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Browse by Category: Main > Electrical & Energy
Class Information
Number: 174/252
Name: Electricity: conductors and insulators > Conduits, cables or conductors > Preformed panel circuit arrangement (e.g., printed circuit) > With cooling means
Description: Subject matter including means to remove or prevent heat accumulation in the structure.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13

Patent Number Title Of Patent Date Issued
8704100 Heat dissipating substrate and method of manufacturing the same Apr. 22, 2014
8704101 Package carrier and manufacturing method thereof Apr. 22, 2014
8692132 Multilayered printed circuit board and method for manufacturing the same Apr. 8, 2014
8693210 Product packaging Apr. 8, 2014
8683684 Method of manufacturing component embedded printed circuit board Apr. 1, 2014
8686295 Heat-dissipating substrate and fabricating method thereof Apr. 1, 2014
8686296 Electronic device having heat dissipation device Apr. 1, 2014
8668355 Light emitting module having heat conductive substrate Mar. 11, 2014
8637777 Power module substrate having heatsink, method for manufacturing the same, power module having heatsink, and power module substrate Jan. 28, 2014
8633393 Printed circuit board, manufacturing method thereof and radio-frequency device Jan. 21, 2014
8630092 Cooling box for components or circuits Jan. 14, 2014
8624123 Printed circuit board Jan. 7, 2014
8624129 Method of attaching a high power surface mount transistor to a printed circuit board Jan. 7, 2014
8625298 Protection for circuit boards Jan. 7, 2014
8624122 Circuit board structure having measures against heat Jan. 7, 2014
8619428 Electronic package structure Dec. 31, 2013
8611089 Heat pipe and circuit board with a heat pipe function Dec. 17, 2013
8598458 Electronic device and method of manufacturing the same Dec. 3, 2013
8598463 Circuit board and manufacturing method thereof Dec. 3, 2013
8599560 Heat dissipating system Dec. 3, 2013
8590147 Method for fabricating circuit board structure with concave conductive cylinders Nov. 26, 2013
8587947 Heat spreader for IC package, and IC package clamper having the heat spreader Nov. 19, 2013
8586493 Silicon nitride sintered body, method of producing the same, and silicon nitride circuit substrate and semiconductor module using the same Nov. 19, 2013
8586872 Metal core substrate Nov. 19, 2013
8575492 Hole in pad thermal management Nov. 5, 2013
8563869 Circuit board and semiconductor module using this, production method for circuit board Oct. 22, 2013
8549739 Method of making circuit board module Oct. 8, 2013
8553417 Heat-radiating substrate and method of manufacturing the same Oct. 8, 2013
8547703 Card-type peripheral apparatus Oct. 1, 2013
8545051 Lighting apparatus with heat conductive substrate Oct. 1, 2013
8540497 Fan self-cooling structure with heat pipe Sep. 24, 2013
8537547 Repair apparatus and method for circuit board assembly Sep. 17, 2013
8537550 Wiring board and power conversion device Sep. 17, 2013
8537553 Devices having anisotropic conductivity heatsinks, and methods of making thereof Sep. 17, 2013
8531841 IC thermal management system Sep. 10, 2013
8526186 Electronic assembly including die on substrate with heat spreader having an open window on the die Sep. 3, 2013
8520394 Control device Aug. 27, 2013
8520392 Electronic control unit and method for producing component of same Aug. 27, 2013
8513530 Package carrier and manufacturing method thereof Aug. 20, 2013
8513534 Semiconductor device and bonding material Aug. 20, 2013
8507801 Printed wiring board Aug. 13, 2013
8507802 Ultra-low current printed circuit board Aug. 13, 2013
8488324 Electric control unit having a housing part and a cooling part Jul. 16, 2013
8482929 Systems for circuit board heat transfer and method of assembling same Jul. 9, 2013
8472195 Electronic device Jun. 25, 2013
8465666 Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive compositi Jun. 18, 2013
8461614 Packaging substrate device, method for making the packaging substrate device, and packaged light emitting device Jun. 11, 2013
8462510 Board-level package with tuned mass damping structure Jun. 11, 2013
8445789 Cable having ESD dissipative adhesive electrically connecting leads thereof May. 21, 2013
8436248 Electrical component May. 7, 2013

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