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Class Information
Number: 174/264
Name: Electricity: conductors and insulators > Conduits, cables or conductors > Preformed panel circuit arrangement (e.g., printed circuit) > With particular conductive connection (e.g., crossover) > Feedthrough > Voidless (e.g., solid)
Description: Subject matter wherein the conductive material is a solid that completely fills the feedthrough.










Sub-classes under this class:

Class Number Class Name Patents
174/265 Preform in hole 262


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
8704106 Ferroelectric component and manufacturing the same Apr. 22, 2014
8692135 Wiring board capable of containing functional element and method for manufacturing same Apr. 8, 2014
8680405 Circuit boards Mar. 25, 2014
8669481 Laminated circuit board and board producing method Mar. 11, 2014
8669480 Wiring board and method of manufacturing wiring board Mar. 11, 2014
8664540 Interposer testing using dummy connections Mar. 4, 2014
8658904 Flex-rigid wiring board and method for manufacturing the same Feb. 25, 2014
8649186 Package substrate and semiconductor package having the same Feb. 11, 2014
8648263 Wiring board and method of manufacturing wiring board Feb. 11, 2014
8638565 Arrangement of optoelectronic components Jan. 28, 2014
8633400 Multilayer printed wiring board and method for manufacturing multilayer printed wiring board Jan. 21, 2014
8633394 Flexible printed circuit board Jan. 21, 2014
8621926 Wiring substrate, piezoelectric oscillator and gyrosensor Jan. 7, 2014
8624132 Printed wiring board Jan. 7, 2014
8625299 Circuit board with even current distribution Jan. 7, 2014
8618424 Multilayer wiring substrate and method of manufacturing the same Dec. 31, 2013
8617688 Conductive paste and multilayer printed wiring board using the same Dec. 31, 2013
8609997 Multilayer wiring substrate Dec. 17, 2013
8609998 Wiring board and method of manufacturing the same Dec. 17, 2013
8610001 Printed wiring board and method for manufacturing printed wiring board Dec. 17, 2013
8598468 Electromagnetic bandgap structure and printed circuit board Dec. 3, 2013
8592691 Printed wiring board Nov. 26, 2013
8586873 Test point design for a high speed bus Nov. 19, 2013
8586875 Wiring board and method for manufacturing the same Nov. 19, 2013
8586876 Laminated circuit board and board producing method Nov. 19, 2013
8575492 Hole in pad thermal management Nov. 5, 2013
8569632 Wiring board having through hole or non-through hole, and method for producing the same Oct. 29, 2013
8563872 Wiring board, wiring board manufacturing method, and via paste Oct. 22, 2013
8552312 Printed wiring board and method for manufacturing printed wiring board Oct. 8, 2013
8552311 Electrical feedthrough assembly Oct. 8, 2013
8546698 Wiring board and method for manufacturing the same Oct. 1, 2013
8541695 Wiring board and method for manufacturing the same Sep. 24, 2013
8541694 Multilayer wiring board Sep. 24, 2013
8536462 Flex circuit package and method Sep. 17, 2013
8530755 Wiring board and method for manufacturing the same Sep. 10, 2013
8516692 Solder layer, substrate for device joining utilizing the same and method of manufacturing the substrate Aug. 27, 2013
8507803 Structure of connecting printed wiring boards, method of connecting printed wiring boards, and adhesive having anisotropic conductivity Aug. 13, 2013
8502085 Multi-layer substrate with a via hole and electronic device having the same Aug. 6, 2013
8497434 Printed circuit board and manufacturing method thereof Jul. 30, 2013
8482934 Implementing surface mount components with symmetric reference balance Jul. 9, 2013
8481858 Method for producing a non-developable surface printed circuit and the thus obtained printed circuit Jul. 9, 2013
8481863 Substrate and method for manufacturing the same Jul. 9, 2013
8461462 Circuit substrate, laminated board and laminated sheet Jun. 11, 2013
8461463 Composite module Jun. 11, 2013
8456855 Printed circuit board Jun. 4, 2013
8445790 Coreless substrate having filled via pad and method of manufacturing the same May. 21, 2013
8440917 Method and apparatus to reduce impedance discontinuity in packages May. 14, 2013
8431831 Bond strength and interconnection in a via Apr. 30, 2013
8431833 Printed wiring board and method for manufacturing the same Apr. 30, 2013
8405999 Flexible wiring board and method of manufacturing same Mar. 26, 2013

1 2 3 4 5 6 7 8 9 10 11










 
 
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