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Class Information
Number: 174/262
Name: Electricity: conductors and insulators > Conduits, cables or conductors > Preformed panel circuit arrangement (e.g., printed circuit) > With particular conductive connection (e.g., crossover) > Feedthrough
Description: Subject matter including a passage used to make electrical and mechanical connection between conductive patterns on plural planes of a printed circuit board.










Sub-classes under this class:

Class Number Class Name Patents
174/266 Hollow (e.g., plated cylindrical hole) 529
174/264 Voidless (e.g., solid) 545
174/263 With solder 468


Patents under this class:

Patent Number Title Of Patent Date Issued
8607448 Method of manufacturing a printed circuit board having micro strip line Dec. 17, 2013
8604359 Package substrate and fabrication method thereof Dec. 10, 2013
8604349 Multilayer substrate and manufacturing method thereof Dec. 10, 2013
8598468 Electromagnetic bandgap structure and printed circuit board Dec. 3, 2013
8598467 Multi-layer circuit assembly and process for preparing the same Dec. 3, 2013
8598466 Controlled-impedance electronic board vias, method of forming the same, and unitized PCB incorporating the same Dec. 3, 2013
8598465 Hermetic circuit ring for BCB WSA circuits Dec. 3, 2013
8592692 Substrate having a plural diameter via Nov. 26, 2013
8592691 Printed wiring board Nov. 26, 2013
8592690 Circuit board having circumferential shielding layer Nov. 26, 2013
8592686 Printed circuit board assembled panel, unit sheet for packaging a printed circuit board, rigid-flexible board and method for manufacturing the same Nov. 26, 2013
8586876 Laminated circuit board and board producing method Nov. 19, 2013
8586873 Test point design for a high speed bus Nov. 19, 2013
RE44586 Via structure for improving signal integrity Nov. 12, 2013
8581113 Low cost high frequency device package and methods Nov. 12, 2013
8581112 Coupler apparatus Nov. 12, 2013
8575492 Hole in pad thermal management Nov. 5, 2013
8572840 Method of attaching an electronic module power supply Nov. 5, 2013
8569632 Wiring board having through hole or non-through hole, and method for producing the same Oct. 29, 2013
8569631 Noise dampening energy efficient circuit board and method for constructing and using same Oct. 29, 2013
8563868 Electronic device for a flexible display device and method the same Oct. 22, 2013
8559185 Integrated circuit package system with stackable devices and a method of manufacture thereof Oct. 15, 2013
8555494 Method of manufacturing coreless substrate Oct. 15, 2013
8552311 Electrical feedthrough assembly Oct. 8, 2013
8552309 Wiring device and display device Oct. 8, 2013
8552308 Differential signal pair transmission structure, wiring board and electronic module Oct. 8, 2013
8549745 Fabricating process of circuit substrate Oct. 8, 2013
8549744 Printed circuit board using bump and method for manufacturing thereof Oct. 8, 2013
8547701 Electronics module and method for manufacturing the same Oct. 1, 2013
8546698 Wiring board and method for manufacturing the same Oct. 1, 2013
8545051 Lighting apparatus with heat conductive substrate Oct. 1, 2013
8541695 Wiring board and method for manufacturing the same Sep. 24, 2013
8541694 Multilayer wiring board Sep. 24, 2013
8541693 Wiring board and method for manufacturing the same Sep. 24, 2013
8541691 Heat resistant substrate incorporated circuit wiring board Sep. 24, 2013
8541687 Coreless layer buildup structure Sep. 24, 2013
8536695 Chip-last embedded interconnect structures Sep. 17, 2013
8536464 Multilayer substrate Sep. 17, 2013
8536462 Flex circuit package and method Sep. 17, 2013
8536459 Coreless layer buildup structure with LGA Sep. 17, 2013
8536457 Multilayer wiring board and method for manufacturing the same Sep. 17, 2013
8530755 Wiring board and method for manufacturing the same Sep. 10, 2013
8528203 Providing selective via plating using laser resin activation Sep. 10, 2013
8525041 Multilayer wiring board and method for manufacturing the same Sep. 3, 2013
8520399 Stretchable electronics modules and circuits Aug. 27, 2013
8514587 Conductive structure Aug. 20, 2013
8513539 Wiring board and method of manufacturing the same Aug. 20, 2013
8513533 Multilayer stacked circuit arrangement with localized separation section Aug. 20, 2013
8510941 Methods of manufacturing a printed wiring board having copper wrap plated hole Aug. 20, 2013
8510940 Method of fabricating a multi-trace via substrate Aug. 20, 2013











 
 
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