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Browse by Category: Main > Electrical & Energy
Class Information
Number: 174/266
Name: Electricity: conductors and insulators > Conduits, cables or conductors > Preformed panel circuit arrangement (e.g., printed circuit) > With particular conductive connection (e.g., crossover) > Feedthrough > Hollow (e.g., plated cylindrical hole)
Description: Subject matter wherein the feedthrough surrounds an empty space.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
8693203 Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices Apr. 8, 2014
8693209 Wiring board and method for manufacturing the same Apr. 8, 2014
8680404 Printed circuit board including via pad with concavo-convex patterns and method of manufacturing the same Mar. 25, 2014
8680405 Circuit boards Mar. 25, 2014
8668355 Light emitting module having heat conductive substrate Mar. 11, 2014
8669777 Assessing connection joint coverage between a device and a printed circuit board Mar. 11, 2014
8658911 Through-hole-vias in multi-layer printed circuit boards Feb. 25, 2014
8654538 Wiring board and method for manufacturing the same Feb. 18, 2014
8609998 Wiring board and method of manufacturing the same Dec. 17, 2013
8604357 Wiring board having via and method forming a via in a wiring board Dec. 10, 2013
8592692 Substrate having a plural diameter via Nov. 26, 2013
8592691 Printed wiring board Nov. 26, 2013
8586876 Laminated circuit board and board producing method Nov. 19, 2013
8580682 Cost-effective TSV formation Nov. 12, 2013
8581114 Packaged structure having magnetic component and method thereof Nov. 12, 2013
8563873 Substrate with metal film and method for manufacturing the same Oct. 22, 2013
8552570 Wiring board, semiconductor device, and method for manufacturing wiring board and semiconductor device Oct. 8, 2013
8552311 Electrical feedthrough assembly Oct. 8, 2013
8545051 Lighting apparatus with heat conductive substrate Oct. 1, 2013
8536464 Multilayer substrate Sep. 17, 2013
8513539 Wiring board and method of manufacturing the same Aug. 20, 2013
8508037 Bumpless build-up layer and laminated core hybrid structures and methods of assembling same Aug. 13, 2013
8502085 Multi-layer substrate with a via hole and electronic device having the same Aug. 6, 2013
8502086 Laminated wiring board and method for manufacturing the same Aug. 6, 2013
8492659 Printed wiring board and manufacturing method therefor Jul. 23, 2013
8476537 Multi-layer substrate Jul. 2, 2013
8466368 High-frequency device Jun. 18, 2013
8461461 Embedded substrate having circuit layer element with oblique side surface and method for making the same Jun. 11, 2013
8461464 Circuit board having interconnected holes Jun. 11, 2013
8440917 Method and apparatus to reduce impedance discontinuity in packages May. 14, 2013
8436254 Method of fabricating circuit board structure May. 7, 2013
8431829 Printed wiring board and method for manufacturing the same Apr. 30, 2013
8431831 Bond strength and interconnection in a via Apr. 30, 2013
8431833 Printed wiring board and method for manufacturing the same Apr. 30, 2013
8431834 Method for assuring counterbore depth of vias on printed circuit boards and printed circuit boards made accordingly Apr. 30, 2013
8420954 Printed circuit board and method for fabricating the same Apr. 16, 2013
8410375 Wiring board and method of manufacturing the same Apr. 2, 2013
8410376 Printed wiring board and method for manufacturing the same Apr. 2, 2013
8391022 Multi-function mezzanine board alignment and mounting device, with integrated handle Mar. 5, 2013
8383957 Printed circuit board Feb. 26, 2013
8377544 Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity Feb. 19, 2013
8378230 Printed wiring board and method for manufacturing the same Feb. 19, 2013
8365398 Accurate alignment for stacked substrates Feb. 5, 2013
8365397 Method for producing a circuit board comprising a lead frame Feb. 5, 2013
8351002 Printed circuit board and method for manufacturing the same Jan. 8, 2013
8351216 Layered structure connection and assembly Jan. 8, 2013
8344261 Carrier substrate, fabrication method thereof, printed circuit board using the same, and fabrication method thereof Jan. 1, 2013
8345444 Structure with electronic component mounted therein and method for manufacturing such structure Jan. 1, 2013
8336201 Method of manufacturing printed circuit board having flow preventing dam Dec. 25, 2012
8334461 Wiring board and electronic component device Dec. 18, 2012

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