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Class Information
Number: 174/261
Name: Electricity: conductors and insulators > Conduits, cables or conductors > Preformed panel circuit arrangement (e.g., printed circuit) > With particular conductive connection (e.g., crossover)
Description: Subject matter including details to the electrical interconnection of two or more electrically separate parts of the panel.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7414858 |
Method of manufacturing an electronic device |
Aug. 19, 2008 |
| 7411135 |
Contour structures to highlight inspection regions |
Aug. 12, 2008 |
| 7411134 |
Hybrid ground grid for printed circuit board |
Aug. 12, 2008 |
| 7408120 |
Printed circuit board having axially parallel via holes |
Aug. 5, 2008 |
| 7408119 |
Electrical interconnection for high-frequency devices |
Aug. 5, 2008 |
| 7406344 |
Wireless network card with antenna selection option |
Jul. 29, 2008 |
| 7405946 |
Ball grid array assignment |
Jul. 29, 2008 |
| 7405364 |
Decoupled signal-power substrate architecture |
Jul. 29, 2008 |
| 7405363 |
Connecting sheet |
Jul. 29, 2008 |
| 7402757 |
Method, system, and apparatus for reducing transition capacitance |
Jul. 22, 2008 |
| 7402755 |
Circuit board with quality-indicator mark and method for indicating quality of the circuit board |
Jul. 22, 2008 |
| 7400515 |
Circuit board electrode connection structure |
Jul. 15, 2008 |
| 7400512 |
Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor |
Jul. 15, 2008 |
| 7397672 |
Flip chip mounting substrate |
Jul. 8, 2008 |
| 7397001 |
Multi-strand substrate for ball-grid array assemblies and method |
Jul. 8, 2008 |
| 7394028 |
Flexible circuit substrate for flip-chip-on-flex applications |
Jul. 1, 2008 |
| 7394026 |
Multilayer wiring board |
Jul. 1, 2008 |
| 7390973 |
Memory module and signal line arrangement method thereof |
Jun. 24, 2008 |
| 7388158 |
Concentric spacer for reducing capacitive coupling in multilayer substrate assemblies |
Jun. 17, 2008 |
| 7385829 |
Assembly retention latch having concave release structure |
Jun. 10, 2008 |
| 7380338 |
Circuit board and manufacturing method thereof |
Jun. 3, 2008 |
| 7378598 |
Printed circuit board substrate and method for constructing same |
May. 27, 2008 |
| 7375983 |
Circuit board for reducing crosstalk of signals |
May. 20, 2008 |
| 7375432 |
Via attached to a bond pad utilizing a tapered interconnect |
May. 20, 2008 |
| 7375290 |
Printed circuit board via with radio frequency absorber |
May. 20, 2008 |
| 7375288 |
Apparatuses and methods for improving ball-grid-array solder joint reliability |
May. 20, 2008 |
| 7375286 |
Printed circuit board and manufacturing method thereof |
May. 20, 2008 |
| 7371972 |
Electrical wiring structure, manufacturing method thereof, electro-optical device substrate having electrical wiring structure, electro-optical device, and manufacturing method thereof |
May. 13, 2008 |
| 7371971 |
Wired circuit board and producing method thereof |
May. 13, 2008 |
| 7368666 |
Surface-mounting type electronic circuit unit without detachment of solder |
May. 6, 2008 |
| 7368665 |
Circuit board and a power module employing the same |
May. 6, 2008 |
| 7365274 |
Electronic circuit board |
Apr. 29, 2008 |
| 7363705 |
Method of making a contact |
Apr. 29, 2008 |
| 7361846 |
High electrical performance semiconductor package |
Apr. 22, 2008 |
| 7361845 |
Wiring line for high frequency |
Apr. 22, 2008 |
| 7358607 |
Substrates and systems to minimize signal path discontinuities |
Apr. 15, 2008 |
| 7355283 |
Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging |
Apr. 8, 2008 |
| 7355128 |
Wired circuit board |
Apr. 8, 2008 |
| 7355127 |
Printed wiring board and electronic device using the same |
Apr. 8, 2008 |
| 7353595 |
Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon |
Apr. 8, 2008 |
| 7351917 |
Vents with signal image for signal return path |
Apr. 1, 2008 |
| 7351313 |
Production device and production method for conductive nano-wire |
Apr. 1, 2008 |
| 7350292 |
Method for affecting impedance of an electrical apparatus |
Apr. 1, 2008 |
| 7348497 |
Mounting structure for electronic components |
Mar. 25, 2008 |
| 7348496 |
Circuit board with organic dielectric layer |
Mar. 25, 2008 |
| 7345889 |
Method and system for reducing radiated energy emissions in computational devices |
Mar. 18, 2008 |
| 7345246 |
Wiring board and capacitor to be built into wiring board |
Mar. 18, 2008 |
| 7345244 |
Flexible substrate and a connection method thereof that can achieve reliable connection |
Mar. 18, 2008 |
| 7342802 |
Multilayer wiring board for an electronic device |
Mar. 11, 2008 |
| 7342182 |
Printed board |
Mar. 11, 2008 |
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