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Class Information
Number: 174/262
Name: Electricity: conductors and insulators > Conduits, cables or conductors > Preformed panel circuit arrangement (e.g., printed circuit) > With particular conductive connection (e.g., crossover) > Feedthrough
Description: Subject matter including a passage used to make electrical and mechanical connection between conductive patterns on plural planes of a printed circuit board.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7626829 |
Multilayer printed wiring board and manufacturing method of the multilayer printed wiring board |
Dec. 1, 2009 |
| 7626270 |
Coreless package substrate with conductive structures |
Dec. 1, 2009 |
| 7625214 |
High density power connector with impedance control |
Dec. 1, 2009 |
| 7624501 |
Method of manufacturing multilayer wiring board |
Dec. 1, 2009 |
| 7615709 |
Circuit board through-hole impedance tuning using clearance size variations |
Nov. 10, 2009 |
| 7615708 |
Arrangement of non-signal through vias and wiring board applying the same |
Nov. 10, 2009 |
| 7615707 |
Printed circuit board and forming method thereof |
Nov. 10, 2009 |
| 7614142 |
Method for fabricating an interposer |
Nov. 10, 2009 |
| 7612298 |
Connecting unit for wick of cold cathode fluorescent lamp |
Nov. 3, 2009 |
| 7612296 |
Visually inspectable surface mount device pad |
Nov. 3, 2009 |
| 7612295 |
Printed wiring board and method for manufacturing the same |
Nov. 3, 2009 |
| RE40947 |
Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
Oct. 27, 2009 |
| 7609526 |
Circuit board |
Oct. 27, 2009 |
| 7603771 |
Method of manufacturing a combined multilayer circuit board having embedded chips |
Oct. 20, 2009 |
| 7599192 |
Layered structure with printed elements |
Oct. 6, 2009 |
| 7598609 |
Structure of polymer-matrix conductive film and method for fabricating the same |
Oct. 6, 2009 |
| 7596842 |
Method of making multilayered construction for use in resistors and capacitors |
Oct. 6, 2009 |
| 7595454 |
Method of making a circuitized substrate with enhanced circuitry and electrical assembly utilizing said substrate |
Sep. 29, 2009 |
| 7594318 |
Multilayer circuit board with embedded components and method of manufacture |
Sep. 29, 2009 |
| 7593235 |
Thermal conduit |
Sep. 22, 2009 |
| 7589398 |
Embedded metal features structure |
Sep. 15, 2009 |
| 7589283 |
Method of making circuitized substrate with improved impedance control circuitry, electrical assembly and information handling system |
Sep. 15, 2009 |
| 7586755 |
Electronic circuit component |
Sep. 8, 2009 |
| 7582833 |
Transparent substrate provided with electroconductive strips |
Sep. 1, 2009 |
| 7581312 |
Method for manufacturing multilayer flexible printed circuit board |
Sep. 1, 2009 |
| 7579553 |
Front-and-back electrically conductive substrate |
Aug. 25, 2009 |
| 7576995 |
Flex circuit apparatus and method for adding capacitance while conserving circuit board surface area |
Aug. 18, 2009 |
| 7576288 |
Circuit board, multi-layer wiring boards, method of producing circuit boards and method of producing multilayer wiring boards |
Aug. 18, 2009 |
| 7566835 |
Multilayer printed wiring board and component mounting method thereof |
Jul. 28, 2009 |
| 7565739 |
Method of making zinc-aluminum alloy connection |
Jul. 28, 2009 |
| 7565738 |
Method for manufacturing circuit device |
Jul. 28, 2009 |
| 7564694 |
Apparatus and method for impedance matching in a backplane signal channel |
Jul. 21, 2009 |
| 7563987 |
Electronic parts packaging structure and method of manufacturing the same |
Jul. 21, 2009 |
| 7557304 |
Printed circuit board having closed vias |
Jul. 7, 2009 |
| 7550321 |
Substrate having a functionally gradient coefficient of thermal expansion |
Jun. 23, 2009 |
| 7548430 |
Buildup dielectric and metallization process and semiconductor package |
Jun. 16, 2009 |
| 7546682 |
Methods for repairing circuit board having defective pre-soldering bump |
Jun. 16, 2009 |
| 7546106 |
Electronic circuit |
Jun. 9, 2009 |
| 7544899 |
Printed circuit board |
Jun. 9, 2009 |
| 7544897 |
Connecting substrate, connecting structure. connection method and electronic apparatus |
Jun. 9, 2009 |
| 7543375 |
Process for filling via hole in a substrate |
Jun. 9, 2009 |
| 7542302 |
Minimizing thickness of deadfronted display assemblies |
Jun. 2, 2009 |
| 7538413 |
Semiconductor components having through interconnects |
May. 26, 2009 |
| 7531754 |
Flexible substrate having interlaminar junctions, and process for producing the same |
May. 12, 2009 |
| 7528325 |
Key sheet module |
May. 5, 2009 |
| 7521637 |
Multilayer printed circuit board having via arrangements for reducing crosstalk among vias |
Apr. 21, 2009 |
| 7518882 |
Circuit module |
Apr. 14, 2009 |
| 7518066 |
Conformable interface device for improved electrical joint |
Apr. 14, 2009 |
| 7517730 |
Coreless substrate and manufacturing method thereof |
Apr. 14, 2009 |
| 7515430 |
Conductive hook and loop shockmount system |
Apr. 7, 2009 |
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