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Class Information
Number: 174/255
Name: Electricity: conductors and insulators > Conduits, cables or conductors > Preformed panel circuit arrangement (e.g., printed circuit) > With particular substrate or support structure
Description: Subject matter including a material means distinguished by significant construction or configuration which provides a supporting surface for other materials, especially materials used as printed-circuits patterns.


Patents under this class:

Patent Number Title Of Patent Date Issued
7630207 Wiring board, method of manufacturing wiring board, and liquid ejection head Dec. 8, 2009
7629559 Method of improving electrical connections in circuitized substrates Dec. 8, 2009
7626829 Multilayer printed wiring board and manufacturing method of the multilayer printed wiring board Dec. 1, 2009
7622184 Multilevel interconnection board and method of fabricating the same Nov. 24, 2009
RE40947 Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole Oct. 27, 2009
7608789 Component arrangement provided with a carrier substrate Oct. 27, 2009
7599193 Tape circuit substrate with reduced size of base film Oct. 6, 2009
7598609 Structure of polymer-matrix conductive film and method for fabricating the same Oct. 6, 2009
7595453 Surface mount package Sep. 29, 2009
7592551 Wired circuit board assembly sheet Sep. 22, 2009
7589398 Embedded metal features structure Sep. 15, 2009
7589282 Wiring board and a semiconductor device using the same Sep. 15, 2009
7586046 Wired circuit board Sep. 8, 2009
7582833 Transparent substrate provided with electroconductive strips Sep. 1, 2009
7576288 Circuit board, multi-layer wiring boards, method of producing circuit boards and method of producing multilayer wiring boards Aug. 18, 2009
7576287 Lot traceable printed circuit board Aug. 18, 2009
7572500 Method of manufacturing circuit-forming board and material of circuit-forming board Aug. 11, 2009
7571540 Production method of suspension board with circuit Aug. 11, 2009
7562446 Method for manufacturing substrate with cavity Jul. 21, 2009
7560650 Substrate structure and method for manufacturing the same Jul. 14, 2009
7557303 Electronic component connection support structures including air as a dielectric Jul. 7, 2009
7557302 Printed circuit board with electrostatic discharge damage prevention Jul. 7, 2009
7551455 Package structure Jun. 23, 2009
7551452 Printed circuit board Jun. 23, 2009
7550321 Substrate having a functionally gradient coefficient of thermal expansion Jun. 23, 2009
7548432 Embedded capacitor structure Jun. 16, 2009
7542302 Minimizing thickness of deadfronted display assemblies Jun. 2, 2009
7540082 Method for manufacturing printed wiring board Jun. 2, 2009
7538413 Semiconductor components having through interconnects May. 26, 2009
7538278 Printed circuit board for preventing increase of thermal expansion May. 26, 2009
7535727 Light source module May. 19, 2009
7535095 Printed wiring board and method for producing the same May. 19, 2009
7534967 Conductor structures including penetrable materials May. 19, 2009
7531754 Flexible substrate having interlaminar junctions, and process for producing the same May. 12, 2009
7531752 Flexible substrate and electronic device May. 12, 2009
7531751 Method and system for an improved package substrate for use with a semiconductor package May. 12, 2009
7529101 Assembly retention latch having concave release structure May. 5, 2009
7528325 Key sheet module May. 5, 2009
7523545 Methods of manufacturing printed circuit boards with stacked micro vias Apr. 28, 2009
7518879 Universal Serial Bus (USB) memory plug Apr. 14, 2009
7515435 Multi-functional composite substrate structure Apr. 7, 2009
7514781 Circuit substrate and manufacturing method thereof Apr. 7, 2009
7511962 Flexible printed circuit board Mar. 31, 2009
7511232 Substrate for mounting electronic part and electronic part Mar. 31, 2009
7511228 Printed circuit board Mar. 31, 2009
7510759 Electronic part and manufacturing method thereof Mar. 31, 2009
7508681 Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristics Mar. 24, 2009
7505285 Main board for backplane buses Mar. 17, 2009
7505281 Multilayer wiring board for an electronic device Mar. 17, 2009
7504843 Probe unit substrate Mar. 17, 2009



 
 
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