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Class Information
Number: 174/262
Name: Electricity: conductors and insulators > Conduits, cables or conductors > Preformed panel circuit arrangement (e.g., printed circuit) > With particular conductive connection (e.g., crossover) > Feedthrough
Description: Subject matter including a passage used to make electrical and mechanical connection between conductive patterns on plural planes of a printed circuit board.










Sub-classes under this class:

Class Number Class Name Patents
174/266 Hollow (e.g., plated cylindrical hole) 529
174/264 Voidless (e.g., solid) 545
174/263 With solder 468


Patents under this class:
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Patent Number Title Of Patent Date Issued
8063316 Split wave compensation for open stubs Nov. 22, 2011
8063315 Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate Nov. 22, 2011
8061025 Method of manufacturing heat radiation substrate having metal core Nov. 22, 2011
8059423 Enhanced localized distributive capacitance for circuit boards Nov. 15, 2011
8059420 Surface mountable device Nov. 15, 2011
8058567 High density package substrate and method for fabricating the same Nov. 15, 2011
8058566 Packaging substrate structure and manufacturing method thereof Nov. 15, 2011
8058562 Wiring substrate and method of manufacturing the same Nov. 15, 2011
8056221 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery Nov. 15, 2011
8053681 Integrated circuit package and manufacturing method thereof Nov. 8, 2011
8050049 Semiconductor device Nov. 1, 2011
8049118 Printed circuit board Nov. 1, 2011
8046912 Method of making a connection component with posts and pads Nov. 1, 2011
8044306 Wiring board and method of manufacturing the same Oct. 25, 2011
8044305 Circuit board including hybrid via structures Oct. 25, 2011
8035992 Vertical transitions, printed circuit boards therewith and semiconductor packages with the printed circuit boards and semiconductor chip Oct. 11, 2011
8035987 Electronic device having a groove partitioning functional and mounting parts from each other Oct. 11, 2011
8035983 Wiring board and method of manufacturing wiring board Oct. 11, 2011
8035978 Printed circuit board, fabrication method and apparatus Oct. 11, 2011
8035037 Core substrate and method of producing the same Oct. 11, 2011
8035035 Multi-layer wiring board and method of manufacturing the same Oct. 11, 2011
8031477 System and method for coupling a lens to a printed circuit Oct. 4, 2011
8030580 Printed wiring board and electronic apparatus including same Oct. 4, 2011
8030579 Multilayer printed wiring board Oct. 4, 2011
8030574 Flexible printed circuit Oct. 4, 2011
8028407 Method of manufacturing substrates with feedthrough electrodes for inkjet heads and method of manufacturing inkjet heads Oct. 4, 2011
8026448 Multilayer wiring board and method of manufacturing the same Sep. 27, 2011
8024856 Method for manufacturing printed circuit board Sep. 27, 2011
8022314 Printed wiring board Sep. 20, 2011
8017875 Printed wiring board Sep. 13, 2011
8014167 Liquid crystal material sealed housing Sep. 6, 2011
8013254 Printed circuit board Sep. 6, 2011
8011091 Fabrication method of a nanotube-based electric connection having air gaps Sep. 6, 2011
8008583 Heat resistant substrate incorporated circuit wiring board Aug. 30, 2011
8008582 Anisotropic electrically conductive structure Aug. 30, 2011
8004848 Stack module, card including the stack module, and system including the stack module Aug. 23, 2011
8003897 Printed wiring board Aug. 23, 2011
8003896 Multi-layer printed wiring board and manufacturing method thereof Aug. 23, 2011
8003895 Electronic parts packaging structure and method of manufacturing the same Aug. 23, 2011
7999380 Process for manufacturing substrate with bumps and substrate structure Aug. 16, 2011
7999194 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board Aug. 16, 2011
7999193 Wiring substrate and method of manufacturing the same Aug. 16, 2011
7999192 Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards Aug. 16, 2011
7994433 Printed wiring board and method for producing the same Aug. 9, 2011
7994432 Heat resistant substrate incorporated circuit wiring board Aug. 9, 2011
7994431 Substrate with built-in electronic component and method for manufacturing the same Aug. 9, 2011
7992297 Method for forming a circuit board via structure for high speed signaling Aug. 9, 2011
7989708 Multi-layer wiring board Aug. 2, 2011
7989080 Method and apparatus for providing hermetic electrical feedthrough Aug. 2, 2011
7985930 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board Jul. 26, 2011

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