| |
 |
|
Class Information
Number: 174/521
Name: Electricity: conductors and insulators > Boxes and housings > With electrical device > Encapsulated (potted, molded, plastic filled)
Description: Subject matter wherein a portion of the box or housing including the electrical component or the structure for attaching an electrical device is filled with sealing or encapsulating compound.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7622684 |
Electronic component package |
Nov. 24, 2009 |
| 7615712 |
Integrated circuit packages including damming and change protection cover for harsh environments |
Nov. 10, 2009 |
| 7616448 |
Wrap-around overmold for electronic assembly |
Nov. 10, 2009 |
| 7608789 |
Component arrangement provided with a carrier substrate |
Oct. 27, 2009 |
| 7593233 |
Modules for a measuring device and measuring device |
Sep. 22, 2009 |
| 7586048 |
Electronic component |
Sep. 8, 2009 |
| 7566836 |
Potting shell |
Jul. 28, 2009 |
| 7563990 |
Electronic product, a body and a method of manufacturing |
Jul. 21, 2009 |
| 7560153 |
Insert-molded article and a production method for insert-molded article |
Jul. 14, 2009 |
| 7552532 |
Method for hermetically encapsulating a component |
Jun. 30, 2009 |
| 7531757 |
IC card and semiconductor integrated circuit device package |
May. 12, 2009 |
| 7514629 |
Electrical connection box |
Apr. 7, 2009 |
| 7488904 |
Resin molded component fitted with a metal plate and molding method therefor |
Feb. 10, 2009 |
| 7488903 |
Method for manufacturing circuit modules and circuit module |
Feb. 10, 2009 |
| 7473845 |
Structural unit and method for the production of a structural unit |
Jan. 6, 2009 |
| 7467457 |
Method of coupling a device to a mating part |
Dec. 23, 2008 |
| 7459642 |
RIM slot filler module and method of manufacturing the same |
Dec. 2, 2008 |
| 7443693 |
Electromagnetic interference shielding for a printed circuit board |
Oct. 28, 2008 |
| 7439452 |
Multi-chip module packaging with thermal expansion coefficiencies |
Oct. 21, 2008 |
| 7421781 |
Method of forming a module component having a plurality of penetration holes |
Sep. 9, 2008 |
| 7397001 |
Multi-strand substrate for ball-grid array assemblies and method |
Jul. 8, 2008 |
| 7390978 |
Overmolded electronic assembly and overmoldable interface component |
Jun. 24, 2008 |
| 7355547 |
Vehicle-mounted millimeter wave radar device, millimeter wave radar module, and manufacturing method thereof |
Apr. 8, 2008 |
| 7351920 |
IC card and semiconductor integrated circuit device package |
Apr. 1, 2008 |
| 7349227 |
Electronic control device |
Mar. 25, 2008 |
| 7342807 |
Modules for a measuring device and measuring device |
Mar. 11, 2008 |
| 7336500 |
Method and apparatus for encapsulating a printed circuit board |
Feb. 26, 2008 |
| 7320738 |
Method for encapsulation of a chip card and module obtained thus |
Jan. 22, 2008 |
| 7320817 |
Holding structure and a molding with the same |
Jan. 22, 2008 |
| 7319191 |
Signal adapter |
Jan. 15, 2008 |
| 7312406 |
Sensor having metallic housing and resin connector, and method of manufacturing the same |
Dec. 25, 2007 |
| 7309838 |
Multi-layered circuit board assembly with improved thermal dissipation |
Dec. 18, 2007 |
| 7296299 |
Tamper-evident and/or tamper-resistant electronic components |
Nov. 13, 2007 |
| 7288728 |
Electronic package and packaging method |
Oct. 30, 2007 |
| 7265982 |
Semiconductor device |
Sep. 4, 2007 |
| 7227086 |
Semiconductor chip package having an adhesive tape attached on bonding wires |
Jun. 5, 2007 |
| 7209361 |
Electronic device |
Apr. 24, 2007 |
| 7209360 |
Leak-tight system for boxes containing electrical and electronic components |
Apr. 24, 2007 |
| 7208943 |
Electrical device enclosure |
Apr. 24, 2007 |
| 7199306 |
Multi-strand substrate for ball-grid array assemblies and method |
Apr. 3, 2007 |
| 7193161 |
SiP module with a single sided lid |
Mar. 20, 2007 |
| 7189929 |
Flexible circuit with cover layer |
Mar. 13, 2007 |
| 7189919 |
Housing for antenna amplifier |
Mar. 13, 2007 |
| 7186912 |
Hermetic lid seal by metal pressing for fiber optic module |
Mar. 6, 2007 |
| 7183485 |
Microelectronic component assemblies having lead frames adapted to reduce package bow |
Feb. 27, 2007 |
| 7179991 |
Case of electronic device and method for fabricating the same |
Feb. 20, 2007 |
| 7180012 |
Module part |
Feb. 20, 2007 |
| 7146721 |
Method of manufacturing a sealed electronic module |
Dec. 12, 2006 |
| 7134198 |
Method for manufacturing electric element built-in module with sealed electric element |
Nov. 14, 2006 |
| 7126063 |
Encapsulated electronic sensor package |
Oct. 24, 2006 |
|
|
|
