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Browse by Category: Main > Electrical & Energy
Class Information
Number: 174/256
Name: Electricity: conductors and insulators > Conduits, cables or conductors > Preformed panel circuit arrangement (e.g., printed circuit) > With particular material
Description: Subject matter wherein at least a part of the circuit board structure is composed of one or more specific substances.










Sub-classes under this class:

Class Number Class Name Patents
174/259 Adhesive/bonding 634
174/257 Conducting (e.g., ink) 748
174/258 Insulating 839


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Patent Number Title Of Patent Date Issued
8704106 Ferroelectric component and manufacturing the same Apr. 22, 2014
8692130 Transparent thin plate Apr. 8, 2014
8693203 Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices Apr. 8, 2014
8686295 Heat-dissipating substrate and fabricating method thereof Apr. 1, 2014
8674232 Device-embedded flexible printed circuit board and manufacturing method thereof Mar. 18, 2014
8653379 Electronic part, electronic member connection method, and circuit connection member Feb. 18, 2014
8642895 Substrate with transparent conductive layer and method for producing the same, and touch panel using the same Feb. 4, 2014
8629556 Semiconductor device Jan. 14, 2014
8624125 Metal foil laminated polyimide resin substrate Jan. 7, 2014
8609993 Power module substrate, power module, and method for manufacturing power module substrate Dec. 17, 2013
8598468 Electromagnetic bandgap structure and printed circuit board Dec. 3, 2013
8592691 Printed wiring board Nov. 26, 2013
8586493 Silicon nitride sintered body, method of producing the same, and silicon nitride circuit substrate and semiconductor module using the same Nov. 19, 2013
8582314 Interconnection structure, interposer, semiconductor package, and method of manufacturing interconnection structure Nov. 12, 2013
8581106 Submount Nov. 12, 2013
8570763 Method of forming hole for interlayer connection conductor, method of producing resin substrate and component-incorporated substrate, and resin substrate and component-incorporated substrate Oct. 29, 2013
8569631 Noise dampening energy efficient circuit board and method for constructing and using same Oct. 29, 2013
8563870 Transparent conductive film Oct. 22, 2013
8558117 Electroconductive inks made with metallic nanoparticles Oct. 15, 2013
8558116 Multilayer rigid flexible printed circuit board and method for manufacturing the same Oct. 15, 2013
8546699 Glass-ceramic substrate Oct. 1, 2013
8547701 Electronics module and method for manufacturing the same Oct. 1, 2013
8541688 Circuit connection material, circuit member connecting structure and method of connecting circuit member Sep. 24, 2013
8530749 Copper foil attached to the carrier foil, a method for preparing the same and printed circuit board using the same Sep. 10, 2013
8519524 Chip stacking structure and fabricating method of the chip stacking structure Aug. 27, 2013
8519273 Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom Aug. 27, 2013
8513534 Semiconductor device and bonding material Aug. 20, 2013
8513878 Spontaneous emission display, spontaneous emission display manufacturing method, transparent conductive film, electroluminescence device, solar cell transparent electrode, and electronic paper Aug. 20, 2013
8507802 Ultra-low current printed circuit board Aug. 13, 2013
8507804 Electrical connector with solder columns Aug. 13, 2013
8507805 Wiring board for semiconductor devices, semiconductor device, electronic device, and motherboard Aug. 13, 2013
8507801 Printed wiring board Aug. 13, 2013
8502082 Circuitized substrate utilizing three smooth-sided conductive layers as part thereof and electrical assemblies and information handling systems utilizing same Aug. 6, 2013
8497434 Printed circuit board and manufacturing method thereof Jul. 30, 2013
8493746 Additives for grain fragmentation in Pb-free Sn-based solder Jul. 23, 2013
8484840 Leading wiring method, leading wiring program, and leading wiring apparatus Jul. 16, 2013
8487189 Wired circuit board assembly sheet Jul. 16, 2013
8487191 Flexible laminate and flexible electronic circuit board formed by using the same Jul. 16, 2013
8481861 Method of attaching die to circuit board with an intermediate interposer Jul. 9, 2013
8482931 Package structure Jul. 9, 2013
8476534 Multilayer printed board and method for manufacturing the same Jul. 2, 2013
8472207 Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods Jun. 25, 2013
8465670 Liquid crystal polyester composition and electronic circuit board using the same Jun. 18, 2013
8450618 Printed circuit board with reinforced thermoplastic resin layer May. 28, 2013
8450621 Wiring board and process for fabricating the same May. 28, 2013
8446736 Circuit board and manufacturing method thereof May. 21, 2013
8445789 Cable having ESD dissipative adhesive electrically connecting leads thereof May. 21, 2013
8436254 Method of fabricating circuit board structure May. 7, 2013
8436255 Fan-out wafer level package with polymeric layer for high reliability May. 7, 2013
8431826 Capacitive power and ground plane structure utilizing fractal elements for the reduction of radiated emissions Apr. 30, 2013

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