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Class Information
Number: 174/262
Name: Electricity: conductors and insulators > Conduits, cables or conductors > Preformed panel circuit arrangement (e.g., printed circuit) > With particular conductive connection (e.g., crossover) > Feedthrough
Description: Subject matter including a passage used to make electrical and mechanical connection between conductive patterns on plural planes of a printed circuit board.

Sub-classes under this class:

Class Number Class Name Patents
174/266 Hollow (e.g., plated cylindrical hole) 529
174/264 Voidless (e.g., solid) 545
174/263 With solder 468

Patents under this class:

Patent Number Title Of Patent Date Issued
8357860 Wiring board having a connecting pad area which is smaller than a surface plating layer area Jan. 22, 2013
8357859 Insulating resin sheet laminate and multi-layer printed circuit board including insulating resin sheet laminate Jan. 22, 2013
8354601 Method and structure for coaxial via routing in printed circuit boards for improved signal integrity Jan. 15, 2013
8354600 Printed wiring board and electronic device Jan. 15, 2013
8354595 Adhesive reinforced open hole interconnect Jan. 15, 2013
8351216 Layered structure connection and assembly Jan. 8, 2013
8350161 Circuit board and structure using the same Jan. 8, 2013
8345444 Structure with electronic component mounted therein and method for manufacturing such structure Jan. 1, 2013
8344268 Electronic component packaging structure having two-layer moisture-proof coating and method for manufacturing the same Jan. 1, 2013
8344267 LED luminous module with crossover connecting element Jan. 1, 2013
8344266 Optimizing ASIC pinouts for HDI Jan. 1, 2013
8344264 Semiconductor device and manufacturing process thereof Jan. 1, 2013
8344259 Connection terminal, package using the same, and electronic apparatus Jan. 1, 2013
8339803 High-speed ceramic modules with hybrid referencing scheme for improved performance and reduced cost Dec. 25, 2012
8338717 Circuit substrate and structure using the same Dec. 25, 2012
8338714 Heat-radiating substrate and manufacturing method thereof Dec. 25, 2012
8336201 Method of manufacturing printed circuit board having flow preventing dam Dec. 25, 2012
8334466 Multilayer printed wiring board Dec. 18, 2012
8334463 Wiring board and method for manufacturing the same Dec. 18, 2012
8334461 Wiring board and electronic component device Dec. 18, 2012
8330048 Electromagnetic bandgap structure and printed circuit board having the same Dec. 11, 2012
8325490 Circuit manufacturing and design techniques for reference plane voids with strip segment Dec. 4, 2012
8324513 Wiring substrate and semiconductor apparatus including the wiring substrate Dec. 4, 2012
8324512 Multilayer printed wiring board Dec. 4, 2012
8324511 Through via nub reveal method and structure Dec. 4, 2012
8324508 Composite circuit board Dec. 4, 2012
8322032 Substrate structure and method for manufacturing the same Dec. 4, 2012
8320134 Embedded component substrate and manufacturing methods thereof Nov. 27, 2012
8319117 Printed circuit board Nov. 27, 2012
8319116 Rib reinforcement of plated thru-holes Nov. 27, 2012
8319115 Wiring board and manufacturing method thereof Nov. 27, 2012
8319114 Surface mount power module dual footprint Nov. 27, 2012
8316536 Multi-level circuit substrate fabrication method Nov. 27, 2012
8315678 Systems, methods, and apparatus for multilayer superconducting printed circuit boards Nov. 20, 2012
8315064 Apparatus for detecting pattern alignment error Nov. 20, 2012
8314344 Wiring board and manufacturing method of the same Nov. 20, 2012
8310840 Electromagnetic bandgap structure and printed circuit board Nov. 13, 2012
8304667 Multilayer printed circuit board Nov. 6, 2012
8304666 Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof Nov. 6, 2012
8304665 Package substrate having landless conductive traces Nov. 6, 2012
8304662 Buildup board, and electronic component and apparatus having the buildup board Nov. 6, 2012
8304657 Printed wiring board and method for manufacturing printed wiring board Nov. 6, 2012
8302301 Method for backdrilling via stubs of multilayer printed circuit boards with reduced backdrill diameters Nov. 6, 2012
8302297 Method of fabricating a circuit board structure Nov. 6, 2012
8300199 Flexible printed circuit board and liquid crystal display device including the same Oct. 30, 2012
8299371 Circuitized substrate with dielectric interposer assembly and method Oct. 30, 2012
8299370 Wiring board and method of manufacturing the same Oct. 30, 2012
8299369 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery Oct. 30, 2012
8299366 Wiring board and method for manufacturing the same Oct. 30, 2012
8294042 Connector and manufacturing method thereof Oct. 23, 2012

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