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Class Information
Number: 174/262
Name: Electricity: conductors and insulators > Conduits, cables or conductors > Preformed panel circuit arrangement (e.g., printed circuit) > With particular conductive connection (e.g., crossover) > Feedthrough
Description: Subject matter including a passage used to make electrical and mechanical connection between conductive patterns on plural planes of a printed circuit board.










Sub-classes under this class:

Class Number Class Name Patents
174/266 Hollow (e.g., plated cylindrical hole) 529
174/264 Voidless (e.g., solid) 545
174/263 With solder 468


Patents under this class:

Patent Number Title Of Patent Date Issued
8508950 Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noise Aug. 13, 2013
8507807 Wiring board Aug. 13, 2013
8507806 Heat resistant substrate incorporated circuit wiring board Aug. 13, 2013
8507803 Structure of connecting printed wiring boards, method of connecting printed wiring boards, and adhesive having anisotropic conductivity Aug. 13, 2013
8507802 Ultra-low current printed circuit board Aug. 13, 2013
8507801 Printed wiring board Aug. 13, 2013
8505198 Method for manufacturing an electronic assembly Aug. 13, 2013
8502086 Laminated wiring board and method for manufacturing the same Aug. 6, 2013
8502085 Multi-layer substrate with a via hole and electronic device having the same Aug. 6, 2013
8502084 Semiconductor package including power ball matrix and power ring having improved power integrity Aug. 6, 2013
8499446 Method of manufacturing multilayer printed wiring board Aug. 6, 2013
8499443 Method of manufacturing a piezoelectric vibrator Aug. 6, 2013
8498128 Printed circuit board Jul. 30, 2013
8497433 Circuit board having improved ground vias Jul. 30, 2013
8492659 Printed wiring board and manufacturing method therefor Jul. 23, 2013
8492658 Laminate capacitor stack inside a printed circuit board for electromagnetic compatibility capacitance Jul. 23, 2013
8487195 Via structure for multi-gigahertz signaling Jul. 16, 2013
8487187 Solid core glass bead seal with stiffening rib Jul. 16, 2013
8481866 Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards Jul. 9, 2013
8481865 Wiring board and method for manufacturing the same Jul. 9, 2013
8481861 Method of attaching die to circuit board with an intermediate interposer Jul. 9, 2013
8477507 Suspension board assembly sheet with circuits and method for manufacturing the same Jul. 2, 2013
8476538 Wiring substrate with customization layers Jul. 2, 2013
8476537 Multi-layer substrate Jul. 2, 2013
8476536 Wiring substrate and method for manufacturing the same Jul. 2, 2013
8476534 Multilayer printed board and method for manufacturing the same Jul. 2, 2013
8476532 Multilayer flexible printed circuit board and electronic device Jul. 2, 2013
8474135 Method for fabricating printed circuit board Jul. 2, 2013
8471156 Method for forming a via in a substrate and substrate with a via Jun. 25, 2013
8471154 Stackable variable height via package and method Jun. 25, 2013
8471153 Multilayer printed wiring board including a capacitor section Jun. 25, 2013
8466368 High-frequency device Jun. 18, 2013
8461462 Circuit substrate, laminated board and laminated sheet Jun. 11, 2013
8461459 Flex-rigid wiring board and method for manufacturing the same Jun. 11, 2013
RE44251 Circuit board for mounting electronic parts Jun. 4, 2013
8456855 Printed circuit board Jun. 4, 2013
8455770 Method of fabricating wiring board and method of fabricating semiconductor device Jun. 4, 2013
8455768 Back-end-of-line planar resistor Jun. 4, 2013
8453322 Manufacturing methods of multilayer printed circuit board having stacked via Jun. 4, 2013
8451615 Printed circuit board May. 28, 2013
8450624 Supporting substrate and method for fabricating the same May. 28, 2013
8450623 Circuit board May. 28, 2013
8446736 Circuit board and manufacturing method thereof May. 21, 2013
8445790 Coreless substrate having filled via pad and method of manufacturing the same May. 21, 2013
8440917 Method and apparatus to reduce impedance discontinuity in packages May. 14, 2013
8440916 Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method May. 14, 2013
8436254 Method of fabricating circuit board structure May. 7, 2013
8436248 Electrical component May. 7, 2013
8432706 Printed circuit board and electro application Apr. 30, 2013
8432702 Electronic apparatus and printed wiring board Apr. 30, 2013











 
 
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