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Class Information
Number: 174/50.56
Name: Electricity: conductors and insulators > Boxes and housings > Hermetic sealed envelope type > Lead-in insulated from metal wall
Description: Subject matter wherein the envelope has at least a portion of its wall formed of metal or other conductive material with a lead-in conductor which passes through the metal or conductive wall position and is insulated therefrom.

Patents under this class:

Patent Number Title Of Patent Date Issued
8604341 Feedthrough assembly for an implantable device Dec. 10, 2013
8581118 Seal structure, method of forming seal structure, wire body, and electronic apparatus Nov. 12, 2013
8378212 Sealed electrical feed-through assembly and methods of making same Feb. 19, 2013
8378239 Hermetic feed-through with hybrid seal structure Feb. 19, 2013
8011970 Systems and methods for providing a trimless electronic device port Sep. 6, 2011
7771240 Systems and methods for providing a trimless electronic device port Aug. 10, 2010
7759774 Shielded structures to protect semiconductor devices Jul. 20, 2010
7164142 Electrical feed-through structure and method Jan. 16, 2007
7145076 Method for minimizing stress in feedthrough capacitor filter assemblies Dec. 5, 2006
6956167 Lid-holding frame used in production of hollow-package type electronic products, and sealing-process using such lid-holding frame Oct. 18, 2005
6861586 Electrical shield for a welding apparatus Mar. 1, 2005
6852925 Feed-through assemblies having terminal pins comprising platinum and methods for fabricating same Feb. 8, 2005
6841731 Terminal assembly Jan. 11, 2005
6809259 Through terminal and X-ray tube Oct. 26, 2004
6797887 Glass terminal for high-speed optical communication Sep. 28, 2004
6586675 Feedthrough devices Jul. 1, 2003
6433275 Watertight housing for electrical devices Aug. 13, 2002
6245993 Electronic assembly having shielding and strain-relief member Jun. 12, 2001
6137053 Electric double-layer capacitor housing Oct. 24, 2000
6111198 Duplex feedthrough and method therefor Aug. 29, 2000
6078501 Power semiconductor module Jun. 20, 2000
5917150 Mineral-insulated cable terminations Jun. 29, 1999
5880403 Radiation shielding of three dimensional multi-chip modules Mar. 9, 1999
5861577 Seal structure for member-passing-through hole bored in metal partition member Jan. 19, 1999
5734103 Sealed wire entry for instrument housing and method of sealing Mar. 31, 1998
5525759 Pin-shaped feedthrough Jun. 11, 1996
5491300 Penetrator and flexible circuit assembly for sealed environment Feb. 13, 1996
5399805 Metal electronic package with reduced seal width Mar. 21, 1995
5374786 Ceramic wall hybrid package with washer and solid metal through wall leads Dec. 20, 1994
5367125 Aluminum based article having an insert with vitreous material hermetically sealed thereto Nov. 22, 1994
5308925 Conductive pin assembly for a machine housing May. 3, 1994
5214246 Grooved package for hybrid components May. 25, 1993
5194697 Electrically conductive feedthrough connection and methods of manufacturing same Mar. 16, 1993
5160810 Universal surface mount package Nov. 3, 1992
5032692 Process for manufactoring hermetic high temperature filter packages and the products produced thereby Jul. 16, 1991
4889960 Sealed semiconductor casing Dec. 26, 1989
4874910 High lead density vacuum feedthrough Oct. 17, 1989
4684763 Hermetically sealable package for electronic component Aug. 4, 1987
4547624 Method and apparatus for reducing package height for microcircuit packages Oct. 15, 1985
4356344 Metal-plastic header assembly Oct. 26, 1982
4033017 Manufacturing method of a hermetically sealed terminal Jul. 5, 1977

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