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Class Information
Number: 174/262
Name: Electricity: conductors and insulators > Conduits, cables or conductors > Preformed panel circuit arrangement (e.g., printed circuit) > With particular conductive connection (e.g., crossover) > Feedthrough
Description: Subject matter including a passage used to make electrical and mechanical connection between conductive patterns on plural planes of a printed circuit board.

Sub-classes under this class:

Class Number Class Name Patents
174/266 Hollow (e.g., plated cylindrical hole) 529
174/264 Voidless (e.g., solid) 545
174/263 With solder 468

Patents under this class:

Patent Number Title Of Patent Date Issued
8129625 Multilayer printed wiring board Mar. 6, 2012
8124885 Anisotropically conductive connector and anisotropically conductive connector device Feb. 28, 2012
8124882 Multilayer printed wiring board Feb. 28, 2012
8119931 Differential vertical structure for high density, low layer count packages Feb. 21, 2012
8119930 Wiring board and method for manufacturing the same Feb. 21, 2012
8119929 Wiring board and method for manufacturing the same Feb. 21, 2012
8119921 Impedance tuning for circuit board signal path surface pad structures Feb. 21, 2012
8119920 Multilayer printed wiring board Feb. 21, 2012
8116090 Low temperature co-fired ceramic (LTCC) transmit/receive (T/R) assembly utilizing ball grid array (BGA) technology Feb. 14, 2012
8116089 Method and apparatus for securing a magnetic component to a printed circuit board for soldering Feb. 14, 2012
8115111 Multilayer printed wiring board with filled viahole structure Feb. 14, 2012
8115110 Printed circuit board minimizing undesirable signal reflections in a via and methods therefor Feb. 14, 2012
8114711 Method of electrically connecting a microelectronic component Feb. 14, 2012
8112884 Method for providing an efficient thermal transfer through a printed circuit board Feb. 14, 2012
8110753 Circuit board assembly Feb. 7, 2012
8110750 Multilayer printed wiring board Feb. 7, 2012
8109768 Connector and electronic component provided with same Feb. 7, 2012
8108993 Method of manufacturing wiring substrate, and method of manufacturing semiconductor device Feb. 7, 2012
8106310 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board Jan. 31, 2012
8106302 Circuit board of communication product and manufacturing method thereof Jan. 31, 2012
8101868 Multilayered printed circuit board and method for manufacturing the same Jan. 24, 2012
8101864 Electronic device substrate and its fabrication method, and electronic device and its fabrication method Jan. 24, 2012
8097946 Device mounting board, semiconductor module, and mobile device Jan. 17, 2012
8097815 Printed circuit board and its designing method, and designing method of IC package terminal and its connecting method Jan. 17, 2012
8096049 Method of manufacturing a multilayer wiring board Jan. 17, 2012
8094460 Orientation-tolerant land pattern and method of manufacturing the same Jan. 10, 2012
8093718 Chip structure and stacked structure of chips Jan. 10, 2012
8093508 Printed wiring board and method of manufacturing the same Jan. 10, 2012
8093507 Printed wiring board and method for producing the same Jan. 10, 2012
8093506 Multilayer wiring board and power supply structure to be embedded in multilayer wiring board Jan. 10, 2012
8093502 Flex-rigid wiring board and manufacturing method thereof Jan. 10, 2012
8089007 Printed circuit board Jan. 3, 2012
8089006 High performance resonant element Jan. 3, 2012
8084696 Printed circuit board and manufacturing method thereof Dec. 27, 2011
8084695 Via structure for improving signal integrity Dec. 27, 2011
8080741 Printed circuit board Dec. 20, 2011
8079011 Printed circuit boards having pads for solder balls and methods for the implementation thereof Dec. 13, 2011
8077478 Module board Dec. 13, 2011
8076590 Printed circuit board Dec. 13, 2011
8076589 Multilayer wiring board and its manufacturing method Dec. 13, 2011
8076586 Heat conduction from an embedded component Dec. 13, 2011
8071891 Interconnect structure Dec. 6, 2011
8071890 Electrically conductive structure of circuit board and circuit board using the same Dec. 6, 2011
8071889 Electronic device with EMI screen and packing process thereof Dec. 6, 2011
8067700 Via structure of printed circuit board Nov. 29, 2011
8067698 Wiring substrate for use in semiconductor apparatus, method for fabricating the same, and semiconductor apparatus using the same Nov. 29, 2011
8067697 Flexible printed circuit board for light emitting diode backlight unit and method of fabricating the same Nov. 29, 2011
8067266 Methods for the fabrication of microelectronic device substrates by attaching two cores together during fabrication Nov. 29, 2011
8064219 Ceramic substrate part and electronic part comprising it Nov. 22, 2011
8064216 Edge connector Nov. 22, 2011

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