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Class Information
Number: 174/250
Name: Electricity: conductors and insulators > Conduits, cables or conductors > Preformed panel circuit arrangement (e.g., printed circuit)
Description: Subject matter wherein a cable or conductor is formed on or attached to a panel or sheet-like insulating body so as to form a unitary structure.










Sub-classes under this class:

Class Number Class Name Patents
174/254 Convertible shape (e.g., flexible) or circuit (e.g., breadboard) 1,170
174/253 Micropanel 81
174/252 With cooling means 605
174/260 With electrical device 2,494
174/251 With encapsulated wire 173
174/261 With particular conductive connection (e.g., crossover) 2,078
174/256 With particular material 773
174/255 With particular substrate or support structure 2,076
174/268 With single conductive plane (e.g., tape, cable) 152


Patents under this class:

Patent Number Title Of Patent Date Issued
5319158 Coil integrated semi-conductor device and method of making the same Jun. 7, 1994
5315069 Electromagnetic radiation reduction technique using grounded conductive traces circumscribing internal planes of printed circuit boards May. 24, 1994
5315070 Printed wiring board to which solder has been applied May. 24, 1994
5315072 Printed wiring board having blind holes May. 24, 1994
5313015 Ground plane shield May. 17, 1994
5310965 Multi-level wiring structure having an organic interlayer insulating film May. 10, 1994
5308926 Compact isolating backplane for routing electronic signals May. 3, 1994
5308928 Soldering interconnects for selective line coupling May. 3, 1994
5309327 Apparatus and method for manufacturing printed circuit boards May. 3, 1994
5306872 Structures for electrically conductive decals filled with organic insulator material Apr. 26, 1994
5306873 Load cell with strain gauges having low temperature dependent coefficient of resistance Apr. 26, 1994
5301420 Method for manufacturing a light weight circuit module Apr. 12, 1994
5300735 Interconnected multilayer boards and fabrication processes thereof Apr. 5, 1994
5298684 Circuit board having a lateral conductive pattern and shielded regions as well as a method of manufacturing such a board Mar. 29, 1994
5298685 Interconnection method and structure for organic circuit boards Mar. 29, 1994
5298687 High-density multilayer interconnection system on a ceramic substrate for high current applications and method of manufacture Mar. 29, 1994
5299093 Electrical packaging structure and liquid crystal display device having the same Mar. 29, 1994
5296649 Solder-coated printed circuit board and method of manufacturing the same Mar. 22, 1994
5296651 Flexible circuit with ground plane Mar. 22, 1994
5296653 Device having a multi-layered conductor structure Mar. 22, 1994
5294754 Direct write EC single metal layer Mar. 15, 1994
5293004 Printed circuit board having an electromagnetic shielding layer Mar. 8, 1994
5293502 Integrated circuit package Mar. 8, 1994
5293503 Semiconductor device having multilayer metal interconnection Mar. 8, 1994
5293509 Sintered body of aluminum nitride Mar. 8, 1994
5290624 Heat-conductive adhesive films, laminates with heat-conductive adhesive layers and the use thereof Mar. 1, 1994
5290970 Multilayer printed circuit board rework method and rework pin Mar. 1, 1994
5290971 Printed circuit board provided with a higher density of terminals for hybrid integrated circuit and method of fabricating the same Mar. 1, 1994
5288542 Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof Feb. 22, 1994
5288948 Structure of a semiconductor chip having a conductive layer Feb. 22, 1994
5288949 Connection system for integrated circuits which reduces cross-talk Feb. 22, 1994
5286713 Method for manufacturing an oxide superconducting circuit board by printing Feb. 15, 1994
5286926 Integrated circuit package and process for producing same Feb. 15, 1994
5286927 Method of manufacturing circuit board and circuit board itself manufactured by said method Feb. 15, 1994
5285057 IC card device Feb. 8, 1994
5285353 Support bar for circuit boards Feb. 8, 1994
5281466 Low volume fraction ceramic filled fluoropolymeric composite material Jan. 25, 1994
5281769 Dewall plating technique Jan. 25, 1994
5276590 Flex circuit electronic cards Jan. 4, 1994
5270492 Structure of lead terminal of electronic device Dec. 14, 1993
5268535 Printed wiring board Dec. 7, 1993
5266380 Method and apparatus for visual verification of proper assembly and alignment of layers in a multi-layer printed circuit board Nov. 30, 1993
5266745 Thick film hybrid arrangement with outer contacts Nov. 30, 1993
5260517 Interconnect lead with stress joint Nov. 9, 1993
5258889 Apparatus for compliantly retaining a circuit board in a housing Nov. 2, 1993
5250347 Mechanically enhanced, high impact strength triazine resins, and method of preparing same Oct. 5, 1993
5250757 Printed wiring board having a connecting terminal Oct. 5, 1993
5248852 Resin circuit substrate and manufacturing method therefor Sep. 28, 1993
5243140 Direct distribution repair and engineering change system Sep. 7, 1993
5241456 Compact high density interconnect structure Aug. 31, 1993











 
 
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