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Class Information
Number: 174/262
Name: Electricity: conductors and insulators > Conduits, cables or conductors > Preformed panel circuit arrangement (e.g., printed circuit) > With particular conductive connection (e.g., crossover) > Feedthrough
Description: Subject matter including a passage used to make electrical and mechanical connection between conductive patterns on plural planes of a printed circuit board.










Sub-classes under this class:

Class Number Class Name Patents
174/266 Hollow (e.g., plated cylindrical hole) 529
174/264 Voidless (e.g., solid) 545
174/263 With solder 468


Patents under this class:
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Patent Number Title Of Patent Date Issued
7378599 Printed circuit board, radio wave receiving converter, and antenna device May. 27, 2008
7378596 Rigid-flex wiring board May. 27, 2008
7375432 Via attached to a bond pad utilizing a tapered interconnect May. 20, 2008
7375290 Printed circuit board via with radio frequency absorber May. 20, 2008
7375289 Multi-layer printed wiring board including an alignment mark as an index for a position of via holes May. 20, 2008
7375288 Apparatuses and methods for improving ball-grid-array solder joint reliability May. 20, 2008
7374811 Probe pad structure in a ceramic space transformer May. 20, 2008
7372143 Printed circuit board including via contributing to superior characteristic impedance May. 13, 2008
7371976 Printed wiring board and method for manufacturing the same May. 13, 2008
7371975 Electronic packages and components thereof formed by substrate-imprinting May. 13, 2008
7371974 Multilayer printed wiring board May. 13, 2008
7371973 Contact node May. 13, 2008
7368667 Using rows/columns of micro-vias to create PCB routing channels in BGA interconnect grid (micro-via channels) May. 6, 2008
7368666 Surface-mounting type electronic circuit unit without detachment of solder May. 6, 2008
7365272 Circuit board with identifiable information and method for fabricating the same Apr. 29, 2008
7361849 Printed wiring board and method for manufacturing the same Apr. 22, 2008
7361848 Wiring board, magnetic disc apparatus, and manufacturing method of wiring board Apr. 22, 2008
7361847 Capacitance laminate and printed circuit board apparatus and method Apr. 22, 2008
7360308 Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers Apr. 22, 2008
7359213 Circuit board Apr. 15, 2008
7358607 Substrates and systems to minimize signal path discontinuities Apr. 15, 2008
7358445 Circuit substrate and apparatus including the circuit substrate Apr. 15, 2008
7356916 Circuit-formed substrate and method of manufacturing circuit-formed substrate Apr. 15, 2008
7353600 Circuit board fabrication method and circuit board Apr. 8, 2008
7353590 Method of forming printed circuit card Apr. 8, 2008
7350296 Method of fabricating a printed circuit board including an embedded passive component Apr. 1, 2008
7350292 Method for affecting impedance of an electrical apparatus Apr. 1, 2008
7348498 Partially voided anti-pads Mar. 25, 2008
7348496 Circuit board with organic dielectric layer Mar. 25, 2008
7345246 Wiring board and capacitor to be built into wiring board Mar. 18, 2008
7342802 Multilayer wiring board for an electronic device Mar. 11, 2008
7342470 Circuit board microwave filters Mar. 11, 2008
7342183 Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same Mar. 11, 2008
7339118 Printed wiring board and method for manufacturing the same Mar. 4, 2008
7335414 Printed circuit board and camera module Feb. 26, 2008
7332816 Method of fabricating crossing wiring pattern on a printed circuit board Feb. 19, 2008
7329817 Partially completed wiring circuit board assembly sheet and production method of wiring circuit board using said sheet Feb. 12, 2008
7329816 Electronic package with optimized lamination process Feb. 12, 2008
7327583 Routing power and ground vias in a substrate Feb. 5, 2008
7326886 Wafer support member and semiconductor manufacturing system using the same Feb. 5, 2008
7326860 Routing vias in a substrate from bypass capacitor pads Feb. 5, 2008
7326859 Printed circuit boards having pads for solder balls and methods for the implementation thereof Feb. 5, 2008
7326858 Printed circuit board with embedded capacitors and manufacturing method thereof Feb. 5, 2008
7326856 Multi-layer wiring board Feb. 5, 2008
7321099 Component mounting substrate and structure Jan. 22, 2008
7321098 Laminate ceramic circuit board and process therefor Jan. 22, 2008
7321097 Electronic component comprising an electrically conductive connection consisting of carbon nanotubes and a method for producing the same Jan. 22, 2008
7319599 Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor Jan. 15, 2008
7319197 Structure of stacked vias in multiple layer electrode device carriers Jan. 15, 2008
7317166 Wiring base board, method of producing thereof, and electronic device Jan. 8, 2008

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