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Class Information
Number: 174/262
Name: Electricity: conductors and insulators > Conduits, cables or conductors > Preformed panel circuit arrangement (e.g., printed circuit) > With particular conductive connection (e.g., crossover) > Feedthrough
Description: Subject matter including a passage used to make electrical and mechanical connection between conductive patterns on plural planes of a printed circuit board.










Sub-classes under this class:

Class Number Class Name Patents
174/266 Hollow (e.g., plated cylindrical hole) 529
174/264 Voidless (e.g., solid) 545
174/263 With solder 468


Patents under this class:
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Patent Number Title Of Patent Date Issued
7240425 Method of making an electrical connection to a conductor on an inner layer of a multi-layer printed circuit board Jul. 10, 2007
7238892 Printed circuit board including pads with vacancies Jul. 3, 2007
7236372 Surface mounted power supply circuit apparatus and method for manufacturing it Jun. 26, 2007
7235745 Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system util Jun. 26, 2007
7230835 Apparatus for reducing signal reflection in a circuit board Jun. 12, 2007
7226653 Printed circuit board and method for producing a printed circuit board Jun. 5, 2007
7223924 Via placement for layer transitions in flexible circuits with high density ball grid arrays May. 29, 2007
7221050 Substrate having a functionally gradient coefficient of thermal expansion May. 22, 2007
7217890 Method for fabricating a through-hole interconnection substrate and a through-hole interconnection substrate May. 15, 2007
7217889 System and method for reducing crosstalk between vias in a printed circuit board May. 15, 2007
7217888 Electronic parts packaging structure and method of manufacturing the same May. 15, 2007
7216425 Method of forming a non-continuous conductive layer for laminated substrates May. 15, 2007
7214886 High performance chip carrier substrate May. 8, 2007
7211738 Bonding pad structure for a display device and fabrication method thereof May. 1, 2007
7210224 Method for forming an antifuse May. 1, 2007
7205485 Printed circuit board and method for fabricating the same Apr. 17, 2007
7205483 Flexible substrate having interlaminar junctions, and process for producing the same Apr. 17, 2007
7202419 Multi-layer integrated RF/IF circuit board including a central non-conductive layer Apr. 10, 2007
7199309 Structure for repairing or modifying surface connections on circuit boards Apr. 3, 2007
7197820 Circuit board and its manufacturing method Apr. 3, 2007
7197817 Method for forming contact bumps for circuit board Apr. 3, 2007
7196274 Multi-layer integrated RF/IF circuit board Mar. 27, 2007
7190592 Integrated library core for embedded passive components and method for forming electronic device thereon Mar. 13, 2007
7189929 Flexible circuit with cover layer Mar. 13, 2007
7188413 Method of making a microelectronic package Mar. 13, 2007
7188410 Insertion of electrical component within a via of a printed circuit board Mar. 13, 2007
7186924 Dielectric structure for printed circuit board traces Mar. 6, 2007
7186923 Printed wiring boards and methods for making them Mar. 6, 2007
7186920 Flexible wiring board, an intermediate product of a flexible wiring board, and a multi-layer flexible wiring board Mar. 6, 2007
7185799 Method of creating solder bar connections on electronic packages Mar. 6, 2007
7183497 Multilayer wiring board Feb. 27, 2007
7183496 Soldered heat sink anchor and method of use Feb. 27, 2007
7183491 Printed wiring board with improved impedance matching Feb. 27, 2007
7180009 Transmission line with stripped semi-rigid cable Feb. 20, 2007
7177136 Wiring board, electro-optical device, method of manufacturing the electro-optical device, and electronic instrument Feb. 13, 2007
7176384 Electronic component Feb. 13, 2007
7176383 Printed circuit board with low cross-talk noise Feb. 13, 2007
7172805 Method for manufacturing a sequential backplane Feb. 6, 2007
7170155 MEMS RF switch module including a vertical via Jan. 30, 2007
7170012 Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus Jan. 30, 2007
7168164 Methods for forming via shielding Jan. 30, 2007
7164085 Multilayer wiring board including stacked via structure Jan. 16, 2007
7161089 Electronic component Jan. 9, 2007
7157647 Circuitized substrate with filled isolation border, method of making same, electrical assembly utilizing same, and information handling system utilizing same Jan. 2, 2007
7157646 Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same Jan. 2, 2007
7155820 Method for manufacturing printed circuit board Jan. 2, 2007
7154049 Apparatus for crosstalk compensation in a telecommunications connector Dec. 26, 2006
7154047 Via structure of packages for high frequency semiconductor devices Dec. 26, 2006
7154045 Wired circuit board Dec. 26, 2006
7152312 Method for transmitting current through a substrate Dec. 26, 2006

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