subject matter wherein the box or housing includes a pipe or opening for passage of gas or an opening for ingress and egress of the encapsulating compound.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7336500 |
Method and apparatus for encapsulating a printed circuit board |
Feb. 26, 2008 |
| 7208943 |
Electrical device enclosure |
Apr. 24, 2007 |
| 7178235 |
Method of manufacturing an optoelectronic package |
Feb. 20, 2007 |
| 7161092 |
Apparatus and method for protecting an electronic circuit |
Jan. 9, 2007 |
| 7109410 |
EMI shielding for electronic component packaging |
Sep. 19, 2006 |
| 6781849 |
Multi-chip package having improved heat spread characteristics and method for manufacturing the same |
Aug. 24, 2004 |
| 6538200 |
Underfill coating for LOC package |
Mar. 25, 2003 |
| 6384332 |
Bladder insert for encapsulant displacement |
May. 7, 2002 |
| 6350952 |
Semiconductor package including heat diffusion portion |
Feb. 26, 2002 |
| 6297958 |
System and method for housing telecommunications equipment |
Oct. 2, 2001 |
| 6245995 |
Methods and apparatus for removing moisture from an enclosure |
Jun. 12, 2001 |
| 6211462 |
Low inductance power package for integrated circuits |
Apr. 3, 2001 |
| 6191360 |
Thermally enhanced BGA package |
Feb. 20, 2001 |
| 6130383 |
Solder ball array package and a method of encapsulation |
Oct. 10, 2000 |
| 6051783 |
Electronics enclosure |
Apr. 18, 2000 |
| 5981873 |
Printed circuit board for ball grid array semiconductor package |
Nov. 9, 1999 |
| 5734125 |
Junction box |
Mar. 31, 1998 |
| 5717163 |
Plastic material pouring device for forming electronic components |
Feb. 10, 1998 |
| 5686698 |
Package for electrical components having a molded structure with a port extending into the molded structure |
Nov. 11, 1997 |
| 5640764 |
Method of forming a tubular feed-through hermetic seal for an implantable medical device |
Jun. 24, 1997 |
| 5635671 |
Mold runner removal from a substrate-based packaged electronic device |
Jun. 3, 1997 |
| 5567165 |
Fluid actuated connector/carrier for electric part |
Oct. 22, 1996 |
| 5455386 |
Chamfered electronic package component |
Oct. 3, 1995 |
| 5413489 |
Integrated socket and IC package assembly |
May. 9, 1995 |
| 5336931 |
Anchoring method for flow formed integrated circuit covers |
Aug. 9, 1994 |
| 5255157 |
Plastic pin grid array package with locking pillars |
Oct. 19, 1993 |
| 5175613 |
Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips |
Dec. 29, 1992 |
| 5121289 |
Encapsulatable sensor assembly |
Jun. 9, 1992 |
| 5120678 |
Electrical component package comprising polymer-reinforced solder bump interconnection |
Jun. 9, 1992 |
| 5065506 |
Method of manufacturing circuit board |
Nov. 19, 1991 |
| 4897508 |
Metal electronic package |
Jan. 30, 1990 |
| 4874721 |
Method of manufacturing a multichip package with increased adhesive strength |
Oct. 17, 1989 |
| 4855807 |
Semiconductor device |
Aug. 8, 1989 |
| 4847557 |
Hermetically sealed magnetic sensor |
Jul. 11, 1989 |
| 4810831 |
Housing for an electrical component, and method for sealing same |
Mar. 7, 1989 |
| 4777520 |
Heat-resistant plastic semiconductor device |
Oct. 11, 1988 |
| 4748294 |
Housing for an electromechanical device |
May. 31, 1988 |
| 4600969 |
Protective apparatus for encapsulating electrical circuits |
Jul. 15, 1986 |
| 4594644 |
Electrical component encapsulation package |
Jun. 10, 1986 |
| 4556896 |
Lead frame structure |
Dec. 3, 1985 |
| 4366345 |
Electromechanical component sealing system |
Dec. 28, 1982 |
| 4355463 |
Process for hermetically encapsulating semiconductor devices |
Oct. 26, 1982 |
| 4229403 |
Method of assembling a fault limiter by molding a rigid housing about a non-rigid subassembly |
Oct. 21, 1980 |
| 4195201 |
Inductive coil module |
Mar. 25, 1980 |
| 4172272 |
Solid state relay having U-shaped conductive heat sink frame |
Oct. 23, 1979 |
| 4049903 |
Circuit film strip and manufacturing method |
Sep. 20, 1977 |
| 4004199 |
Electrical component seal |
Jan. 18, 1977 |
| 3986083 |
Capacitor case cover disc seal and venting means |
Oct. 12, 1976 |
|
|
|
