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Class Information
Number: 174/262
Name: Electricity: conductors and insulators > Conduits, cables or conductors > Preformed panel circuit arrangement (e.g., printed circuit) > With particular conductive connection (e.g., crossover) > Feedthrough
Description: Subject matter including a passage used to make electrical and mechanical connection between conductive patterns on plural planes of a printed circuit board.










Sub-classes under this class:

Class Number Class Name Patents
174/266 Hollow (e.g., plated cylindrical hole) 529
174/264 Voidless (e.g., solid) 545
174/263 With solder 468


Patents under this class:
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Patent Number Title Of Patent Date Issued
7812262 Multilayer printed circuit board Oct. 12, 2010
7807932 Printed circuit board and method for manufacturing the same Oct. 5, 2010
7805834 Method for fabricating three-dimensional all organic interconnect structures Oct. 5, 2010
7804695 System for interconnecting two substrates each comprising at least one transmission line Sep. 28, 2010
7804694 Reference layer openings Sep. 28, 2010
7804190 Method and apparatus for resistive power distribution Sep. 28, 2010
7804031 Printed wiring board and manufacturing method thereof Sep. 28, 2010
7804030 Printed circuit board Sep. 28, 2010
7800917 Printed wiring board Sep. 21, 2010
7800002 Multilayer wiring board Sep. 21, 2010
7797826 Method of power-ground plane partitioning to utilize channel/trenches Sep. 21, 2010
7796845 Circuit board and method for manufacturing the same Sep. 14, 2010
7796400 Modular integrated circuit chip carrier Sep. 14, 2010
7795542 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board Sep. 14, 2010
7793414 Methods for forming connection structures for microelectronic devices Sep. 14, 2010
7791897 Multi-layer embedded capacitance and resistance substrate core Sep. 7, 2010
7790985 Device for repair of a contact pad of a printed circuit board Sep. 7, 2010
7790270 Wiring board and semiconductor device Sep. 7, 2010
7786573 Packaging chip having interconnection electrodes directly connected to plural wafers Aug. 31, 2010
7786569 Semiconductor device using wiring substrate having a wiring structure reducing wiring disconnection Aug. 31, 2010
7786389 Flexible printed wiring board Aug. 31, 2010
7782629 Embedding an electronic component between surfaces of a printed circuit board Aug. 24, 2010
7781889 Shielded via Aug. 24, 2010
7781880 Semiconductor package Aug. 24, 2010
7781681 Multilayer printed wiring board Aug. 24, 2010
7777136 Multi-layered interconnect structure using liquid crystalline polymer dielectric Aug. 17, 2010
7774932 Circuit board process Aug. 17, 2010
7767914 Multilayer printed wiring board, method for manufacturing buildup printed wiring board, and electronic apparatus Aug. 3, 2010
7767913 Electronic devices including conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, and accompanying m Aug. 3, 2010
7763809 Multilayered substrate for semiconductor device and method of manufacturing same Jul. 27, 2010
7760512 Electronic board, method of manufacturing the same, and electronic device Jul. 20, 2010
7759774 Shielded structures to protect semiconductor devices Jul. 20, 2010
7759582 Multilayer printed wiring board Jul. 20, 2010
7759581 Circuit board and method for manufacturing semiconductor modules and circuit boards Jul. 20, 2010
7757395 Method of manufacturing substrates with feedthrough electrodes for inkjet heads and method of manufacturing inkjet heads Jul. 20, 2010
7755880 Housing for electronic device and method of making the same Jul. 13, 2010
7754980 Substrate with multilayer plated through hole and method for forming the multilayer plated through hole Jul. 13, 2010
7754976 Compact circuit carrier package Jul. 13, 2010
7752752 Method of fabricating an embedded circuit pattern Jul. 13, 2010
7750249 Multilayer printed circuit board and method of manufacturing same Jul. 6, 2010
7750248 Dielectric lamination structure, manufacturing method of a dielectric lamination structure, and wiring board including a dielectric lamination structure Jul. 6, 2010
7745737 Printed circuit board having vias Jun. 29, 2010
7745736 Interconnecting substrate and semiconductor device Jun. 29, 2010
7745731 Transmission cable Jun. 29, 2010
7743494 Process of fabricating a circuit board Jun. 29, 2010
7741566 Microelectronic substrates with thermally conductive pathways and methods of making same Jun. 22, 2010
7738258 Semiconductor mounting board Jun. 15, 2010
7738249 Circuitized substrate with internal cooling structure and electrical assembly utilizing same Jun. 15, 2010
7737367 Multilayer circuit board and manufacturing method thereof Jun. 15, 2010
7737366 Multilayer printed wiring board with filled viahole structure Jun. 15, 2010

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